Semiconductor memory device

US9502103B1 · US · B1

Patent metadata
FieldValue
Publication numberUS-9502103-B1
Application numberUS-201615068744-A
CountryUS
Kind codeB1
Filing dateMar 14, 2016
Priority dateOct 6, 2015
Publication dateNov 22, 2016
Grant dateNov 22, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A semiconductor memory device according to an embodiment includes: a semiconductor substrate; and a memory cell array which is arranged above the semiconductor substrate in a first direction. The memory cell array includes: a semiconductor layer which extends in the first direction; a first conductive line which extends in a second direction crossing the first direction; a variable resistance film which is arranged at an intersection between the semiconductor layer and the first conductive line; a plurality of second conductive lines which are arranged in the second direction sandwiching the semiconductor layer and extend in the first direction; and a plurality of third conductive lines which are electrically connected to the second conductive lines. Two of the second conductive lines neighboring to each other in the second direction with the semiconductor layer interposed therebetween are electrically connected to different third conductive lines.

First claim

Opening claim text (preview).

What is claimed is: 1. A semiconductor memory device comprising: a semiconductor substrate; and a memory cell array which is arranged above the semiconductor substrate in a first direction, the memory cell array including: a semiconductor layer which extends in the first direction; a first conductive line which extends in a second direction crossing the first direction; a variable resistance film which is arranged at an intersection between the semiconductor layer and the…

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What does patent US9502103B1 cover?
A semiconductor memory device according to an embodiment includes: a semiconductor substrate; and a memory cell array which is arranged above the semiconductor substrate in a first direction. The memory cell array includes: a semiconductor layer which extends in the first direction; a first conductive line which extends in a second direction crossing the first direction; a variable resistance f…
Who is the assignee on this patent?
Toshiba Kk
What technology area does this patent fall under?
Primary CPC classification G11C13/0007. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Nov 22 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).