Optical component and its method of manufacture, and light emitting device and its method of manufacture

Patent metadata

Field	Value
Publication number	US-9490606-B2
Application number	US-201514868809-A
Country	US
Kind code	B2
Filing date	Sep 29, 2015
Priority date	Sep 30, 2014
Publication date	Nov 8, 2016
Grant date	Nov 8, 2016

Abstract

An optical component includes a support member having a through-hole, a second light-transmissive member disposed inside the through-hole, and having a light incidence face, a light emission face and an outer peripheral side surface, and an outer peripheral side surface, a fused first light-transmissive member formed between an inner wall of the through-hole and the outer peripheral side surface of the second light-transmissive member.

First claim

What is claimed is:

1. An optical component comprising;
a support member having a through-hole,
a second light-transmissive member disposed inside the through-hole, and having a light incidence face, a light emission face and an outer peripheral side surface,
a fused first light-transmissive member formed between an inner wall of the through-hole and the outer peripheral side surface of the second light-transmissive member.

2. The optical component according to claim 1 , wherein
the second light-transmissive member has a higher melting point than that of the first light-transmissive member.

3. The optical component according to claim 1 , wherein
the second light-transmissive member includes a phosphor.

4. The optical component according to claim 1 , wherein
the first light-transmissive member is made of an inorganic material.

5. The optical component according to claim 1 , wherein
the first light-transmissive member is made of a glass.

6. The optical component according to claim 1 , wherein
the inner of the through-hole wall expands from a light incidence face side toward a light emission face side.

7. The optical component according to claim 1 , wherein
the second light-transmissive member has a shape that widens from the light incidence face toward the light emission face.

8. The optical component according to claim 1 , further comprising;
a third light-transmissive member that covers the light emission face of the second light-transmissive member.

9. The optical component according to claim 8 , wherein
the third light-transmissive member is made of a material that has a melting point lower than that of the second light-transmissive member.

10. The optical component according to claim 8 , wherein
the third light-transmissive member includes a phosphor.

11. The optical component according to claim 8 , wherein
the third light-transmissive member includes a filler.

12. The optical component according to claim 1 , wherein
the second light-transmissive member is made of an ceramics.

13. The optical component according to claim 1 , wherein
the support member is made of a light reflective material.

14. A light emitting device comprising;
the optical component of claim 1 , and
a semiconductor laser element.

15. A method for manufacturing an optical member comprising;
forming a first light-transmissive member on an inner wall of a through-hole of a support member which has an incidence opening and an emission opening, and
fixing an outer peripheral side surface of a second light-transmissive member includes a light incidence face and a light emission face to the inner wall of the through-hole by fusion of the first light-transmissive member.

16. The method for manufacturing an optical member according to claim 15 further comprising;
forming a third light-transmissive member covering the emission face of the second light-transmissive member.

17. The method for manufacturing an optical member according to claim 16 further comprising;
polishing the third light-transmissive member from a side of the emission opening of the support member after forming the third light-transmissive member.

18. The method for manufacturing an optical member according to claim 15 , wherein
the second light-transmissive member is composed of ceramics including phosphors,
the second light-transmissive member is fixed to the inner wall of the through-hole by heating at a temperature above the melting point of the first light-transmissive member, and below the melting point of the second light-transmissive member.

19. A method for manufacturing a light emitting device comprising;
connecting the optical component of claim 15 to a semiconductor laser element.

Assignees

• Nichia Corp

Inventors

• Okada Takeshi

Classifications

• H01S5/02212

  Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis · CPC title

• F21V13/14

  the elements being filters or photoluminescent elements, reflectors and refractors · CPC title

• F21Y2115/30

  Semiconductor lasers · CPC title

• H01S5/32341

  blue laser based on GaN or GaP · CPC title

• F21V9/38

  Combination of two or more photoluminescent elements of different materials · CPC title