Vibration module based on piezoelectric device

Patent metadata

Field	Value
Publication number	US-9496483-B2
Application number	US-201314012129-A
Country	US
Kind code	B2
Filing date	Aug 28, 2013
Priority date	Aug 22, 2013
Publication date	Nov 15, 2016
Grant date	Nov 15, 2016

Abstract

A vibration module based on a piezoelectric device includes: a piezoelectric device; a vibration plate connected to one side of the piezoelectric device by a medium of an adhesive and an intermediate material; the intermediate material interposed between the piezoelectric device and the vibration plate; and a molding part formed on the side of the piezoelectric device where the intermediate material is not formed.

First claim

What is claimed is:

1. A vibration module based on a piezoelectric device, comprising:
a piezoelectric device;
a vibration plate connected to a lower side of the piezoelectric device by a medium of an adhesive and an intermediate material;
the intermediate material interposed between the piezoelectric device and the vibration plate to absorb a shock transferred to the piezoelectric device, thereby enhancing durability of the vibration module;
a molding part formed on an upper side of the piezoelectric device which is opposite to the lower side of the piezoelectric device where the intermediate material is formed; and
a contact terminal disposed on the upper side of the piezoelectric device to electrically connect the piezoelectric device to an external element,
wherein the molding part is only formed on a part of the upper side of the piezoelectric device to absorb a shock transferred to the piezoelectric device and enhance vibration characteristics of the vibration module,
wherein the molding part of the upper side of the piezoelectric device corresponds to 20 to 40 percent of an area of the piezoelectric device,
wherein the contact terminal is surrounded by the molding part while the contact terminal is being electrically connected to the external element.

2. The vibration module according to claim 1 , wherein the intermediate material is made of one selected from among silicon, urethane, polymer and rubber.

3. The vibration module according to claim 1 , wherein the thickness of the intermediate material is in the range of 0.11 mm to 0.13 mm.

4. The vibration module according to claim 1 , wherein the thickness of the molding part is in the range of 0.5 mm to 0.8 nm.

5. The vibration module according to claim 1 , wherein the molding part is made of one selected from among silicon, urethane, polymer and rubber.

6. The vibration module according to claim 1 , wherein the adhesive is an epoxy-based adhesive with elastic modulus of less than 3000 Mpa.

Assignees

• Wisol Co Ltd

Inventors

• Choi Jae Hyung
• Noro Yukihiro
• Choi Yo Sep
• Noh Jung Rae

Classifications

• H01L41/0926 Primary

  Electricity · mapped topic

• H04R17/005

  using a piezoelectric polymer · CPC title

• H01L41/0933

  Electricity · mapped topic

• H10N30/2041

  Beam type · CPC title

• H10N30/204 Primary

  using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders · CPC title