Electronic apparatus, measuring method, and monitoring apparatus

Patent metadata

Field	Value
Publication number	US-9500693-B2
Application number	US-201213676605-A
Country	US
Kind code	B2
Filing date	Nov 14, 2012
Priority date	Nov 16, 2011
Publication date	Nov 22, 2016
Grant date	Nov 22, 2016

Abstract

According to an embodiment, an electronic apparatus includes a first member serving as a circuit board member; a second member serving as a circuit board member or a semiconductor device; a first electrode formed on the first member; a second electrode formed on a region, of the first member, around a region where the first electrode is formed; and a third electrode formed on the second member. The electronic apparatus also includes a electrical joint configured to bond the first electrode, the second electrode, and the third electrode; and a measuring module configured to measure an electrical characteristic value of a connection path including at least one of the first electrode and the second electrode.

First claim

What is claimed is:

1. An electronic apparatus comprising:
a first member serving as a circuit board member;
a second member serving as a circuit board member or a semiconductor device;
a first electrode formed on the first member;
a second electrode formed on a region, of the first member, around a region where the first electrode is formed, to surround the first electrode;
a third electrode formed on the second member;
a first electrical joint configured to bond the first electrode and the third electrode;
a second electrical joint configured to bond the second electrode and the third electrode, the second electrical joint being separated from the first electrical joint; and
a measuring module configured to measure an electrical characteristic value of a connection path including the first electrode.

2. The electronic apparatus according to claim 1 , wherein the first electrode includes plural electrodes that are separated from one another.

3. The electronic apparatus according to claim 2 , wherein the connection path includes at least two of the plural electrodes or the connection path includes the second electrode and at least one of the plural electrodes.

4. The electronic apparatus according to claim 1 , wherein the region where the first electrode is formed includes a region, of the first member, closest to a connection portion between a conductive member connected to the second member and the second member.

5. The electronic apparatus according to claim 2 , wherein a region where at least one of the plural electrodes is formed includes a region, of the first member, closest to a connection portion between a conductive member connected to the second member and the second member.

6. The electronic apparatus according to claim 1 , wherein a gap is formed between the first electrode and the second electrode.

7. The electronic apparatus according to claim 2 , wherein a gap is formed between the plural electrodes, and a gap is formed between the plural electrodes and the second electrode.

8. The electronic apparatus according to claim 1 , wherein a resist is formed between the first electrode and the second electrode.

9. The electronic apparatus according to claim 2 , wherein a resist is formed between the plural electrodes, and a resist is formed between the plural electrodes and the second electrode.

10. An electronic apparatus comprising:
a first member serving as a circuit board member;
a second member serving as a circuit board member or a semiconductor device;
a first electrode formed on the first member;
a second electrode formed on a region, of the first member, around a region where the first electrode is formed;
a third electrode formed on the second member;
a electrical joint configured to bond the first electrode, the second electrode, and the third electrode;
a measuring module configured to measure an electrical characteristic value of a connection path, the measuring module including a plurality of measuring modules that measure electric properties of plural different connection paths, respectively, each of the connection paths including at least one of the first electrode and the second electrode; and
a calculation unit configured to calculate a damage-related index on the electrical joint based upon a relationship determined for the connection path whose electrical characteristic value is measured, out of relationships, which are determined for the respective measuring modules, between the electrical characteristic value and the damage-related index on the electrical joint, and the measured electrical characteristic value.

11. The electronic apparatus according to claim 10 , further comprising an output unit configured to output a calculation result obtained by the calculation unit.

12. The electronic apparatus according to claim 1 , further comprising:
a fourth electrode formed under the first member; and
a fifth electrode formed on a back surface of the second member, the back surface being reverse to a surface on which the third electrode is formed, wherein
the connection path connects at least one of the first electrode and the second electrode and at least one of the third electrode, the fourth electrode, and the fifth electrode.

13. An electronic apparatus comprising:
a first member serving as a circuit board member;
a second member serving as a circuit board member or a semiconductor device;
a first electrode formed on the first member;
a second electrode formed on the second member;
a third electrode formed on a region, of the second member, around a region where the second electrode is formed, to surround the second electrode;
a first electrical joint configured to bond the first electrode and the second electrode;
a second electrical joint configured to bond the first electrode and the third electrode, the second electrical joint being separated from the first electrical joint; and
a measuring module configured to measure an electrical characteristic value of a connection path including the second electrode.

14. A measuring method for an electronic apparatus, the method comprising:
measuring an electrical characteristic value of a connection path including at least one of a first electrode and a second electrode, wherein the electronic apparatus comprises:
a first member serving as a circuit board member,
a second member serving as a circuit board member or a semiconductor device,
the first electrode formed on the first member,
the second electrode formed on a region, on the first member, around a region where the first electrode is formed, to surround the first electrode,
a third electrode formed on the second member,
a first electrical joint configured to bond the first electrode and the third electrode, and
a second electrical joint configured to bond the second electrode and the third electrode, the second electrical joint being separated from the first electrical joint.

15. A measuring method for an electronic apparatus, the method comprising:
measuring an electrical characteristic value of a connection path including at least one of the second electrode and the third electrode, wherein the electronic apparatus comprises:
a first member serving as a circuit board member,
a second member serving as a circuit board member or a semiconductor device,
a first electrode formed on the first member,
the second electrode formed on the second member,
the third electrode formed on a region, of the second member, around a region where the second electrode is formed, to surround the second electrode,
a first electrical joint configured to bond the first electrode and
the second electrode and a second electrical joint configured to bond the first electrode and the third electrode, the second electrical joint being separated from the first electrical joint.

Assignees

• Monda Tomoko
• Hirohata Kenji
• Toshiba Kk

Inventors

• Monda Tomoko
• Hirohata Kenji

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/931

  Shapes of bond pads · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title