Metal microparticle dispersion, process for production of electrically conductive substrate, and electrically conductive substrate

Patent metadata

Field	Value
Publication number	US-9497859-B2
Application number	US-201013497555-A
Country	US
Kind code	B2
Filing date	Sep 6, 2010
Priority date	Sep 30, 2009
Publication date	Nov 15, 2016
Grant date	Nov 15, 2016

Abstract

Provided is a metal microparticle dispersion including metal microparticles, a polymeric dispersant and a dispersion medium, wherein an average primary particle diameter of the metal microparticles is 0.001 to 0.5 μm; the polymeric dispersant has a polyester skeleton in at least one of a principal chain and a side chain thereof; or the polymeric dispersant has a polyether skeleton in at least one of a principal chain and a side chain thereof; and a content of the above polymeric dispersant is 0.1 to 100 parts by mass based on a content of 100 parts by mass of the metal microparticles. Further, provided is a production process for an electrically conductive substrate, and an electrically conductive substrate produced by the above production process is provided.

First claim

What is claimed is:

1. A metal microparticle dispersion comprising metal microparticles, a polymeric dispersant and a dispersion medium,
wherein an average primary particle diameter of the metal microparticles is 0.001 to 0.5 μm;
the polymeric dispersant comprises a principal chain and a side chain;
the polymeric dispersant further comprises a polyether skeleton in the principal chain;
a content of the above polymeric dispersant is 0.1 to 100 parts by mass based on a content of 100 parts by mass of the metal microparticles; and
wherein the polymeric dispersant is represented by the following Formula (III)
R 4 O—(R 5 O) n —H   (III)

wherein R 4 is a phosphoric acid group and R 5 is a linear or branched alkylene group having 2 to 4 carbon atoms, and n represents a number from 1 to 30.

2. The metal microparticle dispersion according to claim 1 , wherein the polyether skeleton comprises at least one polyethylene glycol and at least one polypropylene glycol as a constitutional unit.

3. A production process for an electrically conductive substrate, comprising printing a coating solution containing the metal microparticle dispersion according to claim 1 in a pattern-like form on a base material to form a printed layer and subjecting the above printed layer to burning treatment to form a pattern-like metal microparticle sintered film.

4. The production process for an electrically conductive substrate according to claim 3 , wherein the burning is carried out by a surface wave plasma generated by applying a microwave energy.

5. The production process for an electrically conductive substrate according to claim 4 , wherein the burning is carried out by a surface wave plasma generated under inert gas atmosphere and/or reducing gas atmosphere.

6. The production process for an electrically conductive substrate according to claim 3 , wherein the burning comprises (i) a step in which burning is carried out at 165° C. or lower under atmosphere containing oxygen and (ii) a step in which burning is carried out at 165° C. or lower by a surface wave plasma under inert gas atmosphere and/or reducing gas atmosphere.

7. An electrically conductive substrate produced by the production process according to claim 3 .

8. The metal microparticle dispersion according to claim 1 , wherein metal constituting the metal microparticle dispersion is at least one selected from the group consisting of gold, silver, copper, nickel, platinum, palladium, tin, iron, chromium, indium, silicon and germanium.

9. The metal microparticle dispersion according to claim 1 , wherein the dispersion medium is at least one selected from the group consisting of aliphatic hydrocarbons, aromatic hydrocarbons, ketones, esters and alcohols.

10. The metal microparticle dispersion according to claim 2 , wherein a sum of the numbers of the polyethylene glycol unit and the polypropylene glycol unit is 10 or more in terms of an average value.

11. The metal microparticle dispersion according to claim 1 , wherein the polyether skeleton comprises at least one polyethylene glycol or at least one polypropylene glycol as a constitutional unit.

12. The metal microparticle dispersion according to claim 11 , wherein a sum of the numbers of the polyethylene glycol unit or the polypropylene glycol unit is 10 or more in terms of an average value.

Assignees

• Hojo Mikiko
• Yoneda Shinya
• Yoshi Naonobu
• Sato Takeshi
• Matsumoto Kisei
• Dainippon Printing Co Ltd

Inventors

• Hojo Mikiko
• Yoneda Shinya
• Yoshi Naonobu
• Sato Takeshi
• Matsumoto Kisei

Classifications

• B22F12/30

  Platforms or substrates · CPC title

• B22F10/32

  of the atmosphere, e.g. composition or pressure in a building chamber · CPC title

• B22F10/28

  Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] · CPC title

• B22F1/0545

  Dispersions or suspensions of nanosized particles · CPC title

• B22F1/107

  containing organic material comprising solvents, e.g. for slip casting · CPC title