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US-12131987-B2 · Oct 29, 2024 · US
Warpage control for flexible substrates
US9502271B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9502271-B2 |
| Application number | US-201414310377-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 20, 2014 |
| Priority date | Nov 15, 2012 |
| Publication date | Nov 22, 2016 |
| Grant date | Nov 22, 2016 |
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Abstract
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Flexible structures and method of providing a flexible structure are disclosed. In some embodiments, a method of providing a flexible structure includes: providing a flex substrate having a device bonded to a first side of the flex substrate; and attaching a rigid layer to a second side of the flex substrate opposite the first side using an adhesive layer.
First claim
Opening claim text (preview).
What is claimed is: 1. A method, comprising: providing a flex substrate having a device bonded to a first side of a bowed region of the flex substrate, the bowed region and the device having substantially similar curvatures; and after the providing, attaching a rigid layer to a second side of the bowed region opposite the first side using a non-conductive adhesive layer, the rigid layer substantially eliminating the curvatures of the bowed region and the device; and attaching…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9502271B2 cover?
- Flexible structures and method of providing a flexible structure are disclosed. In some embodiments, a method of providing a flexible structure includes: providing a flex substrate having a device bonded to a first side of the flex substrate; and attaching a rigid layer to a second side of the flex substrate opposite the first side using an adhesive layer.
- Who is the assignee on this patent?
- Taiwan Semiconductor Mfg Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W70/688. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 22 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).