Method and device for managing information exchange between nfc controller and auxiliary elements
US-2024114324-A1 · Apr 4, 2024 · US
US9501736B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9501736-B2 |
| Application number | US-201615013939-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 2, 2016 |
| Priority date | Jun 21, 2006 |
| Publication date | Nov 22, 2016 |
| Grant date | Nov 22, 2016 |
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A breakaway RFID tag is configured such that it comprises part of a Printed Circuit Board Assembly (PCB). Thus, the breakaway RFID tag can be used to track the PCB as it migrates through a manufacturing process. In one embodiment, the RFID tag can be assembled first and then used to track the PCB as it is populated with components and installed into larger assemblies and ultimately into the end device. Once the PCB is installed into a larger assembly or the end device, the breakaway RFID tag is configured such that it can be broken off and attached to the outside of the larger assembly or end device.
Opening claim text (preview).
What is claimed is: 1. A trackable printed circuit board (PCB), comprising: a main circuit area which is manufactured through a PCB process including a plurality of processing steps, wherein the plurality of processing steps include one or more assembly steps for assembling multiple components onto the main circuit area; a breakaway radio frequency identification (RFID) tag, wherein the breakaway RFID tag is configured to be scanned during the PCB process when the breakaway RFID tag is attached to the main circuit area and store information associated with the plurality of processing steps; and a breakable portion connecting the main circuit area and the RFID tag, wherein the breakable portion is configured to allow the breakaway RFID tag to be detached from the main circuit area. 2. The trackable PCB of claim 1 , wherein the breakaway RFID tag is scanned before each of the plurality of processing steps. 3. The trackable PCB of claim 1 , wherein the breakaway RFID tag is scanned after each of the plurality of processing steps. 4. The trackable PCB of claim 1 , wherein the plurality of processing steps include a repair step for performing a repair operation on the trackable PCB at a repair station. 5. The trackable PCB of claim 4 , wherein the breakaway RFID tag is scanned when the trackable PCB enters the repair station. 6. The trackable PCB of claim 4 , wherein the breakaway RFID tag is scanned when the trackable PCB exits the repair station. 7. The trackable PCB of claim 1 , wherein the stored information includes identification information of the breakaway RFID tag and a time when the breakaway RFID tag is scanned. 8. The trackable PCB of claim 1 , wherein the breakaway RFID tag comprises: a printed antenna; and an integrated circuit (IC) pad configured to receive an RFID transponder IC. 9. The trackable PCB of claim 8 , wherein the breakaway RFID tag further comprises an RFID transponder disposed on the IC pad. 10. The trackable PCB of claim 1 , wherein the breakable portion is perforated with holes so that the breakaway RFID tag can be easily snapped-off from the trackable PCB. 11. The trackable PCB of claim 1 , wherein the breakaway RFID tag comprises a passive RFID tag. 12. The trackable PCB of claim 1 , wherein the breakaway RFID tag comprises an active RFID tag. 13. A method for manufacturing a printed circuit board (PCB), comprising: fabricating a breakaway radio frequency identification (RFID) tag of the PCB, wherein the breakaway RFID tag includes a printed antenna and an RFID transponder integrated circuit (IC); manufacturing a main circuit area of the PCB through a PCB process including a plurality of processing steps, wherein manufacturing the main circuit area further includes scanning the breakaway RFID tag after each of the plurality of processing steps and storing information associated with the plurality of processing steps using the breakaway RFID tag; and manufacturing a breakable portion of the PCB which connects the main circuit area and the breakaway RFID tag, wherein the breakable portion is configured to allow the breakaway RFID tag to be detached from the main circuit area. 14. The method of claim 13 , wherein the plurality of processing steps include one or more assembly steps for assembling multiple components onto the main circuit area. 15. The method of claim 13 , wherein the plurality of processing steps include a repair step for performing a repair operation on the PCB at a repair station. 16. The method of claim 15 , wherein scanning the breakaway RFID tag includes scanning the breakaway RFID tag when the PCB enters the repair station. 17. The method of claim 15 , wherein scanning the breakaway RFID tag includes scanning the breakaway RFID tag when the PCB exits the repair station. 18. The method of claim 13 , wherein storing information associated with the plurality of processing steps includes storing identification information of the breakaway RFID tag and a time when the breakaway RFID tag is scanned. 19. The method of claim 13 , wherein the method further comprises after the PCB has been manufactured, detaching the breakaway RFID tag from the main circuit area and attaching the breakaway RFID tag to the exterior of an assembly comprising the PCB where the breakaway RFID tag maintains its tracking function.
Logistics, e.g. warehousing, loading or distribution; Inventory or stock management · CPC title
Marks, test patterns or identification means · CPC title
for electrical inspection or testing · CPC title
interrogator driven, i.e. synchronous · CPC title
Assembling printed circuits with electric components, e.g. with resistors · CPC title
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