High-frequency signal line

Patent metadata

Field	Value
Publication number	US-9490515-B2
Application number	US-201414547374-A
Country	US
Kind code	B2
Filing date	Nov 19, 2014
Priority date	Oct 12, 2012
Publication date	Nov 8, 2016
Grant date	Nov 8, 2016

Abstract

A high-frequency signal line includes a dielectric laminate body including a first dielectric layer, an adhesive layer and a second dielectric layer laminated in this order from a first side to a second side in a direction of lamination. A linear signal line is fixed on a main surface of the adhesive layer. A main ground conductor is provided on a main surface of the dielectric layer. An auxiliary ground conductor is provided on the second dielectric layer. The adhesive layer bonds the first and second dielectric layers together. A distance in the direction of lamination between the signal line and the main ground conductor is greater than a distance in the direction of lamination between the signal line and the auxiliary ground conductor.

First claim

What is claimed is:

1. A high-frequency signal line comprising:
a dielectric laminate body including a first dielectric layer, an adhesive layer and a second dielectric layer laminated in this order from a first side to a second side in a direction of lamination, the first dielectric layer including a first main surface and a second main surface, the first main surface being closer to the first side than the second main surface and the second main surface being closer to the second side than the first main surface, the adhesive layer including a third main surface and a fourth main surface, the third main surface being closer to the first side than the fourth main surface and the fourth main surface being closer to the second side than the third main surface;
a signal line fixed on the third main surface of the adhesive layer;
a main ground conductor provided on the first main surface of the first dielectric layer; and
an auxiliary ground conductor provided on the second dielectric layer; wherein:
the adhesive layer bonds the first dielectric layer and the second dielectric layer together; and
a distance in the direction of lamination between the signal line and the main ground conductor is greater than a distance in the direction of lamination between the signal line and the auxiliary ground conductor.

2. The high-frequency signal line according to claim 1 , wherein the auxiliary ground conductor includes openings arranged along the signal line.

3. The high-frequency signal line according to claim 1 , wherein an area of an overlapping portion of the signal line with the main ground conductor is greater than an area of an overlapping portion of the signal line and the auxiliary ground conductor.

4. The high-frequency signal line according to claim 1 , wherein
the second dielectric layer includes a fifth main surface and a sixth main surface, the fifth main surface being closer to the first side than the sixth main surface and the sixth main surface being closer to the second side than the fifth main surface; and
the auxiliary ground conductor is provided on the sixth main surface of the second dielectric layer.

5. The high-frequency signal line according to claim 1 , wherein the high-frequency signal line is flexible.

6. The high-frequency signal line according to claim 1 , wherein
the first dielectric layer, the second dielectric layer and the adhesive layer include thermoplastic resin; and
a softening point of the adhesive layer is lower than a softening point of the first dielectric layer and lower than a softening point of the second dielectric layer.

7. The high-frequency signal line according to claim 1 , wherein
the adhesive layer includes thermosetting resin; and
the signal line is fixed on the adhesive layer.

8. The high-frequency signal line according to claim 1 , wherein the dielectric laminate body includes a first protective layer and a second protective layer provided at a top portion and a bottom portion respectively of the dielectric laminate body.

9. The high-frequency signal line according to claim 1 , wherein the first dielectric layer and the second dielectric layer have different thicknesses.

10. The high-frequency signal line according to claim 1 , wherein the signal line is a linear conductor.

11. The high-frequency signal line according to claim 1 , wherein the main ground conductor does not have openings located over the signal line.

12. The high-frequency signal line according to claim 1 , wherein the main ground conductor includes a line portion and terminal portions.

13. The high-frequency signal line according to claim 1 , wherein the auxiliary ground conductor includes a line portion and terminal portions.

14. The high-frequency signal line according to claim 1 , wherein the auxiliary ground conductor has a ladder configuration and the signal line extends across the ladder configuration.

15. The high-frequency signal line according to claim 1 , wherein the signal line, the main ground conductor and the auxiliary ground conductor define a triplate structure.

16. The high-frequency signal line according to claim 1 , wherein the distance between the signal line and the auxiliary ground conductor is equal or substantially equal to a total of a thickness of the first dielectric sheet and a thickness of the adhesive layer.

17. An electronic device comprising:
first and second high-frequency circuits;
the high-frequency signal line according to claim 1 arranged to connect first and second high-frequency circuits to each other.

18. The electronic device according to claim 17 , wherein the electronic device is a cell phone.

19. The electronic device according to claim 17 , wherein the first and second high-frequency circuits are transmitting circuits or receiving circuits and include an antenna.

20. The electronic device according to claim 17 , further comprising a circuit board including the first and second high-frequency circuits provided therein.

Assignees

• Murata Manufacturing Co

Inventors

• Kato Noboru

Classifications

• H01P3/085 Primary

  Triplate lines · CPC title

• H01P3/06

  Coaxial lines · CPC title

• H01P3/082 Primary

  Multilayer dielectric · CPC title

• H04M1/725

  Cordless telephones (user interfaces specially adapted therefor H04M1/724) · CPC title