Multi-layered structure and method

US9498142B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9498142-B2
Application numberUS-201414323163-A
CountryUS
Kind codeB2
Filing dateJul 3, 2014
Priority dateJul 3, 2014
Publication dateNov 22, 2016
Grant dateNov 22, 2016

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

One aspect relates to a method for producing a layered structure, including providing a substrate, forming a first layer onto at least part of the substrate, the first layer being a first polymer, and forming a second layer onto at least part of the first layer, the second layer being a second polymer. The substrate and the second layer are electrically conductive and the first layer is insulating or the substrate and the second layer are insulating and the first layer is electrically conductive. Forming each of the first and second layers includes forming such that each layer is no more than one tenth of the thickness of the substrate.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for producing a layered structure comprising: providing a substrate having a thickness and comprising a material that is biocompatible; forming a first layer onto at least part of the substrate, the first layer being a first biocompatible polymer; forming a second layer onto at least part of the first layer, the second layer being a second biocompatible polymer; wherein the substrate and the second layer are electrically conductive and the first layer is insulating or the substrate and the second layer are insulating and the first layer is electrically conductive; and characterized in that forming each of the first and second layers comprises forming such that each of the first and second layers is no more than one tenth of the thickness of the substrate and such that each are configured for implantation within the human body. 2. The method according to claim 1 , wherein at least one of the first and second layers comprises an electrically conductive PEDOT material. 3. The method according to claim 1 characterized in that forming each of the first and second layers comprises forming such that each of the first and second layers is no more than one fiftieth of the thickness of the substrate. 4. The method according to claim 1 , wherein forming of at least one of the first and second layers comprises masking ends of the layer to define contact areas that are configured for attaching an electrically conducting contact. 5. The method according to claim 1 , wherein forming of at least one of the first and second layers comprises using a conductive PEDOT polymer followed by using a chemical etch to change at least portions of the layer from conductive to insulative. 6. The method according to claim 1 , further comprising forming a third layer over the second layer, the third layer comprising an insulative photoresist material. 7. A method for producing a layered cylindrical structure comprising: providing a substrate having a diameter and comprising a material that is biocompatible; forming a first layer onto at least part of the substrate, the first layer being a first biocompatible polymer; forming a second layer onto at least part of the first layer, the second layer being a second biocompatible polymer, such that both the first and second layers are configured for implantation within the human body; wherein the substrate and the second layer are electrically conductive and the first layer is insulating or the substrate and the second layer are insulating and the first layer is electrically conductive; and characterized in that forming each of the first and second layers comprises forming such that each of the first and second layers has a thickness that is no more than one tenth of the diameter of the substrate such that overall dimensions of the layered structure are substantially determined by the diameter of the substrate. 8. The method of claim 7 , wherein providing the substrate comprises providing one of a wire and a needle. 9. The method according to claim 7 , wherein at least one of the first and second layers comprises an electrically conductive PEDOT material. 10. The method according to claim 7 characterized in that forming each of the first and second layers comprises forming such that each of the first and second layers is no more than one fiftieth of the thickness of the substrate. 11. The method according to claim 7 , wherein forming of at least one of the first and second layers comprises masking ends of the layer to define contact areas that are configured for attaching an electrically conducting contact. 12. The method according to claim 7 , wherein forming of at least one of the first and second layers comprises using a conductive PEDOT polymer followed by using a chemical etch to change at least portions of the layer from conductive to insulative. 13. The method according to claim 7 , further comprising forming a third layer over the second layer, the third layer comprising an insulative photoresist material.

Assignees

Inventors

Classifications

  • A61N1/05Primary

    for implantation or insertion into the body, e.g. heart electrode (A61N1/06 takes precedence) · CPC title

  • H01B1/127Primary

    comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes · CPC title

  • Metallic coating of wire (by extruding B21C23/24; by soldering or welding, e.g. cladding or plating, B23K) · CPC title

  • Electrical insulator · CPC title

  • specially adapted to be brought in contact with an internal body part, i.e. invasive · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9498142B2 cover?
One aspect relates to a method for producing a layered structure, including providing a substrate, forming a first layer onto at least part of the substrate, the first layer being a first polymer, and forming a second layer onto at least part of the first layer, the second layer being a second polymer. The substrate and the second layer are electrically conductive and the first layer is insulat…
Who is the assignee on this patent?
Heraeus Precious Metals Gmbh, Heraeus Deutschland Gmbh & Co Kg
What technology area does this patent fall under?
Primary CPC classification A61N1/05. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Nov 22 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).