Clean polycarbonate material for use in hard disk drive and semiconductor applications

Patent metadata

Field	Value
Publication number	US-9499693-B2
Application number	US-201213670635-A
Country	US
Kind code	B2
Filing date	Nov 7, 2012
Priority date	Nov 7, 2011
Publication date	Nov 22, 2016
Grant date	Nov 22, 2016

Abstract

Compositions based on polycarbonate copolymers to provide ultra-clean materials and articles useful in the hard disk drive and semiconductor industries. In one aspect, the compositions include a polycarbonate copolymer based on a sebacic acid, BPA, PCP polyestercarbonate. The compositions may be used with or without other polymers, fillers or additives. The compositions based on this polycarbonate copolymer exhibit ultra clean performance, low organic contamination, low LPC, and low ionic contaminations. Meanwhile, the compositions also exhibit good flow ability, good ductility and good surface quality.

First claim

What is claimed is:

1. A thermoplastic composition, comprising:
(a) 50 to 95% by weight of at least one polyester-polycarbonate having a weight average molecular weight between 30,000 to 40,000 Daltons as measured by gel permeation chromatography polycarbonate standards and 5.0 mole % to 15.0 mole % sebacic acid and at least one polyester-carbonate having a weight average molecular weight between 15,000 to 25,000 Daltons as measured by gel permeation chromatography using polycarbonate standards and 5.0 mole % to 12.0 mole % sebacic acid; and
(b) 5 to 50% by weight of at least one filler selected from glass, ceramic fiber, carbon fiber, a conductive filler, polytetrafluoroethylene, or a combination including at least one of the foregoing fillers;
wherein the composition, as compared to a composition comprising a bisphenol A-based polycarbonate having at least one same filler and filler loading, has a melt volume rate as measured according to ASTM-D1238-10 that is at least 20% higher, an impact strength that is at least 20% higher, and a liquid particle count that is at least 20% lower.

2. The composition of claim 1 , wherein the polyester-polycarbonate having a molecular weight average between 30,000 to 40,000 Daltons as measured by gel permeation chromatography polycarbonate standards has 7.75 mole % to 8.75 mole % sebacic acid of the total composition.

3. The composition of claim 1 , wherein the polyester-polycarbonate having a molecular weight average between 15,000 to 25,000 Daltons as measured by gel permeation chromatography polycarbonate standards has 5.5 mole % to 6.5 mole % sebacic acid of the total composition.

4. The composition of claim 1 , further comprising other additives such as heat stabilizers, mold release agents, impact modifiers, UV stabilizers, flame retardants, antistatic agents, anti-drip agents, radiation stabilizers and/or colorants.

5. The composition of claim 1 , wherein the filler comprises glass fiber.

6. The composition of claim 1 , wherein the filler comprises carbon fiber.

7. The composition of claim 1 , wherein the filler comprises conductive carbon black.

8. The composition of claim 1 , wherein the filler comprises carbon fiber and polytetrafluoro ethylene.

9. The composition of claim 1 , wherein the composition comprises 5 to 35% by weight of the at least one filler.

10. An article of manufacture comprising the composition of claim 1 .

11. A thermoplastic composition, comprising:
(a) 65 to 90% by weight of at least one polyester-polycarbonate having a weight average molecular weight between 30,000 to 40,000 Daltons as measured by gel permeation chromatography polycarbonate standards and 5.0 mole % to 15.0 mole % sebacic acid and at least one polyester-carbonate having a weight average molecular weight between 15,000 to 25,000 Daltons as measured by gel permeation chromatography using polycarbonate standards and 5.0 mole % to 12.0 mole % sebacic acid; and
(b) 10 to 35% by weight of at least one filler selected from glass, carbon fiber, a conductive filler, polytetrafluorethylene, or a combination including at least one of the foregoing fillers;
wherein the composition, as compared to a composition comprising a bisphenol A-based polycarbonate having at least one same filler and filler loading, has a melt volume rate as measured according to ASTM-D1238-10 that is at least 20% higher, an impact strength that is at least 20% higher, and a liquid particle count that is at least 20% lower.

12. The composition of claim 11 , wherein the polyester-polycarbonate having a molecular weight average between 30,000 to 40,000 Daltons as measured by gel permeation chromatography polycarbonate standards has 7.75 mole % to 8.75 mole % sebacic acid of the total composition.

13. The composition of claim 11 , wherein the polyester-polycarbonate having a molecular weight average between 15,000 to 25,000 Daltons as measured by gel permeation chromatography polycarbonate standards has 5.5 mole % to 6.5 mole % sebacic acid of the total composition.

14. The composition of claim 11 , further comprising other additives such as heat stabilizers, mold release agents, impact modifiers, UV stabilizers, flame retardants, antistatic agents, anti-drip agents, radiation stabilizers and/or colorants.

15. The composition of claim 11 , wherein the filler comprises glass fiber.

16. The composition of claim 11 , wherein the filler comprises carbon fiber.

17. The composition of claim 11 , wherein the filler comprises conductive carbon black.

18. The composition of claim 11 , wherein the filler comprises carbon fiber and polytetrafluoro ethylene.

19. An article of manufacture comprising the composition of claim 11 .

Assignees

• Zheng Yun
• Zou Xiangping (David)
• Meng Fanshun
• Yan Yangang
• Sabic Global Technologies Bv

Inventors

• Zheng Yun
• Zou Xiangping (David)
• Meng Fanshun
• Yan Yangang

Classifications

• C08L69/005 Primary

  Polyester-carbonates · CPC title

• C08L67/02 Primary

  Polyesters derived from dicarboxylic acids and dihydroxy compounds (C08L67/06 takes precedence) · CPC title

• C08L27/18

  Homopolymers or copolymers or tetrafluoroethene · CPC title

• C08K7/04

  inorganic · CPC title

• C08K2201/001

  Conductive additives · CPC title