Metal thin film resistor and process

US9502284B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9502284-B2
Application numberUS-201414548812-A
CountryUS
Kind codeB2
Filing dateNov 20, 2014
Priority dateDec 31, 2013
Publication dateNov 22, 2016
Grant dateNov 22, 2016

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  2. Abstract

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  5. First independent claim

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Abstract

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An integrated circuit with a metal thin film resistor with an overlying etch stop layer. A process for forming a metal thin film resistor in an integrated circuit with the addition of one lithography step.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for forming an integrated circuit comprising: depositing a first etch stop layer over a lower interconnect geometry; depositing a first dielectric layer on the first etch stop layer; depositing metal thin film resistor material on the first dielectric layer; depositing a second etch stop layer on the metal thin film resistor material; forming a resistor photoresist pattern with a resistor photoresist geometry on the second etch stop layer;…

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What does patent US9502284B2 cover?
An integrated circuit with a metal thin film resistor with an overlying etch stop layer. A process for forming a metal thin film resistor in an integrated circuit with the addition of one lithography step.
Who is the assignee on this patent?
Texas Instruments Inc
What technology area does this patent fall under?
Primary CPC classification H10D1/474. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 22 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).