Conductive resin composition, method for manufacturing electronic component using same, bonding method, bonding structure, and electronic component

Patent metadata

Field	Value
Publication number	US-9491868-B2
Application number	US-201113206693-A
Country	US
Kind code	B2
Filing date	Aug 10, 2011
Priority date	Feb 16, 2009
Publication date	Nov 8, 2016
Grant date	Nov 8, 2016

Abstract

A conductive resin composition which includes (a) a curable resin and (b) hard spherical carbon formed by coating the surface of a spherical base carbon particle with fine carbon particles and/or pitch-derived fine carbon pieces is used to electrically bond two conductive elements. The conductive resin composition is supplied to a space between areas of at least two works respectively having the areas to be electrically connected to each other, and the conductive resin composition is cured while applying a pressure between the areas.

First claim

The invention claimed is:

1. A bonding structure bonding one conductor to the other conductor so as to be electrically connected, comprising a pair of conductors with a cured conductive resin composition comprising (a) a cured resin and (b) hard spherical carbon having an average particle diameter of 10 μm or less, the hard spherical carbon itself having a compression strength of 200 MPa or more, and the hard spherical carbon comprising solid spherical carbon particles whose surface is coated with fine carbon particles or pitch-derived fine carbon pieces or both interposed between the conductors, wherein the hard spherical carbon in the conductive resin composition is hard amorphous carbon and has a higher hardness than either member of the pair of conductors, and wherein a part of the solid spherical carbon particles and the fine carbon on the surface of the solid spherical carbon particles are incorporated into a surface of both conductors.

2. A bonding structure according to claim 1 , wherein at least one of the conductors is an electrode disposed on a piezoelectric.

3. The bonding structure according to claim 1 , wherein the primary particle diameter of the fine carbon particles and pitch-derived fine carbon pieces is 0.1 μm or less, and the content of the fine carbon particles and pitch-derived fine carbon pieces is 1 to 40% by weight of the hard spherical carbon.

4. The bonding structure according to claim 1 , wherein the spherical carbon particle surface is coated with fine carbon particles.

5. The bonding structure according to claim 1 , wherein the spherical carbon particle surface is coated with pitch-derived fine carbon pieces.

6. A bonding structure according to claim 1 , wherein the content of the hard spherical carbon in the composition is 0.5 to 20% by weight.

7. The bonding structure according to claim 6 , wherein the primary particle diameter of the fine carbon particles and pitch-derived fine carbon pieces is 0.1 μm or less.

8. The bonding structure according to claim 7 , wherein the fine carbon particles and pitch-derived fine carbon pieces are 1 to 40% by weight of the hard spherical carbon.

9. The bonding structure according to claim 8 , wherein the spherical carbon particle surface is coated with fine carbon particles.

10. The bonding structure according to claim 8 , wherein the spherical carbon particle surface is coated with pitch-derived fine carbon pieces.

Assignees

• Onoue Tomoaki
• Hirayama Masaaki
• Aburatani Yoshiki
• Murata Manufacturing Co

Inventors

• Onoue Tomoaki
• Hirayama Masaaki
• Aburatani Yoshiki

Classifications

• H01R4/58

  characterised by the form or material of the contacting members (H01R4/01 takes precedence) · CPC title

• H05K2201/023

  Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode · CPC title

• H05K2201/0218

  Composite particles, i.e. first metal coated with second metal · CPC title

• H01B1/24

  the conductive material comprising carbon-silicon compounds, carbon or silicon · CPC title

• H05K2201/0323

  Carbon · CPC title