Molding packaging material and molded case

US9498935B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9498935-B2
Application numberUS-201414196593-A
CountryUS
Kind codeB2
Filing dateMar 4, 2014
Priority dateMar 5, 2013
Publication dateNov 22, 2016
Grant dateNov 22, 2016

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A molding packaging material 1 of this invention contains a biaxially stretched polyamide film layer 2 as an outer layer, a thermoplastic resin layer 3 as an inner layer, and a metal foil layer 4 disposed between the both layers 2 and 3 , in which a biaxially stretched polyamide film in which when the fracture strength of the film is defined as “X” and the fracture strain of the film is defined as “Y”, the X/Y value is 230 MPa to 360 MPa is used as the biaxially stretched polyamide film 2 . The molding packaging material can secure excellent moldability even when the molding packaging material is not coated with a slipperiness imparting component.

First claim

Opening claim text (preview).

The invention claimed is: 1. A molding packaging material, comprising: a biaxially stretched polyamide film layer as an outer layer; a thermoplastic resin layer as an inner layer; and a metal foil layer disposed between the both layers, wherein as the biaxially stretched polyamide film, a biaxially stretched polyamide film in which when a fracture strength of the film is defined as “X” and a fracture strain of the film is defined as “Y”, a X/Y value is 230 MPa to 360 MPa is…

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What does patent US9498935B2 cover?
A molding packaging material 1 of this invention contains a biaxially stretched polyamide film layer 2 as an outer layer, a thermoplastic resin layer 3 as an inner layer, and a metal foil layer 4 disposed between the both layers 2 and 3 , in which a biaxially stretched polyamide film in which when the fracture strength of the film is defined as “X” and the fracture strain of the film…
Who is the assignee on this patent?
Showa Denko Packaging Co Ltd, Showa Denko Packaging Co
What technology area does this patent fall under?
Primary CPC classification B32B15/088. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 22 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).