Electronic component mounting apparatus and electronic component mounting method

Patent metadata

Field	Value
Publication number	US-9491411-B2
Application number	US-201313950531-A
Country	US
Kind code	B2
Filing date	Jul 25, 2013
Priority date	Jul 25, 2013
Publication date	Nov 8, 2016
Grant date	Nov 8, 2016

Abstract

A control unit of an electronic component mounting apparatus controls a component imaging unit so as to move an electronic component that is held by the holding unit, when the holding unit is moved in a direction, which is oblique to a conveyance direction of a substrate and is close to the substrate, by a movement mechanism unit.

First claim

What is claimed is:

1. An electronic component mounting apparatus comprising:
a substrate conveyance mechanism unit configured to convey a substrate with an electronic component mounted thereon in a first direction;
a component supply unit configured to supply the electronic component;
a holding unit configured to hold the electronic component supplied from the component supply unit;
a movement mechanism unit configured to move the holding unit;
a component imaging unit configured to image the electronic component that is held by the holding unit;
a control unit configured to control an imaging form of the electronic components by the component imaging unit; and
a component recognition unit configured to recognize the electronic component based on an image that is imaged by the component imaging unit,
wherein the component imaging unit has an area camera that includes at least one imaging element, and
the control unit controls the component imaging unit so as to image the electronic component that is held by the holding unit, when the holding unit is moved in a direction oblique to the first direction and close to the substrate by the movement mechanism unit.

2. The electronic component mounting apparatus according to claim 1 , wherein the control unit controls the component imaging unit so as to image the electronic component held by the holding unit while the holding unit is moved at a constant speed.

3. The electronic component mounting apparatus according to claim 1 ,
wherein the component imaging unit has a component lighting unit that lights the electronic component that is held by the holding unit during imaging, and
when the holding unit holds a first electronic component and a second electronic component of different kinds, the control unit delays imaging timing of the first electronic component by the imaging element and imaging timing of the second electronic component by the imaging element, respectively, and changes the lighting form due to the component lighting unit at each imaging timing.

4. An electronic component mounting apparatus comprising:
a substrate conveyance mechanism unit configured to convey a substrate with an electronic component mounted thereon in a first direction;
a component supply unit configured to supply the electronic component;
a holding unit configured to hold the electronic component supplied from the component supply unit;
a movement mechanism unit configured to move the holding unit;
a component imaging unit configured to image the electronic component that is held by the holding unit;
a control unit configured to control an imaging form of the electronic component by the component imaging unit; and
a component recognition unit configured to recognize the electronic component based on an image that is imaged by the component imaging unit,
wherein the component imaging unit has at least three area cameras that include at least one imaging element, and visual fields of the imaging element are common to each other regardless of the area camera, and
the control unit controls the component imaging unit so as to image the electronic component that is held by the holding unit, when the holding unit is moved in a direction oblique to the first direction and close to the substrate by the movement mechanism unit.

5. The electronic component mounting apparatus according to claim 4 , wherein the control unit controls the component imaging unit so as to image the electronic component held by the holding unit while the holding unit is moved at a constant speed.

6. The electronic component mounting apparatus according to claim 4 ,
wherein the component imaging unit has a component lighting unit that lights the electronic component that is held by the holding unit during imaging, and
when the holding unit holds a first electronic component and a second electronic component of different kinds, the control unit delays imaging timing of the first electronic component by the imaging element of each area camera and imaging timing of the second electronic component by the imaging element of each area camera, respectively, and changes the lighting form due to the component lighting unit at each imaging timing.

7. An electronic component mounting method performed by an electronic component mounting apparatus comprising:
a substrate conveyance mechanism unit configured to convey a substrate with an electronic component mounted thereon in a first direction;
a component supply unit configured to supply the electronic component;
a holding unit configured to hold the electronic component supplied from the component supply unit;
a movement mechanism unit configured to move the holding unit;
a component imaging unit configured to image the electronic component that is held by the holding unit;
a control unit configured to control an imaging form of the electronic component by the component imaging unit; and
a component recognition unit configured to recognize the electronic component based on an image that is imaged by the component imaging unit, the component imaging unit having at least three area cameras that include at least one imaging element, and visual fields of the imaging element being common to each other regardless of the area camera, the electronic component mounting method comprises:
a step of controlling the component imaging unit so as to image the electronic component that is held by the holding unit, when the holding unit is moved in a direction oblique to the first direction and close to the substrate by the movement mechanism unit.

8. The electronic component mounting apparatus according to claim 1 , wherein the area camera comprises a first imaging element and a second imaging element which are independent devices having different visual fields,
the control unit sets the imaging form of the component imaging unit to a first imaging mode or a second imaging mode according to a size of the electronic component,
when the imaging form is set to the first imaging mode, the component recognition unit recognizes a first electronic component that is held by the holding unit based on an image imaged by the first imaging element, and the component recognition unit also recognizes a second electronic component that is held by the holding unit together with the first electronic component based on an image imaged by the second imaging element,
when the imaging form is set to the second imaging mode, the component recognition unit recognizes an electronic component that is held by the holding unit based on an image obtained by combining an image imaged by the first imaging element and an image imaged by the second imaging element, and
the control unit controls the first imaging element and the second imaging element independently so as to image the electronic component held by the holding unit.

9. The electronic component mounting apparatus according to claim 4 , wherein each of the area cameras comprises a first imaging element and a second imaging element which are independent devices having different visual fields,
the control unit sets the imaging form of the component imaging unit to a first imaging mode or a second imaging mode according to a size of the electronic component,
when the imaging form is set to the first imaging mode, the component recognition unit recognizes a first electronic component that is held by the holding unit based on an image imaged by the first imaging element of each of the area cameras, and the component recognition unit also recognizes a second electronic component that is held by the holding unit together with the first electronic component based on an image imaged by the second imaging element of each of the area cameras,
when the imaging

Assignees

• Panasonic Corp
• Panasonic Ip Man Co Ltd

Inventors

• Hachiya Eiichi
• Nakamura Takashi
• Kelly David L
• Camara Jose

Classifications

• H04N23/74

  by influencing the scene brightness using illuminating means · CPC title

• H04N5/2354

  Electricity · mapped topic

• H04N7/18 Primary

  Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast · CPC title

• H05K13/08

  Monitoring manufacture of assemblages · CPC title

• G01N21/956

  Inspecting patterns on the surface of objects {(contactless testing of electronic circuits G01R31/308; testing currency G07D; manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20)} · CPC title