Semiconductor package including stacked semiconductor chips and a redistribution layer

Patent metadata

Field	Value
Publication number	US-9496216-B2
Application number	US-201213725132-A
Country	US
Kind code	B2
Filing date	Dec 21, 2012
Priority date	Dec 22, 2011
Publication date	Nov 15, 2016
Grant date	Nov 15, 2016

Abstract

Semiconductor packages including stacked semiconductor chips are provided. The semiconductor packages may include first semiconductor chips and a second semiconductor chip that are stacked sequentially on a board. The semiconductor packages may also include a wiring layer on the memory chips and the wiring layer may include redistribution patterns and redistribution pads. Each of the memory chips may include a data pad. The data pads of the first semiconductor chips may be electrically connected to the board via the second semiconductor chip, some of redistribution patterns, and some of redistribution pads.

First claim

What is claimed is:

1. A semiconductor package, comprising:
a plurality of first semiconductor chips comprising an uppermost first semiconductor chip on a board, the plurality of first semiconductor chips including respective ones of a plurality of data pads and respective ones of a plurality of power pads, and the plurality of data pads comprising a first data pad in the uppermost first semiconductor chip;
a wiring layer on the uppermost first semiconductor chip, the wiring layer including a redistribution pattern and a redistribution pad;
a second semiconductor chip on the uppermost first semiconductor chip, the second semiconductor chip being electrically connected to the redistribution pattern;
a plurality of first conductive connections between two of the plurality of data pads;
a second conductive connection between the uppermost first semiconductor chip and the second semiconductor chip;
a third conductive connection between the second semiconductor chip and the board,
wherein the redistribution pattern is between the second semiconductor chip and the board,
wherein the redistribution pad comprise:
a first redistribution pad between the first data pad in the uppermost first semiconductor chip and the second semiconductor chip;
a second redistribution pad electrically connected to the redistribution pattern; and
a third redistribution pad electrically connected to the redistribution pattern, the third redistribution pad contacting the third conductive connection,

wherein the second semiconductor chip is closer to the first redistribution pad than the third redistribution pad, and
wherein one of the plurality of data pads is electrically connected to the board via the first redistribution pad, the second conductive connection, the second semiconductor chip, the second redistribution pad, the redistribution pattern, the third redistribution pad and the third conductive connection, sequentially.

2. The semiconductor package of claim 1 , a center of the second semiconductor chip is closer to one of the plurality of data pads than one of the plurality of power pads.

3. A semiconductor package, comprising:
a plurality of first semiconductor chips comprising an uppermost first semiconductor chip on a board, the plurality of first semiconductor chips including respective ones of a plurality of data pads and respective ones of a plurality of power pads, and the plurality of data pads comprising a first data pad in the uppermost first semiconductor chip;
a wiring layer on the uppermost first semiconductor chip, the wiring layer including a redistribution pattern and a redistribution pad;
a second semiconductor chip on the uppermost first semiconductor chip, the second semiconductor chip being electrically connected to the redistribution pattern;
a plurality of first conductive connections between two of the plurality of data pads;
a second conductive connection between the uppermost first semiconductor chip and the second semiconductor chip;
a third conductive connection between the second semiconductor chip and the board,
wherein the redistribution pattern comprises a first redistribution pattern between the uppermost first semiconductor chip and the second semiconductor chip and a second redistribution pattern between the second semiconductor chip and the board,
wherein the first redistribution pattern does not overlaps with the second redistribution pattern and is shorter than the second redistribution pattern, and
wherein one of the plurality of data pads is electrically connected to the board via the first redistribution pattern, the second conductive connection, the second semiconductor chip, the second redistribution pattern, and the third conductive connection, sequentially.

4. The semiconductor package of claim 1 , wherein all of the plurality of data pads are electrically connected to the board via the second semiconductor chip.

5. The semiconductor package of claim 4 , wherein the board includes a board internal wiring, and the board internal wiring is connected to one of the plurality of power pads or the second semiconductor chip.

6. The semiconductor package of claim 4 , wherein the board is free of a wiring connecting one of the plurality of data pads and the second semiconductor chip.

7. The semiconductor package of claim 1 , wherein a ratio of a longer side to a shorter side of the second semiconductor chip is about 1.2 or less.

8. The semiconductor package of claim 1 , wherein one of the plurality of power pads is connected to the board without going through the second semiconductor chip.

9. The semiconductor package of claim 1 , further comprising:
a buffer chip electrically connected to the second semiconductor chip.

10. The semiconductor package of claim 9 , wherein the buffer chip is on the wiring layer.

11. The semiconductor package of claim 10 , wherein the redistribution pattern comprises:
a first redistribution pattern between the first data pad in the uppermost first semiconductor chip and the second semiconductor chip;
a second redistribution pattern between the second semiconductor chip and the board; and
a third redistribution pattern between the second semiconductor chip and the buffer chip, and
wherein the buffer chip is connected to the second semiconductor chip via the third redistribution pattern.

12. The semiconductor package of claim 1 , wherein the plurality of first semiconductor chips comprises:
a first chip stack including a first portion of the plurality of first semiconductor chips that are sequentially offset-aligned in a first direction; and
a second chip stack including a second portion of the plurality of first semiconductor chips that are sequentially offset-aligned in a second direction that is different from the first direction, the second chip stack being between the first chip stack and the board,
and the semiconductor package further comprising an intermediate wiring layer between the first chip stack and the second chip stack, wherein one of the plurality of first semiconductor chips in the second chip stack is electrically connected to the wiring layer via the intermediate wiring layer.

13. A semiconductor package, comprising:
a board including a board electrode;
a top chip on the board including a first top chip data pad and a second top chip data pad;
an intervening chip between the board and the top chip, the intervening chip including an intervening chip data pad that is electrically connected to the first top chip data pad;
a wiring layer on the intervening chip;
a first conductive connection between the intervening chip and the top chip; and
a second conductive connection between the top chip and the board,
wherein the wiring layer comprises:
a redistribution pattern;
a first redistribution pad between the intervening chip and the top chip;
a second redistribution pad electrically connected to the redistribution pattern; and
a third redistribution pad electrically connected to the redistribution pattern, the third redistribution pad contacting the second conductive connection,

wherein the top chip is closer to the first redistribution pad than the third redistribution pad, and
wherein the intervening chip data pad is electrically connected to the board via the first redistribution pad, the first conductive connection, the top chip, the second redistribution pad, the redistribution pattern, the third redistribution pad and the second conductive connection, sequentially.

14. The semiconductor package of claim 13 , wherein the intervening chip comprises a first intervening chip including a first intervening chip data pad th

Assignees

• Chun Sung-Hoon
• Kim Hye-Jin
• An Sang-Ho
• Kim Kyung-Man
• Lee Seok-Chan
• Samsung Electronics Co Ltd

Inventors

• Chun Sung-Hoon
• Kim Hye-Jin
• An Sang-Ho
• Kim Kyung-Man
• Lee Seok-Chan

Classifications

• H10W90/759

  between a chip and a laterally-adjacent discrete passive device · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W90/752

  between stacked chips · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title