Template and pattern forming method

Patent metadata

Field	Value
Publication number	US-9494858-B2
Application number	US-201514944845-A
Country	US
Kind code	B2
Filing date	Nov 18, 2015
Priority date	Sep 24, 2009
Publication date	Nov 15, 2016
Grant date	Nov 15, 2016

Abstract

A template for imprinting in which a pattern is transferred onto a first substrate applied curable resin thereon, including a second substrate having a surface to be contacted with the curable resin, a concave portion provided on the surface and corresponding to a pattern to be transferred onto the first substrate, and at least one convex portion arranged in the concave portion to decrease volume of the concave portion.

First claim

What is claimed is:

1. A pattern forming method comprising:
applying a curable resin on a substrate;
contacting the curable resin with a template which is used for imprinting in which a pattern is transferred onto the curable resin applied on the substrate, the pattern comprising a large pattern of a pad, a dummy pattern or a mark, and a fine pattern smaller than the large pattern, the fine pattern being connected to the large pattern, the template further comprising:
a first convex portion configured to surround an area of a surface of the template, the area and the first convex portion defining a concave portion, a contour of the concave portion corresponding to a contour of the pattern to be transferred onto the curable resin; and
a plurality of second convex portions arranged in the concave portion, the second convex portions being arranged in first and second directions, the second direction being nonparallel to the first direction;

curing the curable resin;
separating the template from the cured curable resin to form the pattern of the cured curable resin; and
transferring the pattern of the cured curable resin to the substrate.

2. The method according to claim 1 , wherein the concave portion comprises:
a first concave portion corresponding to the large pattern; and
a second concave portion corresponding to the fine pattern, wherein intervals of the plurality of second convex portions are smaller than a width of the second convex portion.

3. The method according to claim 1 , wherein the concave portion comprises:
a first concave portion corresponding to the large pattern; and
a second concave portion corresponding to the fine pattern.

4. The method according to claim 1 , wherein the concave portion comprises;
a first concave portion corresponding to the large pattern; and
a second concave portion corresponding to the fine pattern, the second concave portion being outside of the first concave portion.

5. The method according to claim 1 , wherein the plurality of second convex portions arranged in the first direction and a first extracting wiring pattern is formed on a same line.

6. The method according to claim 1 , wherein the plurality of second convex portions are not formed in a concave portion of the fine pattern.

7. The method according to claim 1 , wherein intervals of the plurality of second convex portions are smaller than a width of the second portion.

8. The method according to claim 1 , wherein the concave portion is not divided into closed areas by the plurality of second convex portions.

9. A pattern forming method comprising:
applying a curable resin on a substrate;
contacting the curable resin with a template which is used for imprinting in which a pattern is transferred onto the curable resin applied on the substrate, the pattern comprising a large pattern and a fine pattern smaller than the large pattern, the fine pattern being connected to the large pattern, the template further comprising:
a first convex portion configured to surround an area of a surface of the template, the area and the first convex portion defining a concave portion, a contour of the concave portion corresponding to a contour of the pattern to be transferred onto the curable resin; and
a plurality of second convex portions arranged in the concave portion, the second convex portions being arranged in first and second directions, the second direction being nonparallel to the first direction, the concave portion not being divided into closed areas by the plurality of second convex portions curing the curable resin;

separating the template from the cured curable resin to form the pattern of the cured curable resin; and
transferring the pattern of the cured curable resin to the substrate.

10. The method according to claim 9 , wherein the concave portion comprises:
a first concave portion corresponding to the large pattern; and
a second concave portion corresponding to the fine pattern, wherein intervals of the plurality of second convex portions are smaller than a width of the second convex portions.

11. The method according to claim 9 , wherein the concave portion comprises:
a first concave portion corresponding to the large pattern; and
a second concave portion corresponding to the fine pattern.

12. The method according to claim 9 , wherein the concave portion comprises;
a first concave portion corresponding to the large pattern; and
a second concave portion corresponding to the fine pattern, the second concave portion being outside of the first concave portion.

13. The method according to claim 9 , wherein the plurality of second convex portions arranged in the first direction and a first extracting wiring pattern is formed on a same line.

14. The method according to claim 9 , wherein the plurality of second convex portions are not formed in a concave portion of the fine pattern.

15. The method according to claim 9 , wherein intervals of the plurality of second convex portions are smaller than a width of the second portion.

16. The method according to claim 9 , wherein the concave portion is not divided into closed areas by the plurality of second convex portions.

Assignees

• Toshiba Kk

Inventors

• Kikuchi Yukiko
• Ito Shinichi

Classifications

• H10P76/4088

  Processes for improving the resolution of the masks · CPC title

• H10P76/4085

  characterised by the processes involved to create the masks · CPC title

• H10W72/951

  Materials of bond pads · CPC title

• H10W46/00

  Marks applied to devices, e.g. for alignment or identification · CPC title

• H10W42/00

  Arrangements for protection of devices (arrangements for thermal protection H10W40/00) · CPC title