Magnetic sensor and method of manufacturing the same
US-2017294577-A1 · Oct 12, 2017 · US
US9496867B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9496867-B2 |
| Application number | US-201615041825-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 11, 2016 |
| Priority date | Oct 6, 2011 |
| Publication date | Nov 15, 2016 |
| Grant date | Nov 15, 2016 |
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Embodiments relate to Hall-controlled switch devices. In an embodiment, a Hall switch and a load switch are integrated in a single integrated circuit device. Embodiments can provide load switching and optional simultaneous logic signaling, for example to update a microcontroller or electronic control unit (ECU), while reducing space and complexity and thereby cost.
Opening claim text (preview).
What is claimed is: 1. A Hall-controlled device comprising: an integrated circuit package; Hall switch circuitry disposed in the integrated circuit package; load switch circuitry coupled to the Hall switch circuitry and disposed in the integrated circuit package; and a leadframe disposed in the integrated circuit package, wherein the Hall switch circuitry is arranged on a first, top side of the leadframe configured to face a magnetic field source and the load switch circuitry is arranged on a second, bottom side of the leadframe configured to face a circuit board or other mounting surface to which the leadframe is configured to attach opposing the first side. 2. The Hall-controlled device of claim 1 , further comprising a pull-up resistor coupled to the Hall switch circuitry and the load switch circuitry. 3. The Hall-controlled device of claim 2 , wherein the pull-up resistor is disposed in the package. 4. The Hall-controlled device of claim 1 , wherein the load switch circuitry comprises one of a transistor, an active power switch, an nMOS device, a pMOS device, a linear current source, or a switched current source. 5. The Hall-controlled device of claim 1 , wherein the Hall switch circuitry comprises a Hall probe. 6. The Hall-controlled device of claim 1 , wherein the load switch circuitry is configured to switch a load in a range of about 100 milliamps (mA) to about 50 A. 7. The Hall-controlled device of claim 6 , wherein the load switch circuitry is configured to switch a load in a range of about 100 mA to about 20 A. 8. The Hall-controlled device of claim 6 , wherein the load comprises a light or an LED. 9. The Hall-controlled device of claim 1 , wherein the Hall switch circuitry is configured to send a logic signal to a microcontroller. 10. The Hall-controlled device of claim 1 , further comprising at least one additional load switch circuitry coupled to the Hall switch circuitry and disposed in the package. 11. The Hall-controlled device of claim 1 , further comprising at least one of integrated load protection circuitry or integrated load diagnostics disposed in the package. 12. A method comprising: sensing a magnetic field by a Hall-effect sensor arranged on a first, top side of a leadframe disposed in a package, wherein the first, top side of the leadframe is configured to face a magnetic field source; sending a signal related to the magnetic field by the Hall-effect sensor to a load switch arranged on a second, bottom side of the leadframe disposed in the package, wherein the second, bottom side of the leadframe is configured to face a circuit board or other mounting surface to which the leadframe is configured to attach opposing the first side; and selectively switching a load by the load switch according to the signal from the Hall-effect sensor using the load switch. 13. The method of claim 12 , wherein sending a signal further comprises sending a signal related to the magnetic field by the sensor to a microcontroller. 14. The method of claim 12 , further comprising integrating a pull-up resistor in the package. 15. An integrated circuit comprising: Hall-effect switching circuitry comprising a Hall-effect element; load switching circuitry coupled to the Hall-effect switching circuitry; an integrated circuit package housing the Hall-effect switching circuitry and the load switching circuitry; and a leadframe disposed in the integrated circuit package, wherein the Hall-effect switching circuitry is arranged on a first, top side of the leadframe configured to face a magnetic field source and the load switching circuitry is arranged on a second, bottom side of the leadframe configured to face a circuit board or other mounting surface to which the leadframe is configured to attach opposing the first side. 16. The integrated circuit of claim 15 , further comprising a pull-up resistor housed in the package. 17. The integrated circuit of claim 15 , wherein the Hall-effect switching circuitry is configured to send a logic signal and a load-control signal in parallel. 18. A Hall-controlled device comprising: an integrated circuit package; Hall switch circuitry arranged in the integrated circuit package; load switch circuitry arranged in the integrated circuit package and coupled to the Hall switch circuitry; a back bias magnetic material coupled to the integrated circuit package; and a leadframe disposed in the integrated circuit package, wherein the Hall switch circuitry is arranged on a first, top side of the leadframe configured to face a magnetic field source and the load switch circuitry is arranged on a second, bottom side of the leadframe configured to face a circuit board or other mounting surface to which the leadframe is configured to attach opposing the first side. 19. The Hall-controlled device of claim 18 , wherein the back bias magnetic material is coupled to the integrated circuit package within the integrated circuit package.
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