Methods and Apparatuses to provide an electro-optical alignment

Patent metadata

Field	Value
Publication number	US-9497860-B2
Application number	US-201213671527-A
Country	US
Kind code	B2
Filing date	Nov 7, 2012
Priority date	Nov 7, 2012
Publication date	Nov 15, 2016
Grant date	Nov 15, 2016

Abstract

Exemplary embodiments of methods and apparatuses to provide an electro-optical alignment are described. An electrical connector is formed on a printed circuit board substrate that extends onto a side surface of the substrate to form an electrical turn. An optoelectronic die is placed onto the printed circuit board substrate. The optoelectronic die on the printed circuit board substrate is erected over a mounting board to provide optical coupling substantially parallel to the mounting board.

First claim

What is claimed is:

1. An optoelectronic assembly to provide an electro-optical alignment, comprising:
a printed circuit board substrate comprising:
a front surface,
a rear surface at an opposite side of the front surface of the printed circuit board substrate and parallel to the front surface,
a bottom surface extending from the front surface to the rear surface, wherein the bottom surface in conjunction with the front surface and the rear surface forming an outer periphery of the printed circuit board substrate, the bottom surface substantially perpendicular to the front surface and the rear surface,
a first electrical connector for connecting to a first conductive line on a mounting board, the first electrical connector formed on the printed circuit board substrate to extend at least partially along the front surface and the bottom surface,
a second electrical connector for connecting to a second conductive line on the mounting board, the second electrical connector formed on the printed circuit board substrate to extend at least partially along the bottom surface and the rear surface, the printed circuit board substrate configured to be secured to the mounting board with a portion of the first electrical connector and a portion of the second electrical connector on the bottom surface parallel to a mounting surface of the mounting board; and

an optoelectronic die on the front surface of the printed circuit board substrate and electrically coupled to the first electrical connector, the optoelectronic die comprising an optical surface substantially parallel to the front surface,
wherein the printed circuit board substrate has a first mating feature, the first mating feature patterned on a top surface of the printed circuit board substrate, the top surface substantially parallel to the bottom surface and substantially perpendicular to the front surface, and a supporting member having a second mating feature and a third mating feature, wherein the supporting member is coupled to the printed circuit board substrate by mating the first mating feature with the second mating feature, and wherein the supporting member is coupled to a fiber holder by mating the third mating feature with a fourth mating feature, the fourth mating feature patterned on a rear surface of the fiber holder.

2. The assembly of claim 1 ,
wherein the fiber holder is configured to hold a fiber substantially parallel to the mounting surface of the mounting board.

3. The assembly of claim 1 , wherein the printed circuit board substrate is secured to the mounting board with the bottom surface facing the mounting surface of the mounting board.

4. The assembly of claim 1 , wherein the second mating feature is patterned on a top surface of the supporting member and the third mating feature is patterned on a front surface of the supporting member, the top surface of the supporting member substantially perpendicular to the front surface of the supporting member.

5. The assembly of claim 4 , wherein the fiber holder has a fifth mating feature, the fifth mating feature patterned on a front surface of the fiber holder, the front surface of the fiber holder substantially parallel to the rear surface of the fiber holder.

6. The assembly of claim 5 , further comprising:
a fiber configured to provide optical input to the printed circuit board substrate, the fiber passing through a first opening in the fiber holder and through a second opening in the supporting member.

7. The assembly of claim 6 , wherein each of the first opening and the second opening is formed in a direction substantially parallel to the mounting surface of the mounting board, the first opening extending from the front surface of the fiber holder to the rear surface of the fiber holder and the second opening extending from the front surface of the supporting member to a rear surface of the supporting member.

8. An optoelectronic assembly to provide an electro-optical alignment, comprising,
a printed circuit board substrate comprising:
a front surface,
a rear surface at an opposite side of the front surface of the printed circuit board substrate and parallel to the front surface,
a bottom surface extending from the front surface to the rear surface, wherein the bottom surface in conjunction with the front surface and the rear surface forming an outer periphery of the printed circuit board substrate, the bottom surface substantially perpendicular to the front surface and the rear surface,
a first electrical connector for connecting to a first conductive line on a mounting board, the first electrical connector formed on the printed circuit board substrate to extend at least partially along the front surface and the bottom surface,
a second electrical connector for connecting to a second conductive line on the mounting board, the second electrical connector formed on the printed circuit board substrate to extend at least partially along the bottom surface and the rear surface, the printed circuit board substrate configured to be secured to the mounting board with a portion of the first electrical connector and a portion of the second electrical connector on the bottom surface parallel to a mounting surface of the mounting board; and

an optoelectronic die on the front surface of the printed circuit board substrate and electrically coupled to the first electrical connector, the optoelectronic die comprising an optical surface substantially parallel to the front surface,
wherein the first electrical connector comprises a first electrical path on the bottom surface, the first electrical path filled with a conductive material and extending from the front surface to the rear surface, and wherein the second electrical connector comprises a second electrical path on the bottom surface, the second electrical path filled with a conductive material and extending from the rear surface to the front surface.

9. A printed circuit board substrate comprising:
a front surface;
a rear surface at an opposite side of the front surface and parallel to the front surface;
a bottom surface extending from the front surface to the rear surface, wherein the bottom surface in conjunction with the front surface and the rear surface forming an outer periphery of the printed circuit board substrate, the bottom surface substantially perpendicular to the front surface and the rear surface;
a first electrical connector for connecting to a first conductive line on a mounting board, the first electrical connector formed on the printed circuit board substrate to extend at least partially along the front surface and the bottom surface, the printed circuit board substrate configured to be secured to the mounting board with a portion of the first electrical connector on the bottom surface parallel to a mounting surface of the mounting board; and
an optoelectronic die placed on the front surface of the printed circuit board substrate and electrically coupled to the first electrical connector, the optoelectronic die comprising an optical surface substantially parallel to the front surface,
wherein the printed circuit board substrate has a first mating feature, the first mating feature patterned on a top surface of the printed circuit board substrate, the top surface substantially parallel to the bottom surface and substantially perpendicular to the front surface, and a supporting member having a second mating feature and a third mating feature, wherein the supporting member is coupled to the printed circuit board substrate by mating the first mating feature with the second mating feature, and wherein the supporting member is coupled to a fiber holder by mating the third mating feature with a fourth mating feature, the fourth mating feature patte

Assignees

• Lattice Semiconductor Corp

Inventors

• Kim Kihong

Classifications

• H05K1/0274

  Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42) · CPC title

• G02B6/42

  Coupling light guides with opto-electronic elements · CPC title

• H05K1/141

  One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence) · CPC title

• G02B6/4246

  Bidirectionally operating package structures · CPC title

• Y10T29/4913

  Assembling to base an electrical component, e.g., capacitor, etc. · CPC title