Heat treatment apparatus and heat treatment method for measuring particle concentration

Patent metadata

Field	Value
Publication number	US-9502273-B2
Application number	US-201313895540-A
Country	US
Kind code	B2
Filing date	May 16, 2013
Priority date	May 23, 2012
Publication date	Nov 22, 2016
Grant date	Nov 22, 2016

Abstract

A heat treatment apparatus includes a chamber for receiving a substrate therein, and a measurement part for measuring an air particle concentration in a processing space provided in the chamber. An air particle concentration in the processing space provided in the chamber is measured by the measurement part. The air particle concentration is correlated with the number of particles attached to a substrate received in the chamber. Accordingly, by conducting a particle test after the air particle concentration in the processing space is lowered to an air particle concentration corresponding to the number of particles existing on the substrate which can pass the particle test, the number of times the particle test should be conducted after maintenance of the heat treatment apparatus can be reduced.

First claim

What is claimed is:

1. A heat treatment apparatus for heating a substrate, comprising:
a process chamber for receiving a substrate therein; and
a measurement part for introducing a gas in a processing space provided in said process chamber and measuring an air particle concentration in the gas;
a first exhaust part for exhausting said measurement part; and
a second exhaust part for exhausting said process chamber via a path different from said measurement part and said first exhaust part;
wherein, the inside diameter of said first exhaust part is smaller than the inside diameter of said second exhaust part.

2. The heat treatment apparatus according to claim 1 , further comprising:
a storage part for storing correlation information that indicates the correlation between an air particle concentration in said processing space and a number of particles attached to a substrate received in said process chamber; and
a calculation part for calculating, based on a result of the measurement by said measurement part and said correlation information, a number of particles that will be attached to a substrate intended to be received in said process chamber.

3. The heat treatment apparatus according to claim 1 , further comprising a flash lamp for heating a substrate received in said process chamber by emitting a light flash to said substrate.

4. The heat treatment apparatus according to claim 1 , further comprising a removal part for removing air particles existing in said processing space provided in said process chamber.

Assignees

• Dainippon Screen Mfg
• Screen Holdings Co Ltd

Inventors

• Nishihara Hideo

Classifications

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P72/0436 Primary

  mainly by radiation · CPC title

• G01N15/06

  Investigating concentration of particle suspensions (by weighing G01N5/00; investigating sedimentation of particle suspensions G01N15/04; investigating individual particles G01N15/10) · CPC title

• B08B7/0071

  by heating (B08B7/0035 takes precedence) · CPC title

• B08B9/093

  by the force of jets or sprays ({B08B9/0813} , B08B9/20 take precedence) · CPC title