Copper alloy for electric and electronic device, copper alloy sheet for electric and electronic device, conductive component for electric and electronic device, and terminal

Patent metadata

Field	Value
Publication number	US-9496064-B2
Application number	US-201314762324-A
Country	US
Kind code	B2
Filing date	Jun 28, 2013
Priority date	Jan 28, 2013
Publication date	Nov 15, 2016
Grant date	Nov 15, 2016

Abstract

A copper alloy for electric and electronic devices comprises 23 mass % to 36.5 mass % of Zn; 0.1 mass % to 0.9 mass % of Sn; 0.15 mass % to less than 1.0 mass % of Ni; 0.001 mass % to less than 0.10 mass % of Fe; 0.005 mass % to 0.1 mass % of P; and a balance including Cu and unavoidable impurities, in which 0.002≦Fe/Ni<0.7, 3<(Ni+Fe)/P<15, and 0.3<Sn/(Ni+Fe)<2.9, are satisfied by atomic ratio, and a fraction R{220} of the X-ray diffraction intensity from the {220} plane is 0.8 or less.

First claim

The invention claimed is:

1. A copper alloy for electric and electronic devices, the copper alloy comprising:
23 mass % to 36.5 mass % of Zn;
0.1 mass % to 0.9 mass % of Sn;
0.2 mass % to less than 1.0 mass % of Ni;
0.001 mass % to less than 0.10 mass % of Fe;
0.005 mass % to 0.1 mass % of P; and
a balance including Cu and unavoidable impurities,
wherein a ratio Fe/Ni of a Fe content to a Ni content satisfies 0.002≦Fe/Ni<0.7 by atomic ratio,
a ratio (Ni+Fe)/P of a total content (Ni+Fe) of Ni and Fe to a P content satisfies 3<(Ni+Fe)/P<15 by atomic ratio,
a ratio Sn/(Ni+Fe) of a Sn content to the total content (Ni+Fe) of Ni and Fe satisfies 0.3<Sn/(Ni+Fe)<2.9 by atomic ratio, and
R{220} is 0.8 or less, wherein an X-ray diffraction intensity from a {111} plane on a surface of the copper alloy is represented by I{111}, an X-ray diffraction intensity from a {200} plane on the surface of the copper alloy is represented by I{200}, an X-ray diffraction intensity from a {220} plane on the surface of the copper alloy is represented by I{220}, an X-ray diffraction intensity from a {311} plane on the surface of the copper alloy is represented by I{311}, and a fraction R{220} of the X-ray diffraction intensity from the {220} plane on the surface of the copper alloy is
R{ 220}= I{ 220}/( I{ 111}+ I{ 200}+ I{ 220}+ I{ 311}).

2. The copper alloy for electric and electronic devices according to claim 1 ,
wherein the R{220} is in a range of 0.3 to 0.8.

3. The copper alloy for electric and electronic devices according to claim 1 ,
wherein the copper alloy has mechanical properties including a 0.2% yield strength of 300 MPa or higher.

4. The copper alloy for electric and electronic devices according to claim 2 ,
wherein the copper alloy has mechanical properties including a 0.2% yield strength of 300 MPa or higher.

5. A copper alloy sheet for electric and electronic devices, comprising:
a sheet main body made of a rolled material formed of the copper alloy for electric and electronic devices according to claim 1 ,
wherein a thickness of the sheet main body is in a range of 0.05 mm to 1.0 mm.

6. A conductive component for electric and electronic devices comprising:
the copper alloy sheet for electric and electronic devices according to claim 5 .

7. A terminal comprising:
the copper alloy sheet for electric and electronic devices according to claim 5 .

8. The copper alloy sheet for electric and electronic devices according to claim 5 , further comprising:
a Sn-plated layer formed on a surface of the sheet main body.

9. A conductive component for electric and electronic devices comprising:
the copper alloy sheet for electric and electronic devices according to claim 8 .

10. A terminal comprising:
the copper alloy sheet for electric and electronic devices according to claim 8 .

11. A conductive component for electric and electronic devices comprising:
the copper alloy for electric and electronic devices according to claim 1 .

12. A terminal comprising:
the copper alloy for electric and electronic devices according to claim 1 .

13. A copper alloy for electric and electronic devices, comprising:
23 mass % to 36.5 mass % of Zn;
0.1 mass % to 0.9 mass % of Sn;
0.2 mass % to less than 1.0 mass % of Ni;
0.001 mass % to less than 0.10 mass % of Fe;
0.001 mass % to less than 0.1 mass % of Co;
0.005 mass % to 0.1 mass % of P; and
a balance including Cu and unavoidable impurities,
wherein a ratio (Fe+Co)/Ni of a total content of Fe and Co to a Ni content satisfies 0.002≦(Fe+Co)/Ni<0.7 by atomic ratio,
a ratio (Ni+Fe+Co)/P of a total content (Ni+Fe+Co) of Ni, Fe, and Co to a P content satisfies 3<(Ni+Fe+Co)/P<15 by atomic ratio,
a ratio Sn/(Ni+Fe+Co) of a Sn content to the total content (Ni+Fe+Co) of Ni, Fe, and Co satisfies 0.3<Sn/(Ni+Fe+Co)<2.9 by atomic ratio, and
R{220} is 0.8 or less, wherein an X-ray diffraction intensity from a {111} plane on a surface of the copper alloy is represented by I{111}, an X-ray diffraction intensity from a {200} plane on the surface of the copper alloy is represented by I{200}, an X-ray diffraction intensity from a {220} plane on the surface of the copper alloy is represented by I{220}, an X-ray diffraction intensity from a {311} plane on the surface of the copper alloy is represented by I{311}, and a fraction R{220} of the X-ray diffraction intensity from the {220} plane on the surface of the copper alloy is
R{ 220}= I{ 220}/( I{ 111}+ I{ 200}+ I{ 220}+ I{ 311}).

14. The copper alloy for electric and electronic devices according to claim 13 ,
wherein the R{220} is in a range of 0.3 to 0.8.

15. The copper alloy for electric and electronic devices according to claim 13 ,
wherein the copper alloy has mechanical properties including a 0.2% yield strength of 300 MPa or higher.

16. The copper alloy for electric and electronic devices according to claim 14 ,
wherein the copper alloy has mechanical properties including a 0.2% yield strength of 300 MPa or higher.

Assignees

• Mitsubishi Materials Corp
• Mitsubishi Shindo Kk

Inventors

• Maki Kazunari
• Mori Hiroyuki
• Yamashita Daiki

Classifications

• C22F1/00

  Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working (apparatus for mechanical working of metal B21, B23, B24) · CPC title

• C22C9/04 Primary

  with zinc as the next major constituent · CPC title

• Y10T428/12715

  Next to Group IB metal-base component · CPC title

• Y10T428/12

  All metal or with adjacent metals · CPC title

• H01B1/026 Primary

  Alloys based on copper · CPC title