Semiconductor module cooler

Patent metadata

Field	Value
Publication number	US-9502329-B2
Application number	US-201214110931-A
Country	US
Kind code	B2
Filing date	May 14, 2012
Priority date	May 16, 2011
Publication date	Nov 22, 2016
Grant date	Nov 22, 2016

Abstract

A semiconductor module cooler supplies a cooling medium to a cooling medium jacket from outside to cool a plurality of semiconductor elements thermally connected to the cooling medium jacket through a heat sink. The cooling medium jacket has a cooling fin cooling room including an opening for inserting cooling fins, and cooling the cooling fins; a cooling medium introduction port to introduce the cooling medium; a cooling medium diffusion room to diffuse and supply the cooling medium to the cooling fin cooling room; a cooling medium diffusion wall provided in the cooling medium diffusion room in which the cooling medium diffused by the cooling medium diffusion room flows over to be introduced to the cooling fin cooling room side; a cooling medium discharge port discharging the cooling medium to the outside; and a cooling medium convergence room provided between the cooling fin cooling room and the cooling medium discharge port.

First claim

What is claimed is:

1. A semiconductor module cooler comprising:
at least one semiconductor element;
a heat sink supporting the at least one semiconductor element on one surface thereof and including cooling fins formed on another surface opposite to the one side thereof; and
a cooling medium jacket thermally connected to the at least one semiconductor element through the heat sink, wherein the cooling fins are cooled with a cooling medium supplied from an outside to cool the at least one semiconductor element,
the cooling medium jacket including,
a cooling fin cooling room including an opening in which the cooling fins are inserted;
a cooling medium introduction port to introduce the cooling medium;
a cooling medium diffusion room arranged between and communicated with the cooling medium introduction port and the cooling fin cooling room to diffuse the cooling medium introduced from the cooling medium introduction port and to supply the cooling medium to the cooling fin cooling room;
a cooling medium diffusion wall projecting toward the heat sink at one side of the cooling medium diffusion room communicating with the cooling fin cooling room such that the cooling medium diffused in the cooling medium diffusion room flows over the cooling medium diffusion wall to be introduced to the cooling fin cooling room, the cooling medium diffusion wall having an upper end to be positioned higher than bottom portions of the cooling fins to form a space between the upper end and the another surface of the heat sink;
a cooling medium discharge port to discharge the cooling medium to the outside; and
a cooling medium convergence room arranged between and communicated with the cooling fin cooling room and the cooling medium discharge port to converge the cooling medium toward the cooling medium discharge port,

wherein a surface of the cooling medium diffusion wall facing the cooling medium introduction port is an inclined plane which is inclined forward from a lower part to an upper part thereof.

2. The semiconductor module cooler according to claim 1 , wherein the cooling medium diffusion room has a shape widening from the cooling medium introduction port toward the cooling medium diffusion wall.

3. The semiconductor module cooler according to claim 1 , wherein the cooling fins are arranged in parallel in a width direction perpendicular to a flowing direction of the cooling medium from the cooling medium introduction port to the cooling medium discharge port and continuously extend in the flowing direction of the cooling medium in the cooling fin cooling room,
the cooling medium diffusion room has a shape widening in the width direction perpendicular to the flowing direction of the cooling medium from the cooling medium introduction port toward the cooling medium diffusion wall to diffuse the cooling medium uniformly through the cooling medium diffusion wall, and
the cooling medium convergence room has a shape narrowing in the width direction perpendicular to the flowing direction of the cooling medium from the cooling fin cooling room toward the cooling medium discharge port to converge the cooling medium smoothly.

4. The semiconductor module cooler according to claim 1 , wherein the at least one semiconductor element is arranged on the heat sink in a direction intersecting a flowing direction of the cooling medium from the cooling medium introduction port to the cooling medium discharge port.

5. The semiconductor module cooler according to claim 1 , wherein the cooling fins are any one of blade fins formed of a plurality of flat plates, a plurality of circular pins, each having a circular shape in a cross-sectional view, or a plurality of angular pins, each having a polygonal shape in a cross-sectional view.

6. The semiconductor module cooler according to claim 5 , wherein when the cooling fins are formed of the plurality of circular pins or the plurality of angular pins, a pin array is arranged in a zigzag array.

7. The semiconductor module cooler according to claim 1 , further comprising a sealing member provided between the heat sink and the cooling medium jacket and surrounding at least the opening.

8. The semiconductor module cooler according to claim 1 , wherein the cooling medium diffusion wall extends between two side surfaces of the cooling fin cooling room in a width direction perpendicular to a flowing direction of the cooling medium from the cooling medium introduction port to the cooling medium discharge port, and projects vertically from a bottom surface of the cooling medium diffusion room, and
the bottom portions of the cooling fins are arranged apart from a bottom surface of the cooling fin cooling room to form a space therebetween.

9. The semiconductor module cooler according to claim 3 , wherein the cooling medium diffusion wall is arranged at an upstream in the flowing direction of the cooling medium relative to the cooling fins such that the cooling medium flowing from the cooling medium introduction port is blocked by the cooling medium diffusion wall and diffused in the width direction perpendicular to the flowing direction of the cooling medium to flow to upper parts of the cooling fins.

10. A semiconductor module cooler comprising:
at least one semiconductor element;
a heat sink supporting the at least one semiconductor element on one surface thereof and including cooling fins formed on another surface opposite to the one side thereof; and
a cooling medium jacket thermally connected to the at least one semiconductor element through the heat sink, wherein the cooling fins are cooled with a cooling medium supplied from an outside to cool the at least one semiconductor element,
the cooling medium jacket including,
a cooling fin cooling room including an opening in which the cooling fins are inserted;
a cooling medium introduction port to introduce the cooling medium;
a cooling medium diffusion room arranged between and communicated with the cooling medium introduction port and the cooling fin cooling room to diffuse the cooling medium introduced from the cooling medium introduction port and to supply the cooling medium to the cooling fin cooling room;
a cooling medium diffusion wall projecting toward the heat sink at one side of the cooling medium diffusion room communicating with the cooling fin cooling room such that the cooling medium diffused in the cooling medium diffusion room flows over the cooling medium diffusion wall to be introduced to the cooling fin cooling room, the cooling medium diffusion wall having an upper end to be positioned higher than bottom portions of the cooling fins to form a space between the upper end and the another surface of the heat sink;
a cooling medium discharge port to discharge the cooling medium to the outside; and
a cooling medium convergence room arranged between and communicated with the cooling fin cooling room and the cooling medium discharge port to converge the cooling medium toward the cooling medium discharge port,

wherein a position of the upper end of the cooling medium diffusion wall has a height equal to or greater than that of a position of an upper end of the cooling medium introduction port, and
a surface of the cooling medium diffusion wall facing the cooling medium introduction port is an inclined plane which is inclined forward from a lower part to an upper part thereof.

Assignees

• Nagaune Fumio
• Fuji Electric Co Ltd

Inventors

• Nagaune Fumio

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W40/47 Primary

  by flowing liquids, e.g. forced water cooling · CPC title

• H01L24/32

  Electricity · mapped topic

• H01L2924/13055

  Electricity · mapped topic