Method of manufacturing plate-shaped bonded body, bonding device, and plate-shaped bonded body

US9492954B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9492954-B2
Application numberUS-201113824828-A
CountryUS
Kind codeB2
Filing dateDec 19, 2011
Priority dateDec 22, 2010
Publication dateNov 15, 2016
Grant dateNov 15, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for quickly applying and spreading adhesive between substrates without leaving air bubbles. The method includes holding two substrates apart from each other with adhesive sides facing, a second substrate being positioned above a first substrate. The second substrate is suspended in a manner so as to cause a portion to warp towards the first substrate. After a liquid filler is applied between the two substrates, rollers are lowered onto the second substrate and moved so as to disperse the liquid filler between the first and second substrates. In accordance with the rolling of the rollers, end portions of the second substrate are lowered towards the first substrate.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of manufacturing a plate-shaped bonded body, comprising: a holding step in which respective adhesive surfaces of a first substrate and a second substrate are made to face each other and in which the adhesive surface of the second substrate is held above the first substrate while the adhesive surface of the second substrate warps towards the first substrate; a discharging step in which, while the second substrate is warped towards the first substrate, a dispensing nozzle is inserted from an inserting end side of the first and second substrates into a most approximate position of the first substrate and a curve top portion of the second substrate and in which a liquid filler is discharged from the dispensing nozzle while moving the nozzle back along the most approximate position from one end side hi the width direction of the first and second substrates to the inserting end side to adhere the liquid filler to the first substrate and the second substrate along the most approximate position for at least most of the width of the first and second substrates; and a filling step in which pressing members are disposed on the second substrate at a position corresponding to the most approximate position and in which the liquid filler is fit and spread between the first and second substrates by making the pressing members move on the second substrate, wherein the second substrate is held in parallel to the first substrate in accordance with moving positions of the pressing members. 2. The method of manufacturing a plate-shaped bonded body as claimed in claim 1 , wherein the pressing members are laminating rollers that roll on the second substrate. 3. The method of manufacturing a plate-shaped bonded body as claimed in claim 2 , wherein the filling step comprises: a first filling step in which a first said laminating roller is disposed on the second substrate at the position corresponding to the most approximate position and in which the liquid filler is fit and spread towards one end side in the length direction of the first and second substrates by rolling the first said laminating roller to the one end side in the length direction of the second substrate, and a second filling step in which a second said laminating roller is disposed on the second substrate at the position corresponding to the most approximate position following the first said laminating roller and in which the liquid filler is fit and spread towards the other end side in the length direction of the first and second substrates by rolling the second said laminating roller to the other end side in the length direction of the second substrate. 4. The method of manufacturing a plate-shaped bonded body as claimed in claim 1 , wherein held end portions of the second substrate are descended towards the first substrate in accordance with movements of the pressing members. 5. The method of manufacturing a plate-shaped bonded body as claimed in claim 1 , wherein in the holding step, the second substrate is warped through its own weight by being held at least at a portion of its outer peripheral edge. 6. The method of manufacturing a plate-shaped bonded body as claimed in claim 1 , wherein: prior to the holding step, the liquid filler is preliminarily applied on the first substrate in the form of lines over the moving direction of the pressing members; the discharging step follows the holding step; and the liquid filler discharged in the discharging step along the most approximate position crosses the preliminarily applied liquid filler. 7. The method of manufacturing a plate-shaped bonded body as claimed in claim 1 , wherein: the first substrate is a polarizing plate that comprises a display surface of a liquid crystal display panel, the second substrate is a glass plate that protects the display surface of the liquid crystal display panel, and the liquid filler is a transparent resin that bonds the polarizing plate and the glass plate.

Assignees

Inventors

Classifications

  • Progressively making the joint, e.g. starting from the middle (B29C66/8341, B29C65/12, B29C65/14, B29C65/16 take precedence) · CPC title

  • Preventing air-inclusions · CPC title

  • characterised by the pressing technique, e.g. using action of vacuum or fluid pressure · CPC title

  • by applying the adhesive from an outlet device in contact with, or almost in contact with, the surface of the part to be joined · CPC title

  • selectively, e.g. in stripes, in patterns (B32B37/0076 takes precedence) · CPC title

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Frequently asked questions

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What does patent US9492954B2 cover?
A method for quickly applying and spreading adhesive between substrates without leaving air bubbles. The method includes holding two substrates apart from each other with adhesive sides facing, a second substrate being positioned above a first substrate. The second substrate is suspended in a manner so as to cause a portion to warp towards the first substrate. After a liquid filler is applied b…
Who is the assignee on this patent?
Ogawa Kouichi, Shinya Yoshihisa, Toyoda Tomoyuki, and 2 more
What technology area does this patent fall under?
Primary CPC classification B29C43/28. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 15 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).