Single transmission line for connecting radio frequency modules in an electronic device

Patent metadata

Field	Value
Publication number	US-9496948-B2
Application number	US-201414199395-A
Country	US
Kind code	B2
Filing date	Mar 6, 2014
Priority date	Jun 6, 2011
Publication date	Nov 15, 2016
Grant date	Nov 15, 2016

Abstract

A millimeter-wave radio frequency (RF) system, and method thereof for transferring multiple signals over a single transmission line connected between modules of a millimeter-wave RF system. The system comprises a single transmission line for connecting a first part of the RF system and a second part of the RF system, the single transmission line transfers a multiplexed signal between the first part and second part, wherein the multiplexed signal includes intermediate frequency (IF) signal, a local oscillator (LO) signal, a control signal, and a power signal; the first part includes a baseband module and a chip-to-line interface module for interfacing between the baseband module and the single transmission line; and the second part includes a RF module and a line-to-chip interface module for interfacing between the RF module and the single transmission line, wherein the first part and the second part are located away from each other.

First claim

What is claimed is:

1. An apparatus for wireless communication comprising:
a single transmission line for connecting a first part of the apparatus and a second part of the apparatus, the single transmission line being configured to transfer a multiplexed signal between the first part and the second part, wherein the multiplexed signal includes an intermediate frequency (IF) signal, a local oscillator (LO) signal, a control signal, and a power signal;
the first part includes a baseband module and a chip-to-line interface comprising a multiplexer configured to interface between the baseband module and the single transmission line; and
the second part includes a radio frequency (RF) module and a line-to-chip interface comprising a de-multiplexer configured to interface between the RF module and the single transmission line, wherein the first part and the second part are located away from each other.

2. The apparatus of claim 1 , wherein the RF module includes an active antenna array configured to receive and transmit signals at least at the 60 GHz frequency band.

3. The apparatus of claim 1 , wherein:
the multiplexer is configured to multiplex the IF signal, the LO signal, and the control signal and produce a first multiplexed signal;
the chip-to-line interface further comprises a bias-T coupled to the multiplexer and configured to insert the power signal to the first multiplexed signal to produce the multiplexed signal to be transferred over the single transmission line; and
the bias-T is connected to the single transmission line.

4. The apparatus of claim 3 , wherein the multiplexer includes:
a high-pass filter (HPF) configured to pass signals at an IF frequency band of the IF signal;
a base-pass filter (BPS) configured to pass signals at a LO frequency band of the LO signal; and
a low-pass filter (LPF) configured to pass a signal at a control frequency band of the control signal, wherein the IF frequency band, the LO frequency band, and the control frequency band are set according to a frequency plan.

5. The apparatus of claim 4 , wherein the frequency plan defines separation of a frequency spectrum to the IF frequency band, the LO frequency band, and the control frequency band.

6. The apparatus of claim 4 , wherein the frequency plan is:
a) the IF frequency band is 13 GHz to 17.4 GHz, the LO band is 7 GHz to 8.2 GHz, and the control band is 200 MHz to 1.5 GHz;
b) the IF frequency band is 13 GHz to 17.4 GHz, the LO band is below 1 GHz, and the control band is 200 MHz to 1.5 GHz;
c) the IF frequency band is 5 GHz to 10 GHz, the LO band is below 100 MHz, and the control band is above 10 GHz; or
d) the IF frequency band is 5 GHz to 10 GHz, the LO band is above 15 GHz, and the frequency band of the control signal is 200 MHz to 1.5 GHz.

7. The apparatus of claim 3 , wherein the multiplexer is further configured to de-multiplex another IF signal, another LO signal, and another control signal received from the RF module over the single transmission line.

8. The apparatus of claim 3 , wherein the bias-t is connected to a power source and includes:
a network of transmission lines configured to block the IF signal, the LO signal, and the control signal from reaching the power source.

