Integrated circuit package having a split lead frame

Patent metadata

Field	Value
Publication number	US-9494660-B2
Application number	US-201313749776-A
Country	US
Kind code	B2
Filing date	Jan 25, 2013
Priority date	Mar 20, 2012
Publication date	Nov 15, 2016
Grant date	Nov 15, 2016

Abstract

A magnetic field sensor includes a lead frame having a plurality of leads, at least two of which have a connection portion and a die attach portion. A semiconductor die is attached to the die attach portion of the at least two leads. In some embodiments, at least one passive component is attached to the die attach portion of at least two leads.

First claim

What is claimed is:

1. A magnetic field sensor comprising:
a lead frame having a first surface, a second opposing surface, and comprising a plurality of leads, wherein at least two of the plurality of leads are electrically isolated from each other and wherein each of the at least two leads has an elongated connection portion extending from a die attach portion;
a semiconductor die supporting a magnetic field sensing element and attached to the die attach portions of the at least two leads;
a passive component coupled between the die attach portions of the at least two leads; and
a non-conductive adhesive between the semiconductor die and the die attach portions of the at least two leads.

2. The magnetic field sensor of claim 1 further comprising a non-conductive mold material enclosing the semiconductor die and the die attach portions of the at least two leads.

3. The magnetic field sensor of claim 2 further comprising a ferromagnetic mold material secured to a portion of the non-conductive mold material.

4. The magnetic field sensor of claim 1 wherein the passive component is a capacitor.

5. The magnetic field sensor of claim 1 further comprising at least two passive components, each coupled between a respective pair of die attach portions.

6. The magnetic field sensor of claim 1 further comprising a second passive component coupled to the connection portion of the at least two leads.

7. The magnetic field sensor of claim 1 wherein the connection portion of at least one of the at least two leads has a widened portion extending away from another one of the at least two leads.

8. The magnetic field sensor of claim 1 further comprising a wire bond coupled between the semiconductor die and a location of the die attach portion of at least one of the at least two leads distal from the connection portion of the at least one lead.

9. The magnetic field sensor of claim 1 further comprising a wire bond coupled between the semiconductor die and a location of the die attach portion of at least one of the at least two leads proximate to the connection portion of the at least one lead.

10. The magnetic field sensor of claim 1 wherein at least one of the plurality of leads has a first portion that is separated from a second portion of the lead and wherein the magnetic field sensor further comprises a passive component coupled between the first portion and second portion of the at least one lead.

11. The magnetic field sensor of claim 10 wherein the passive component is a resistor.

12. The magnetic field sensor of claim 10 wherein the semiconductor die is attached to the first portion of the at least one lead and is not attached to the second portion of the at least one lead.

13. The magnetic field sensor of claim 1 wherein the die attach portion of at least one of the at least two leads comprises at least one slot.

14. The magnetic field sensor of claim 1 further comprising a ferromagnetic mold material secured to the elongated connection portion of at least one of the plurality of leads.

15. The magnetic field sensor of claim 1 further comprising a ferromagnetic bead secured to the connection portion of at least one of the plurality of leads.

16. The magnetic field sensor of claim 1 wherein the semiconductor die has a first surface in which the magnetic field sensing element is disposed and a second, opposing surface and wherein the second, opposing surface is attached to the die attach portions of the at least two leads.

17. A magnetic field sensor comprising:
a lead frame having a first surface, a second opposing surface, and comprising a plurality of leads, wherein at least two of the plurality of leads are electrically isolated from each other and wherein each of the at least two leads has an elongated connection portion extending from a die attach portion;
a semiconductor die supporting a magnetic field sensing element and attached to the die attach portions of the at least two leads;
a passive component coupled between the die attach portions of the at least two leads; and
a non-conductive mold material enclosing the semiconductor die and the die attach portions of the at least two leads, wherein the non-conductive mold material has a diameter of less than approximately 7.0 mm.

18. The magnetic field sensor of claim 17 wherein the passive component is a capacitor.

19. A magnetic field sensor comprising:
a lead frame comprising a plurality of leads, wherein at least two of the plurality of leads are electrically isolated from each other and wherein each of the at least two leads has an elongated connection portion extending from a die attach portion;
a semiconductor die supporting a magnetic field sensing element and attached to the die attach portions of the at least two leads;
a non-conductive adhesive between the semiconductor die and the die attach portions of the at least two leads;
at least one passive component coupled between the die attach portions of the at least two leads;
a non-conductive mold material enclosing the semiconductor die, the passive component, and the die attach portions of the at least two leads; and
a ferromagnetic mold material secured to a portion of the non-conductive mold material.

20. The magnetic field sensor of claim 19 wherein the at least one passive component is a capacitor.

21. The magnetic field sensor of claim 19 further comprising at least two passive components, each coupled between a respective pair of die attach portions.

22. The magnetic field sensor of claim 19 further comprising at least one passive component coupled to the connection portion of the at least two leads.

23. The magnetic field sensor of claim 19 wherein the connection portion of at least one of the at least two leads has a widened portion extending away from another one of the at least two leads.

24. The magnetic field sensor of claim 19 further comprising a wire bond coupled between the semiconductor die and a location of the die attach portion of at least one of the at least two leads distal from the connection portion of the at least one lead.

25. The magnetic field sensor of claim 19 further comprising a wire bond coupled between the semiconductor die and a location of the die attach portion of at least one of the at least two leads proximate to the connection portion of the at least one lead.

26. The magnetic field sensor of claim 19 wherein at least one of the plurality of leads has a first portion that is separated from a second portion of the lead and wherein the magnetic field sensor further comprises at least one passive component coupled between the first portion and second portion of the at least one lead.

27. The magnetic field sensor of claim 26 wherein the at least one passive component is a resistor.

28. The magnetic field sensor of claim 19 wherein the die attach portion of at least one of the at least two leads comprises at least one slot.

29. The magnetic field sensor of claim 19 further comprising a ferromagnetic mold material secured to the elongated connection portion of at least one of the plurality of leads.

30. The magnetic field sensor of claim 19 further comprising a ferromagnetic bead secured to the connection portion of at least one of the plurality of leads.

Assignees

• Allegro Microsystems Llc

Inventors

• David Paul
• Taylor William P
• Scheller P Karl
• Vig Ravi
• Friedrich Andreas P

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/726

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W70/481

  for devices being provided for in groups H10D8/00 - H10D48/00 · CPC title