Silicon and Semiconducting Oxide Thin-Film Transistor Displays
US-2016087022-A1 · Mar 24, 2016 · US
US9490312B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9490312-B2 |
| Application number | US-201414579511-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 22, 2014 |
| Priority date | Dec 22, 2014 |
| Publication date | Nov 8, 2016 |
| Grant date | Nov 8, 2016 |
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There is provided a flexible display having a plurality of innovations configured to allow bending of a portion or portions to reduce apparent border size and/or utilize the side surface of an assembled flexible display.
Opening claim text (preview).
What is claimed is: 1. An organic-light emitting display apparatus, comprising: a flexible base layer defined with a first area, a second area and a bend allowance section between the first area and the second area of the flexible base layer; a plurality of thin-film transistors and a plurality of organic-light emitting diode (OLED) elements disposed in the first area of the flexible base layer, the plurality of thin-film transistors being configured to control emission of the plurality of OLED elements; and a flexible printed circuit film connected to a connection interface provided in the second area of the flexible base layer, the printed circuit film having at least one driver integrated circuit (D-IC), wherein the printed circuit film includes a first metal layer on a first side and a second metal layer on a second side of the printed circuit film. 2. The organic-light emitting display apparatus of claim 1 , wherein the flexible printed circuit film in includes a plurality of conductive lines in the first metal layer and the second metal layer, in which at least one of the conductive lines on the first metal layer of the flexible printed circuit film is in contact with at least one of the conductive lines on the second metal layer of the flexible printed circuit film via a hole through the printed circuit film. 3. The organic-light emitting display apparatus of claim 2 , wherein said conductive lines connected via the hole through the flexible printed circuit film is connected to a ground line configured to discharge electrostatic from the flexible printed circuit film. 4. The organic-light emitting display apparatus of claim 2 , wherein at least two conductive lines in the first metal layer of the flexible printed circuit film are bridged by at least one of the conductive lines in the second metal layer of the flexible printed circuit film. 5. The organic-light emitting display apparatus of claim 1 , wherein the printed circuit film includes a conductive line having a valley portion and a main portion provided in the first metal layer of the flexible printed circuit film and a conductive bridge provided in the second metal layer of the flexible printed circuit film. 6. The organic-light emitting display apparatus of claim 1 , wherein the flexible printed circuit film includes a conductive line having a valley portion provided in the first metal layer of the flexible printed circuit film and a main portion provided in the second metal layer of the flexible printed circuit film, and wherein the valley portion and the main portion of the conductive line is in contact with each other via a hole through the flexible printed circuit film. 7. The organic-light emitting display apparatus of claim 1 , wherein the bend allowance section of the flexible base layer is bent such that the second area of the flexible base layer is arranged to overlap at least some part of the first area of the flexible base layer. 8. The organic-light emitting display apparatus of claim 1 , wherein the flexible printed circuit film includes a display driver integrated circuit and a touch driver integrated circuit. 9. The organic-light emitting display apparatus of claim 1 , wherein the flexible printed circuit film includes a power supply unit disposed thereon. 10. An apparatus comprising: a flexible base layer having a first area, a second area and a bend allowance section between said first area and said second area; a plurality of thin-film transistors and a plurality of organic-light emitting diode (OLED) elements in at least one among said first area and said second area of said flexible base layer, said plurality of thin-film transistors configured to control said plurality of OLED elements; and a printed circuit film having one surface with a first metal layer and an opposing surface with a second metal layer, said first metal layer having a portion electrically connected to, by means of a conductive adhesive, a connection interface at said second area of said flexible base layer. 11. The apparatus of claim 10 , wherein said printed circuit film is configured to have one or more integrated circuits that cooperate with at least one among said plurality of thin-film transistors and said plurality of OLED elements. 12. The apparatus of claim 11 , wherein said first and second metal layers include conductive line patterns that provide electrical connection for said integrated circuits. 13. The apparatus of claim 12 , wherein certain conductive line patterns are connected together by means of via holes through said flexible base layer. 14. The apparatus of claim 13 , wherein at least one conductive line among said conductive line patterns is configured as a single conductive path with segments along said one surface and segments along said opposing surface being electrically connected with a conductive bridge at adjacent via holes. 15. The apparatus of claim 14 , further comprising a power supply unit configured to supply power to at least one among said integrated circuits, said plurality of thin-film transistors and said plurality of OLED elements. 16. The apparatus of claim 15 , further comprising a solder resist (SR) layer on selective portions of said first and second metal layers. 17. The apparatus of claim 10 , wherein the printed circuit film having one surface with the first metal layer and the opposing surface with the second metal layer provides increased footprint area on the one surface to allow two or more integrated circuits to be attached thereon.
Electricity · mapped topic
Electricity · mapped topic
Display · CPC title
Mesh conductors, e.g. as a ground plane · CPC title
Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title
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