Thermal management device and method for making the same

Patent metadata

Field	Value
Publication number	US-9500416-B2
Application number	US-13108108-A
Country	US
Kind code	B2
Filing date	May 31, 2008
Priority date	May 31, 2008
Publication date	Nov 22, 2016
Grant date	Nov 22, 2016

Abstract

A thermal management device suitable for use as an electronic chassis includes a monolithic, monocoque body having integrally formed channels for carrying thermal energy away from a heat source, such as electronic components. The device may be fabricated using additive/subtractive manufacturing processes such as ultrasonic consolidation.

First claim

What is claimed is:

1. A thermal management device comprising:
a one-piece monolithic body having at least one embedded channel for channeling heat away from a heat source, said at least one embedded channel surrounded by fluid impervious consolidated layers of thermally conductive material comprising said monolithic body, said consolidated layers of thermally conductive material comprising multiple solid interfaces that are metallurgically bonded, wherein the at least one embedded channel is formed within a first layer of material that is sandwiched between two outer layers of material, wherein the first layer of material and the two outer layers of material are different materials, wherein the first layer of material and the two outer layers of material are fused into the one-piece monolithic body, and wherein the monolithic body includes a second embedded channel for channeling heat away from the heat source, the first and second channels forming a zigzag pattern and being generally coextensive with each other.

2. The device of claim 1 , wherein:
the body includes first and second opposite edges, and
the channel includes first and second portions respectively extending along the first and second edges for channeling heat from the body to the first and second edges.

3. The device of claim 1 , wherein the channel includes internal walls and thermal fins integral with the walls for enhancing heat transfer from the body to the channel.

4. The device of claim 1 , wherein the body is a plate having opposite faces upon which the heat source may be mounted.

5. An electronics chassis having thermal management, comprising:
a one-piece monocoque body having at least one integral channel therein for carrying heat away from an electronic assembly, said at least one integral channel surrounded by fluid impervious consolidated layers of thermally conductive material comprising said monocoque body, said consolidated layers of thermally conductive material comprising multiple solid interfaces that are metallurgically bonded, wherein the at least one integral channel is formed within a first layer of material that is sandwiched between two outer layers of material, wherein the first layer of material and the two outer layers of material are different materials, wherein the first layer of material and the two outer layers of material are fused into the monocoque body, and wherein the monocoque body includes integrally formed inlet and outlet openings coupled with the channel for directing a flow of a heat exchange fluid into and out of the monocoque body.

6. The electronics chassis of claim 5 , wherein:
the monocoque body includes an edge, and
the channel includes portions extending along the edge of the monocoque body for channeling heat from the electronic assembly to the edge of the monocoque body.

7. The electronic chassis of claim 5 , wherein the monocoque body includes integrally formed thermal fins within the channel for enhancing heat transfer from the body to the channel.

8. The electronic chassis of claim 5 , wherein the monocoque body includes consolidated layers of at least one of:
aluminum,
copper,
manganese,
nickel,
gold,
silver, and
titanium.

9. The electronic chassis of claim 5 , further comprising:
a mounting receptacle, and
wherein the monocoque body includes a face configured to have a second electronics assembly mounted thereon, and an edge extending generally traverse to the face and received within the mounting receptacle.

10. An electronic device having thermal management, comprising:
a one-piece monolithic chassis; and
at least one circuit board mounted on the chassis, said at least one circuit board comprising electronic devices generating heat,
wherein the monolithic chassis includes integral channels for carrying heat away from the at least one circuit board, each of said integral channels surrounded by fluid impervious consolidated layers comprising solid interfaces of thermally conductive material comprising said monolithic chassis, said consolidated layers of thermally conductive material being metallurgically bonded, wherein the integral channels are formed within a first layer of material that is sandwiched between two outer layers of material, wherein the first layer of material and the two outer layers of material are different materials, wherein the first layer of material and the two outer layers of material are fused into the one-piece monolithic body, and wherein the monolithic chassis includes integrally formed inlet and outlet openings coupled with the channel integral channels directing a flow of a heat exchange fluid into and out of the monolithic chassis.

11. A thermal management device comprising:
a generally flat one piece monolithic body including solid interfaces of metallurgically bonded layers of a metal foil, and a pair of faces each having a means to contact a heat source; and,
open fluid channels integral with the body, including thermal fins in the channels for enhancing the transfer of heat from the body into the channels, the channels including aligned stretches extending along edges of the flat monolithic body defining heat extraction zones where heat may be extracted from the body, said fluid channels surrounded by said metallurgically bonded layers of metal foil, said bonded layers of metal foil impervious to fluid, wherein the open fluid channels are formed within a first layer of material that is sandwiched between the metallurgically bonded layers of metal foil wherein the first layer of material and the two outer layers of material are different materials, and wherein the first layer of material and the two outer layers of material are fused into the monolithic body.

12. The thermal management device of claim 1 wherein a boundary between the first layer of material and the two layers of material is indistinct as a result of being fused.

13. The thermal management device of claim 12 wherein the one-piece monolithic body includes holes, and wherein the at least one embedded channel has an irregularly shaped layout geometry including arcuate sections that substantially follow a periphery of the holes.

14. The electronics chassis of claim 5 wherein a boundary between the first layer of material and the two layers of material is indistinct as a result of being fused.

15. The thermal management device of claim 14 wherein the one-piece monolithic body includes holes, and wherein the at least one embedded channel has an irregularly shaped layout geometry including arcuate sections that substantially follow a periphery of the holes.

16. The electronic assembly of claim 10 wherein a boundary between the first layer of material and the two layers of material is indistinct as a result of being fused.

17. The thermal management device of claim 16 wherein the one-piece monolithic body includes holes, and wherein the at least one embedded channel has an irregularly shaped layout geometry including arcuate sections that substantially follow a periphery of the holes.

18. The thermal management device of claim 11 wherein a boundary between the first layer of material and the two layers of material is indistinct as a result of being fused, wherein the one-piece monolithic body includes holes, and wherein the at least one embedded channel has an irregularly shaped layout geometry including arcuate sections that substantially follow a periphery of the holes.

Assignees

• Nguyen Sean
• Duncan Gary L
• Drolen Bruce L
• Bowden David M
• Boeing Co

Inventors

• Nguyen Sean
• Duncan Gary L
• Drolen Bruce L
• Bowden David M

Classifications

• H10W40/00

  Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title

• H10W40/10 Primary

  Arrangements for heating · CPC title

• H05K7/20545

  Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards · CPC title

• F28F21/08

  of metal · CPC title

• F28F3/02

  Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations (F28F3/08 takes precedence) · CPC title