9. The apparatus of claim 8 , wherein the network of transmission lines includes three pairs of transmission lines, wherein each pair of transmission lines is designed to short a signal at its respective frequency band, a length of each transmission line is a quarter of a wavelength respective of the signal's frequency band, wherein the frequency band is the IF frequency band, the LO frequency band, or the control frequency band.

10. The apparatus of claim 1 , wherein:
the line-to-chip interface further comprises a bias-T connected to the single transmission line and configured to extract the power signal from the multiplexed signal to produce a second multiplexed signal; and
the de-multiplexer is coupled to an output of the bias-T and is configured to de-multiplex the IF signal, the LO signal, and the control signal from the second multiplexed signal.

11. The apparatus of claim 10 , wherein the de-multiplexer includes:
a high-pass filter (HPF) configured to pass signals at an IF frequency band of the IF signal;
a base-pass filter (BPS) configured to pass signals at a LO frequency band of the LO signal; and
a low-pass filter (LPF) configured to pass a signal at a control frequency band of the control signal, wherein the IF frequency band, the LO frequency band, and the control frequency band are set according to a frequency plan utilized for setting a multiplexer in the chip-to-line interface.

12. The apparatus of claim 10 , wherein the de-multiplexer is further configured to multiplex another IF signal and another control signal to be transferred to the baseband module over the single transmission line.

13. The apparatus of claim 10 , wherein the first part is integrated in a first RF integrated circuit (RFIC) and the second part is integrated in a second RF integrated circuit (RFIC), wherein each of the first RFIC and the second RFIC is mounted on a first printed circuit board (PCB) and second PCB respectively, the first and second PCBs being positioned apart from each other.

14. The apparatus of claim 13 , wherein the chip-to-line interface matches impedance between the first PCB and the single transmission line, and wherein the line-to-chip interface matches impedance between the second PCB and the single transmission line.

15. A method for wireless communication, comprising:
multiplexing an intermediate frequency (IF) signal, a local oscillator (LO) signal, a control signal, and a power signal; and
transferring the multiplexed IF signal, LO signal, control signal, and power signal, via a single transmission line, from a first part of an apparatus to a second part of the apparatus,
wherein the first part includes a baseband module and a chip-to-line interface comprising a multiplexer configured to interface between the baseband module and the single transmission line, and
wherein the second part includes a radio frequency (RF) module and a line-to-chip interface comprising a de-multiplexer configured to interface between the RF module and the single transmission line, wherein the first part and the second part are located away from each other.

16. The method of claim 15 , further comprising receiving and transmitting signals at least at a 60 GHz frequency band via an active antenna array of the RF module.

17. The method of claim 15 , wherein interfacing between the baseband module and the single transmission comprises:
multiplexing the IF signal, the LO signal, and the control signal and producing a first multiplexed signal using the multiplexer; and
inserting the power signal to the first multiplexed signal to produce the multiplexed signal to be transferred over the single transmission line via a bias-T coupled to the multiplexer, wherein the bias-T is connected to the single transmission line.

18. The method of claim 17 , wherein the multiplexing comprises:
passing signals at an IF frequency band of the IF signal via a high-pass filter (HPF);
passing signals at a LO frequency band of the LO signal via a base-pass filter (BPS) ; and
passing a signal at a control frequency band of the control signal via a low-pass filter (LPF), wherein the IF frequency band, the LO frequency band, and the control frequency band are set according to a frequency plan.

19. The method of claim 18 , wherein the frequency plan defines separation of

Assignees

• Qualcomm Inc

Inventors

• Yehezkely Alon
• Sasson Ori

Classifications

• H01P5/20

  Magic-T junctions · CPC title

• H04B7/24 Primary

  for communication between two or more posts (wireless communication networks H04W) · CPC title

• H01P3/06

  Coaxial lines · CPC title

• H04L25/026

  Arrangements for coupling transmitters, receivers or transceivers to transmission lines; Line drivers (duplexing arrangements H04L5/14) · CPC title