Chemical dispense system with reduced contamination

Patent metadata

Field	Value
Publication number	US-9494261-B2
Application number	US-201313764597-A
Country	US
Kind code	B2
Filing date	Feb 11, 2013
Priority date	Feb 11, 2013
Publication date	Nov 15, 2016
Grant date	Nov 15, 2016

Abstract

An apparatus includes a production tool and a pipe connected to the production tool. The pipe includes an inner pipe formed of a metal-free material, an outer pipe encircling the inner pipe, and an inlet connected to a channel between the inner pipe and the outer pipe. The apparatus further includes a chemical supply system connected to the pipe. The chemical supply system is configured to supply a chemical through a channel encircled by the inner pipe to the production tool.

First claim

What is claimed is:

1. An apparatus comprising:
a production tool configured to manufacture integrated circuits;
a pipe connected to the production tool, wherein the pipe comprises:
an inner pipe with a first channel therein, wherein the inner pipe is formed of a metal-free material;
a first metal layer coated on an outer surface of the inner pipe;
an outer pipe comprising a dielectric material encircling the inner pipe;
a second metal layer coated on an inner surface of the outer pipe, wherein the first metal layer and the second metal layer are electrically grounded;
an electrical conductive fluid in a second channel between the inner pipe and the outer pipe, wherein the electrical conductive fluid is configured to sufficiently conduct electrical charges on the inner pipe away from the inner pipe; and
an inlet connected to the second channel; and

a chemical supply system connected to the pipe, wherein the chemical supply system is configured to supply a chemical through the first channel while the electrical conductive fluid is in the second channel.

2. The apparatus of claim 1 , wherein the electrical conductive fluid comprises wet nitrogen comprising water vapor and nitrogen gas.

3. The apparatus of claim 2 , wherein the electrical conductive fluid is electrically grounded.

4. The apparatus of claim 1 further comprising a metal line placed in the second channel and electrically grounded.

5. The apparatus of claim 1 , wherein, the electrical conductive fluid is configured to dissolve and conduct the chemical leaked from the inner pipe away from the second channel when the chemical is supplied through the first channel.

6. The apparatus of claim 1 , wherein the chemical supply system comprises:
a first chemical storage configured to store a first chemical;
a second chemical storage configured to store a second chemical;
a mixer connected to the first chemical storage and the second chemical storage, wherein the mixer is configured to mix the first chemical and the second chemical, thereby forming the chemical supplied to the first channel;
wherein the apparatus further comprises:
a first pump proximate a first end of the outer pipe and connected to the mixer, wherein the first pump is configured to pump the chemical from the mixer into the first channel.

7. The apparatus of claim 6 , wherein the inlet is disposed proximate the first end of the outer pipe, wherein the apparatus further comprises a second pump connected between the outer pipe and the inlet, wherein the second pump is configured to pump the electrical conductive fluid supplied at the inlet into the second channel of the pipe.

8. The apparatus of claim 7 , wherein a second end of the outer pipe is disposed proximate the production tool, wherein the apparatus further comprises an outlet proximate the second end of the outer pipe, wherein the outlet is configured to discharge the electrical conductive fluid out of the second channel.

9. The apparatus of claim 8 , wherein the second channel comprises a continuous channel between the first end of the outer pipe and the second end of the outer pipe.

10. An apparatus comprising:
a production tool configured to manufacture integrated circuits;
a pipe connected to the production tool, wherein the pipe comprises:
an inner pipe, wherein the inner pipe is formed of a metal-free dielectric material, with a first channel in the inner pipe and a first conductive coating on an outer surface of the inner pipe, wherein the first conductive coating is electrically grounded;
an outer pipe encircling the inner pipe, with a second channel between the inner pipe and the outer pipe, wherein the outer pipe is electrically grounded; and
an electrical conductive fluid in the second channel, wherein the electrical conductive fluid comprises wet nitrogen comprising water vapor and nitrogen gas; and

a chemical supply system connected to the pipe, wherein the chemical supply system is configured to supply a chemical to the production tool through the first channel while the electrical conductive fluid is in the second channel.

11. The apparatus of claim 10 , wherein the outer pipe comprises a dielectric material, and has a second conductive coating coated on an inner surface of the outer pipe, wherein the second conductive coating is electrically grounded.

12. The apparatus of claim 10 , wherein the inner pipe comprises a dielectric material, with an inner surface of the inner pipe being a surface of the dielectric material, and wherein the outer pipe is metal.

13. The apparatus of claim 10 , wherein the inner pipe comprises a material selected from the group consisting of Polytetrafluoroethylene (PTFE), Non-Explosion Perfluoroalkoxy (NE-PFA), and Anti-Static Perfluoroalkoxy (AS-PFA), and wherein the outer pipe comprises a material selected from the group consisting of stainless steel, copper, and aluminum.

14. The apparatus of claim 13 , wherein a first thickness of the inner pipe is in a range between about 1 mm and about 4 mm, and a second thickness of the outer pipe is in a range between about 1 mm and about 4 mm.

15. The apparatus of claim 10 , wherein the second channel comprises a continuous conduit for the electrical conductive fluid between a first end of the outer pipe proximate the chemical supply system and a second end of the outer pipe proximate the production tool.

16. A method comprising:
supplying a chemical to a production tool through a pipe connected to the production tool, wherein the production tool is configured to manufacture integrated circuits, and wherein the pipe comprises:
an inner pipe, wherein the inner pipe is formed of a first dielectric material, wherein an outer surface of the inner pipe is coated with a first conductive coating that is electrically grounded, and wherein the chemical flows in the inner pipe; and
an outer pipe formed of a second dielectric material encircling the inner pipe, wherein an inner surface of the outer pipe is coated with a second conductive coating that is electrically grounded; and

dispensing a conductive fluid into a channel between the inner pipe and the outer pipe during the supplying the chemical.

17. The method of claim 16 further comprising, at a time the chemical flows in the inner pipe:
injecting the conductive fluid into the channel between the inner pipe and the outer pipe through an inlet of the pipe; and
retrieving the conductive fluid out of the channel between the inner pipe and the outer pipe through an outlet of the pipe.

18. The method of claim 16 , wherein the conductive fluid comprises wet nitrogen or ionized water.

19. The method of claim 16 further comprising conducting charges in the conductive fluid to an electrical ground through a metal line placed in the channel between the inner pipe and the outer pipe.

20. The method of claim 16 , wherein the conductive fluid is dispensed into and conducted away from the channel during the supplying the chemical, with the conductive fluid configured to dissolve the chemical.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Pan Rong-Shyan
• Chen Yung-Long
• Tzeng Heng-Yi
• Ku Shao-Yen
• Tseng Chih-Chiang

Classifications

• Y10T137/5762

  With leakage or drip collecting · CPC title

• F16L9/18 Primary

  Double-walled pipes; Multi-channel pipes or pipe assemblies · CPC title

• F17D5/02

  Preventing, monitoring, or locating loss · CPC title

• Y10T137/87153

  Plural noncommunicating flow paths · CPC title

• Y10T137/0318

  Processes · CPC title