Apparatus and electronic devices including transistors comprising two-dimensional materials
US-2024339543-A1 · Oct 10, 2024 · US
US9502316B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9502316-B2 |
| Application number | US-201314398474-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 24, 2013 |
| Priority date | May 3, 2012 |
| Publication date | Nov 22, 2016 |
| Grant date | Nov 22, 2016 |
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A method for producing a plurality of optoelectronic components may include measuring at least one measurement parameter for a first optoelectronic component and a second optoelectronic component, and processing the first optoelectronic component and the second optoelectronic component taking account of the measured measurement parameter value of the first optoelectronic component and the measured measurement parameter value of the second optoelectronic component, such that the optoelectronic properties of the first optoelectronic component and the optoelectronic properties of the second optoelectronic component are changed in a different way toward at least one common predefined optoelectronic target property. The processing of at least one value of a measurement parameter of the optoelectronic properties of the first optoelectronic component or of the optoelectronic properties of the second optoelectronic component toward the optoelectronic target property is formed by means of a compensation element. The compensation element is formed as a film.
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The invention claimed is: 1. A method for producing a plurality of optoelectronic components, the method comprising: measuring at least one measurement parameter for a first optoelectronic component and a second optoelectronic component; and processing the first optoelectronic component and the second optoelectronic component taking account of the measured measurement parameter value of the first optoelectronic component and the measured measurement parameter value of the second optoelectronic component, such that the optoelectronic properties of the first optoelectronic component and the optoelectronic properties of the second optoelectronic component are changed in a different way toward at least one common predefined optoelectronic target property; wherein the processing of at least one value of a measurement parameter of the optoelectronic properties of the first optoelectronic component or of the optoelectronic properties of the second optoelectronic component toward the optoelectronic target property is formed by means of a compensation element; and wherein the compensation element is formed as a film. 2. The method as claimed in claim 1 , wherein the measurable parameter comprises a measurement parameter with regard to emitted or absorbed electromagnetic radiation from the group of the measurement parameters: the brightness or the intensity; the wavelength spectrum or the color; the viewing angle dependence; the absorption; or the efficiency. 3. The method as claimed in claim 1 , wherein the optoelectronic properties of the first optoelectronic component and the optoelectronic properties of the second optoelectronic component deviate from the optoelectronic target property in terms of the same optoelectronic property. 4. The method as claimed in claim 1 , wherein measuring the measurement parameter comprises measuring the optoelectronic properties after or during the manufacture of the optoelectronic component. 5. The method as claimed in claim 1 , wherein the film comprises at least one coating, wherein the coating is a compensating coating and the film is a carrier of the coating. 6. The method as claimed in claim 1 , wherein the optoelectronic properties of the first optoelectronic component or of the second optoelectronic component are processed in combination from two or more compensation elements toward the target property. 7. The method as claimed in claim 1 , wherein further optical layers are formed between the optoelectronic component and the compensation element. 8. The method as claimed in claim 7 , wherein the further layers are formed in such a way that the further layers have an adhesion-reinforcing, diffusion-inhibiting and/or optically coupling effect. 9. The method as claimed in claim 5 , wherein the two or more compensation elements comprise layers having an identical or different layer cross section, wherein a layer cross section comprises the following properties: the layer sequence; the number of layers; the layer thickness; the substance composition of the layers. 10. The method as claimed in claim 5 , wherein at least one different compensation element is applied to the first optoelectronic component in comparison with the second optoelectronic component. 11. The method as claimed in claim 1 , wherein the optoelectronic component is formed as a radiation-emitting component. 12. The method as claimed in claim 1 , wherein the optoelectronic component is formed as a radiation-detecting component. 13. A device for producing a plurality of optoelectronic components, the device comprising: an input unit, designed for inputting at least one common optoelectronic target property of the plurality of optoelectronic components; a measuring unit, designed for measuring at least one optoelectronic property of the optoelectronic components and for communicating the same to a selection unit; a compensation unit, designed for providing at least two compensation elements having different optoelectronic effects with regard to the common target property for the optoelectronic components for selection by means of a selection unit; the selection unit, designed for component-individually selecting at least one compensation element using the measured at least one optoelectronic properties of the optoelectronic components and the optoelectronic effect for the optoelectronic components in such a way that after the use of the at least one selected compensation element and/or of the at least one selected compensation method, the optoelectronic properties of the optoelectronic components are changed toward the target property. 14. The device as claimed in claim 13 , wherein the input unit is designed for inputting the manufacturing status of the optoelectronic components. 15. The method as claimed in claim 11 , wherein the optoelectronic component is formed as an organic light-emitting diode.
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