Shield part, method of fabricating the same, and contactless power transmission device having the shield part

Patent metadata

Field	Value
Publication number	US-9502173-B2
Application number	US-201314033410-A
Country	US
Kind code	B2
Filing date	Sep 20, 2013
Priority date	Jun 28, 2013
Publication date	Nov 22, 2016
Grant date	Nov 22, 2016

Abstract

There is provided a shield part including: a magnetic laminate formed by laminating a plurality of magnetic layers and having a first surface and a second surface; a coil pattern formed on the first surface; and a first lead part formed at an end portion of a central portion of the coil pattern and a second lead part formed outside of the coil pattern, wherein a portion of the second surface is removed to form a recess, the first lead part is electrically connected to the second lead part by a conductive material disposed in the recess and a first via formed in the magnetic laminate in a lamination direction, and the second lead part is electrically connected to the first lead part by the conductive material disposed in the recess and a second via formed in the magnetic laminate in the lamination direction.

First claim

What is claimed is:

1. A shield part comprising:
a magnetic laminate formed by laminating a plurality of magnetic layers and having a first surface and a second surface;
a coil pattern formed on the first surface; and
a first lead part formed at an end portion of a central portion of the coil pattern and a second lead part formed outside of the coil pattern,
wherein a portion of the second surface is removed to form a recess, the first lead part is electrically connected to the second lead part by a conductive material disposed in the recess and a first via formed in the magnetic laminate in a lamination direction, and the second lead part is electrically connected to the first lead part by the conductive material disposed in the recess and a second via formed in the magnetic laminate in the lamination direction.

2. The shield part of claim 1 , wherein the second lead part is connected to an external power supply.

3. The shield part of claim 1 , wherein the conductive material further contains a magnetic material.

4. The shield part of claim 1 , further comprising a magnetic layer formed on a lower portion of the magnetic laminate.

5. The shield part of claim 1 , further comprising:
a conductive adhesive layer interposed between the first lead part and the first via; and
a conductive adhesive layer interposed between the second lead part and the second via.

6. A contactless power transmission device comprising:
a receiver; and
a transmitter,
wherein the transmitter includes a transmission shield part and an external power supply, and
the receiver includes an electronic device, a power storage part, and reception shield part,
the transmission or reception shield part including a magnetic laminate formed by laminating a plurality of magnetic layers and having a first surface and a second surface; a coil pattern formed on the first surface; and a first lead part formed at an end portion of a central portion of the coil pattern and a second lead part formed outside of the coil pattern,
a recess being formed by removing a portion of the second surface, the first lead part being electrically connected to the second lead part by a conductive material disposed in the recess and a first via formed in the magnetic laminate in a lamination direction, and the second lead part being electrically connected to the first lead part by the conductive material disposed in the recess and a second via formed in the magnetic laminate in the lamination direction.

7. The contactless power transmission device of claim 6 , wherein the magnetic laminate has a thickness of 100 to 200 um.

8. The contactless power transmission device of claim 6 , wherein the coil pattern has a thickness of 5 to 95 um.

9. The contactless power transmission device of claim 6 , wherein the transmission or reception shield part has a thickness of 105 to 295 um.

Assignees

• Samsung Electro Mech

Inventors

• Park Seung Wook
• Park No Il
• Jung Doo Sung
• Kim Jang Su
• Lee Chang Bae

Classifications

• H02J50/70

  involving the reduction of electric, magnetic or electromagnetic leakage fields · CPC title

• H01F2027/2809

  on stacked layers · CPC title

• H01F27/288

  Shielding · CPC title

• Y10T156/1057

  Subsequent to assembly of laminae · CPC title

• H01F27/2804 Primary

  Printed windings · CPC title