Housing, manufacturing method thereof, and electronic device using the same

US9498907B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9498907-B2
Application numberUS-201314038946-A
CountryUS
Kind codeB2
Filing dateSep 27, 2013
Priority dateNov 28, 2012
Publication dateNov 22, 2016
Grant dateNov 22, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Provided is a method of manufacturing a housing of an electronic device. The method includes manufacturing a housing body by successively stacking a composite material sheet with a plastic sheet applied to at least one surface of a top and a bottom surfaces of the composite material sheet and molding a plastic injection-molded product on the plastic sheet of the housing body through insert molding to connectively affix the composite material sheet with the housing body and the plastic sheet.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of manufacturing a housing of an electronic device, the method comprising: manufacturing a housing body by successively stacking a composite material sheet with a plastic sheet applied to at least one surface of a top and a bottom surfaces of the composite material sheet, the housing body including an outer surface and an inner surface; and molding a plastic injection-molded product having a front face and a rear face onto the plastic sheet of the housing body through insert molding such that an entirety of the front face is affixed to the inner surface, the insert molding further connectively affixing the composite material sheet with the housing body and the plastic sheet, wherein the plastic injection-molded product includes openings, each opening exposing a portion of the inner surface of the housing body to provide additional space for electronic components housed in the electronic device, a particular opening of the openings comprising a quadrilateral form, and wherein the plastic-molded injection product is molded to include at least one slit extending from a vertex of the quadrilateral form towards a terminal edge of the inner surface of the housing body, and disposed diagonally relative to an edge of the quadrilateral, the at least one slit configured to prevent deformation of the housing body from contraction of the plastic injection-molded product. 2. The method of claim 1 , wherein the plastic sheet of the housing body to which the insert molding is applied is formed of a same material as the plastic injection-molded product. 3. The method of claim 1 , wherein a bonded portion between the plastic sheet of the housing body and the plastic injection-molded product is thermally fused to connectively affix the composite material sheet with the housing body and the plastic sheet. 4. The method of claim 1 , wherein the plastic sheet is a surface-treated plastic sheet and wherein the surface-treated plastic sheet adhering to the housing body is disposed on the top surface of the composite material sheet, and the plastic sheet adhering to the plastic injection-molded product is disposed on the bottom surface of the composite material sheet. 5. The method of claim 4 , wherein a surface treatment of the surface-treated plastic sheet comprises at least one of coloring, dyeing, and depositing. 6. The method of claim 1 , wherein the plastic injection-molded product has snap-fits disposed along a circumference of the housing body so that the snap-fits are detachably coupled to a coupling groove defined in a rear housing of the electronic device. 7. The method of claim 1 , wherein the composite material sheet to which the plastic sheet is applied to the at least one surface of the top and bottom surfaces thereof is formed by successively stacking at least one fiber base material on one of the at least one surface of the top and bottom of the plastic sheet. 8. The method of claim 7 , wherein the at least one fiber base material comprises at least one of a unidirectional prepreg, a plain weave prepreg, a twill woven prepreg, and a satin weave prepreg. 9. The method of claim 1 , wherein the housing comprises a battery cover of the electronic device. 10. The method of claim 1 , wherein the plastic sheet of the body to which the insert molding is applied is formed of a same material as the plastic injection-molded product. 11. The method claim 1 , wherein a bonded portion between the plastic sheet of the housing body and the plastic injection-molded product is thermally fused to connectively affix the composite material sheet with the housing body and the plastic sheet. 12. The method claim 1 , wherein the plastic sheet is a surface-treated plastic sheet and wherein the surface-treated plastic sheet adhering to the housing body is disposed on the top surface of the composite material sheet, and the plastic sheet adhering to the plastic injection-molded product is disposed on the bottom surface of the composite material sheet. 13. The method of claim 12 , wherein a surface treatment of the surface-treated plastic sheet comprises at least one of coloring, dyeing, and depositing. 14. The method of claim 1 , wherein the plastic injection-molded product has snap-fits disposed along a circumference of the housing body so that the snap-fits are detachably coupled to a coupling groove defined in a rear body housing of the electronic device. 15. The method of claim 1 , wherein the composite material sheet to which the plastic sheet is applied to the at least one surface of the top and bottom surfaces thereof is formed by successively stacking at least one fiber base material on one of the at least one surface of the top and bottom of the plastic sheet. 16. The method of claim 15 , wherein the fiber base material comprises at least one of a unidirectional prepreg, a plain weave prepreg, a twill woven prepreg, and a satin weave prepreg. 17. The method of claim 1 , wherein the housing comprises a battery cover of the electronic device. 18. The method of claim 1 , wherein the electronic device further comprises: a front housing disposed on a front side of the electronic device, a rear housing coupled to the front housing to provide a space between the front housing and the rear housing for accommodating a plurality of electronic components of the electronic device, and a detachable rear cover disposed on a rear side of the electronic device, the detachable rear cover being coupled to the rear housing to provide a space accommodating a battery between the rear housing and the rear cover, the method further comprising manufacturing the rear cover by: successively stacking a composite material sheet with a plastic sheet applied to each of a top and a bottom surfaces of the composite material sheet to manufacture a body; and insert molding a plastic injection-molded product molded onto the plastic sheet disposed on the bottom surface of the body to connectively affix the composite material sheet with the housing body and the plastic sheet, the plastic injection-molded product having snap-fits on a circumference thereof so that the snap-fits are detachably coupled to a coupling groove defined in the rear housing, wherein the plastic sheet is a surface-treated plastic sheet and wherein the surface-treated plastic sheet adhering to the housing body is disposed on the top surface of the body comprises a surface-treated sheet, and wherein the plastic sheet disposed on the bottom surface of the body and the plastic injection-molded product are the same material, and a bonded portion between the plastic sheet and the plastic injection-molded product is thermally fused to connectively affix the composite material sheet with the housing body and the plastic sheet. 19. The method of claim 18 , wherein the composite material sheet to which the plastic sheet is applied to the at least one surface of the top and bottom surfaces thereof is formed by successively stacking at least one fiber base material on one of the at least one surface of the top and bottom of the plastic sheet.

Assignees

Inventors

Classifications

  • bonding by a fusion bond · CPC title

  • related to the mounting of internal components, e.g. disc drive or any other functional module · CPC title

  • Fibrous material or fibre containing material, e.g. fibre mats or fibre reinforced material · CPC title

  • Cellular phones · CPC title

  • Enclosures (for portable computers G06F1/1613) · CPC title

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Frequently asked questions

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What does patent US9498907B2 cover?
Provided is a method of manufacturing a housing of an electronic device. The method includes manufacturing a housing body by successively stacking a composite material sheet with a plastic sheet applied to at least one surface of a top and a bottom surfaces of the composite material sheet and molding a plastic injection-molded product on the plastic sheet of the housing body through insert mold…
Who is the assignee on this patent?
Samsung Electronics Co Ltd
What technology area does this patent fall under?
Primary CPC classification B29C45/14336. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 22 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).