Optoelectronic component and method for producing it

Patent metadata

Field	Value
Publication number	US-9496467-B2
Application number	US-201314403159-A
Country	US
Kind code	B2
Filing date	May 17, 2013
Priority date	May 21, 2012
Publication date	Nov 15, 2016
Grant date	Nov 15, 2016

Abstract

An optoelectronic component is specified. According to at least one embodiment of the invention, the optoelectronic component comprises a housing ( 20 ) and a radiation-emitting or radiation-receiving semiconductor chip ( 10 ) arranged in the housing ( 20 ). Furthermore, the component comprises an optical element ( 50 ), which contains a polymer material comprising a silicone. The silicone contains at least 40% by weight of cyclic siloxanes, and at least 40% of the silicon atoms of the cyclic siloxanes are crosslinked with a further silicon atom of the silicon via alkylene and/or alkylarylene groups.

First claim

The invention claimed is:

1. An optoelectronic component comprising:
a housing;
a radiation-emitting or radiation-receiving semiconductor chip disposed within the housing; and
an optical element containing a polymer material comprising a silicone,
wherein the silicone contains at least 40% by weight of cyclic siloxanes and at least 40% of the silicon atoms in the cyclic siloxanes are crosslinked via alkylene and/or alkylarylene groups to a further silicon atom in the silicone,
wherein the optical element is obtainable by curing a composition comprising a first cyclic siloxane represented by the formula II and a second cyclic siloxane represented by the formula III

where, in formula II or in formula III,
n is in each case independently selected from 1, 2, 3, 4 and 5,
R 1 is in each case independently selected from a group comprising alkyl, cycloalkyl and aryl, and
R 3 is in each case independently a substituent which is represented by the formula

with m=0 or 1 and X=C 1 -C 4 -alkylene or phenylene,
wherein the ratio of first cyclic siloxane to second cyclic siloxane in the composition is in the range from 2.5:1 to 4:1,
wherein the optical element is arranged in the radiation path of the semiconductor chip and over the semiconductor chip, and
wherein the optical element surrounds the semiconductor chip,
wherein the optical element is transparent to the radiation used in the component with a relative transmission of at least 80%, and
wherein the optical element comprises one or more converter materials for conversion of the radiation emitted by the semiconductor chip, which are embedded in the composition.

2. The component according to claim 1 ,
wherein at least 50% of the silicon atoms in the cyclic siloxanes are crosslinked via alkylene and/or alkylarylene groups to a further silicon atom in the silicone.

3. The component according to claim 1 ,
wherein the silicone contains at least 75% by weight of cyclic siloxanes.

4. The component according to claim 1 ,
wherein the cyclic siloxanes are represented by a structure of the formula I

where
n is selected from 1, 2, 3, 4 and 5,
R 1 is in each case independently selected from a group comprising alkyl, cycloalkyl and aryl,
R 2 is in each case independently selected from a group comprising alkylene and/or alkylarylene group, hydrogen atom, a substituent of the formula

with m=0 or 1 and X=C 1 -C 4 -alkylene or phenylene, and an attached heteroatom, and
where at least 40% of the R 2 substituents correspond to the alkylene and/or alkylarylene group, through which the R 2 -substituted silicon atom in the cyclic siloxane of the formula I is crosslinked to a further silicon atom in the silicone, and the alkylene and/or alkylarylene group in each case independently has a structure of the following formula

with m=0 or 1 and X=C 1 -C 4 -alkylene or phenylene.

5. The component according to claim 4 ,
wherein R 1 is each case independently selected from a group comprising C 1 -C 4 -alkyl, C 5 -C 6 -cycloalkyl and phenyl.

6. The component according to claim 4 ,
wherein at least 40% of the R 1 substituents are each independently selected from a group comprising C 5 -C 6 -cycloalkyl and phenyl.

7. The component according to claim 6 ,
wherein the refractive index n of the silicone is greater than or equal to 1.44.

8. The component according to claim 1 ,
wherein the optical element is an encapsulation which surrounds the semiconductor chip.

9. The component according to claim 1 ,
wherein the optical element comprises an inorganic filler embedded in the polymer material and selected from a group comprising thermally conductive particles, a diffuser, a converter material and a combination thereof.

10. The component according to claim 1 ,
wherein the optical element takes the form of a reflector and comprises a reflective filler.

11. The component according to claim 10 ,
wherein the housing has a recess in which the semiconductor chip is disposed, and the optical element lines at least part of the recess or forms at least part of the housing in the region of the recess.

12. A process for producing an optoelectronic component having an optical element, comprising the steps of:
A) providing a housing;
B) disposing a radiation-emitting or radiation-detecting semiconductor chip within the housing;
C) producing an optical element containing a polymer material comprising a silicone;
wherein the silicone contains at least 40% by weight of cyclic siloxanes and at least 40% of the silicon atoms in the cyclic siloxanes are crosslinked via alkylene and/or alkylarylene groups to a further silicon atom in the silicone,
wherein the optical element is produced in step C) by curing a composition comprising a first cyclic siloxane represented by the formula II and a second cyclic siloxane represented by the formula III

where, in formula II or in formula III,
n is in each case independently selected from 1, 2, 3, 4 and 5,
R 1 is in each case independently selected from a group comprising alkyl, cycloalkyl and aryl, and
R 3 is in each case independently a substituent which is represented by the formula

with m=0 or 1 and X=C 1 -C 4 -alkylene or phenylene,
wherein the ratio of first cyclic siloxane to second cyclic siloxane in the composition is in the range from 2.5:1 to 4:1,
wherein the optical element is arranged in the radiation path of the semiconductor chip and over the semiconductor chip, and
wherein the optical element surrounds the semiconductor chip,
wherein the optical element is transparent to the radiation used in the component with a relative transmission of at least 80%, and
wherein the optical element comprises one or more converter materials for conversion of the radiation emitted by the semiconductor chip, which are embedded in the composition.

Assignees

• Osram Opto Semiconductors Gmbh
• Osram Opto Semiconductors Gmbh

Inventors

• Schmidtke Kathy
• Kruppa Michael
• Braune Bert

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• Y10S362/80

  Light emitting diode · CPC title

• C07F7/08

  Compounds having one or more C—Si linkages · CPC title

• C07F7/21

  Cyclic compounds having at least one ring containing silicon, but no carbon in the ring · CPC title

• C08L83/04

  Polysiloxanes · CPC title