Image sensor testing probe card

Patent metadata

Field	Value
Publication number	US-9494617-B2
Application number	US-201313787472-A
Country	US
Kind code	B2
Filing date	Mar 6, 2013
Priority date	Nov 7, 2012
Publication date	Nov 15, 2016
Grant date	Nov 15, 2016

Abstract

A probe card for use in testing a wafer and a method of making the probe card include a printed circuit board (PCB) formed with a conductor pattern and a probe head in proximity to the PCB, the probe head defining at least one hole through the probe head, and the probe head being made of an electrically insulating material. At least one conductive pogo pin is disposed respectively in the at least one hole, the pogo pin having a first end electrically connected to the conductor pattern on the PCB. At least one conductive probe pin includes a cantilever portion and a tip portion. The cantilever portion is in contact with and electrically connected to a second end of the pogo pin, and the tip portion is electrically connectable to the wafer to electrically connect the wafer to the conductor pattern on the PCB. The cantilever portion of the probe pin is fixedly attached to the probe head.

First claim

We claim:

1. A probe card for use in testing a wafer, comprising:
a printed circuit board (PCB) having a conductor pattern;
a probe head in proximity to the PCB, the probe head defining at least one hole through the probe head, the probe head being made of an electrically insulating material;
at least one conductive pogo pin disposed respectively in the at least one hole, the pogo pin having a first end electrically connected to the conductor pattern on the PCB; and
at least one conductive probe pin comprising a cantilever portion and a tip portion, the cantilever portion being electrically connected and removably adjoined to a second end of the pogo pin and the tip portion being electrically connectable to the wafer to electrically connect the wafer to the conductor pattern on the PCB, the cantilever portion of the probe pin being fixedly attached to the probe head,
the at least one hole spanning a top surface of the probe head proximate the PCB and a bottom surface of the probe head opposite the top surface,
the at least one conductive probe pin being entirely outside the at least one hole,
the second end of the pogo pin and the cantilever portion forming a non-zero angle at an interface therebetween.

2. The probe card of claim 1 , the contact and electrical connection between the pogo pin and the conductive probe pin being at a first location on the cantilever portion, a second location of the cantilever portion of the probe pin being fixedly attached to the probe head by epoxy disposed between and in contact with the cantilever portion of the probe pin and the probe head, the second location being between the first location and the tip portion.

3. The probe card of claim 1 , wherein the electrically insulating material of the probe head is a ceramic material.

4. The probe card of claim 1 , further comprising a spacer in proximity to the probe head, the spacer mechanically reinforcing the probe head.

5. The probe card of claim 4 , wherein the spacer is made of a metallic material.

6. The probe card of claim 4 , wherein the spacer is made of stainless steel.

7. The probe card of claim 4 , wherein the probe head comprises a main body portion and a panhandle portion, the main body portion and the panhandle portion forming an L-shape, the spacer being disposed under the panhandle portion.

8. The probe card of claim 4 , wherein the probe head is horizontally adjacent to and fixedly attached to an end of the spacer.

9. The probe card of claim 1 , wherein the second end of the pogo pin comprises a notch that receives the cantilever portion of the probe pin.

10. The probe card of claim 1 , wherein the probe card is mountable to a stiffener frame for mechanical reinforcement of the probe card.

11. The probe card of claim 1 , further comprising a lens for focusing light passing through the probe card.

12. The probe card of claim 1 , further comprising an optical diffuser for diffusing light passing through the probe card.

13. The probe card of claim 1 , the at least one conductive pogo pin including a first spring, the second end having one of (i) a second spring, and (ii) a notch, configured to engage the cantilever portion of the at least one conductive probe pin.

14. The probe card of claim 1 , any portion of conductive probe pin being beneath at least one of (a) the probe head bottom surface and (b) an aperture in the probe head.

Assignees

• Omnivision Tech Inc

Inventors

• Lin Shih-Duen
• Ho Wen-Jen
• Jen Chih-Pin
• Lin Wei-Feng
• Hsieh Yi-Chang

Classifications

• G01R3/00

  Apparatus or processes specially adapted for the manufacture {or maintenance} of measuring instruments {, e.g. of probe tips} · CPC title

• G01R1/07342

  the body of the probe being at an angle other than perpendicular to test object, e.g. probe card · CPC title

• Y10T29/49165

  by forming conductive walled aperture in base · CPC title

• G01R1/07378 Primary

  using an intermediate adapter, e.g. space transformers (G01R1/07371 takes precedence) · CPC title

• G01R1/07364 Primary

  with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch · CPC title