Thermal energy storage, dissipation and EMI suppression for integrated circuits using porous graphite sheets and phase change material

Patent metadata

Field	Value
Publication number	US-9501112-B2
Application number	US-201314125654-A
Country	US
Kind code	B2
Filing date	Aug 10, 2013
Priority date	Aug 10, 2013
Publication date	Nov 22, 2016
Grant date	Nov 22, 2016

Abstract

Mobile platforms and methods may provide for an integrated circuit such as a system on chip (SoC), a first heat spreader thermally coupled to the integrated circuit and a phase change material configuration thermally coupled to the first heat spreader. The integrated circuit may include logic to operate the integrated circuit in a performance burst mode according to a duty cycle, wherein the performance burst mode causes a phase change material to enter a liquid state within a graphite matrix of the phase change material configuration.

First claim

We claim:

1. A mobile platform comprising:
an integrated circuit;
a first heat spreader thermally coupled to the integrated circuit; and
a phase change material configuration thermally coupled to the first heat spreader, wherein the phase change material is impregnated within open cell cavities of porous graphite sheets;
a printed circuit board having a ground plane electrically coupled to the integrated circuit, wherein the phase change material configuration is electrically coupled to the printed circuit ground plane to attenuate electromagnetic interference (EMI) radiation, further including an epoxy disposed between the printed circuit board and the phase change material configuration;
an EMI fence electrically coupled to the ground plane and the phase change material configuration wherein the phase change material configuration is removably coupled to the EMI fence.

2. The mobile platform of claim 1 , wherein the phase change material includes wax.

3. The mobile platform of claim 1 , wherein the phase change material is to be contained within the graphite matrix when the phase change material is in a liquid state.

4. The mobile platform of claim 1 , wherein the integrated circuit includes logic to operate the integrated circuit in a performance burst mode according to a duty cycle.

5. The mobile platform of claim 4 , wherein the duty cycle operation, the phase change material and the graphite matrix are to combine to prevent a junction temperature limit associated with the integrated circuit from being exceeded.

6. The mobile platform of claim 4 , wherein the duty cycle operation, the phase change material and the graphite matrix are to combine to prevent a skin temperature limit associated with the mobile platform from being exceeded.

7. The mobile platform of claim 4 , further including a temperature sensor, wherein the logic is to set the duty cycle based on a signal from the temperature sensor.

8. The mobile platform of claim 1 , wherein the first heat spreader includes one or more heat reliefs to conduct heat away from a skin of the mobile platform.

9. The mobile platform of claim 1 , further including a second heat spreader thermally coupled to the phase change material configuration.

10. The mobile platform of claim 9 , further including a display, wherein the second heat spreader is an aluminum spreader associated with the display.

Assignees

• Intel Corp

Inventors

• Nelson Daryl
• Daniel Kevin
• Chiang Daniel
• Gallina Mark
• Lofland Steven

Classifications

• G06F2200/201

  Cooling arrangements using cooling fluid · CPC title

• G06F1/206 Primary

  comprising thermal management · CPC title

• G06F1/203

  for portable computers, e.g. for laptops · CPC title