Electronic device with multi-layer contact

Patent metadata

Field	Value
Publication number	US-9490193-B2
Application number	US-201113309163-A
Country	US
Kind code	B2
Filing date	Dec 1, 2011
Priority date	Dec 1, 2011
Publication date	Nov 8, 2016
Grant date	Nov 8, 2016

Abstract

The electronic device includes a carrier, a semiconductor substrate attached to the carrier, and a layer system disposed between the semiconductor substrate and the carrier. The layer system includes an electrical contact layer disposed on the semiconductor substrate. A functional layer is disposed on the electrical contact layer. An adhesion layer is disposed on the functional layer. A solder layer is disposed between the adhesion layer and the carrier.

First claim

What is claimed is:

1. An electronic device comprising:
a carrier having one or more metallic layers disposed on its surface, wherein the metallic layer or an uppermost of the metallic layers, respectively, comprises one or more of Cu, Pt, or Ag;
a semiconductor substrate attached to the carrier; and
a layer system disposed between the semiconductor substrate and the carrier, the layer system comprising:
an electrical contact layer disposed directly on the semiconductor substrate, wherein the electrical contact layer is a layer of a single element Ti;
a functional layer disposed directly on the electrical contact layer, wherein the functional layer is a TiW layer;
an adhesion layer disposed directly on the functional layer, wherein the adhesion layer is a single element layer of Cu, Au, Ag or Ni;
a solder layer disposed directly on the adhesion layer, wherein the solder layer is a single element layer of Zn, In, Ga, Bi, or Cd, or an alloy containing one or more of Zn, In, Ga, Bi, or Cd; and
a protection layer disposed directly on the solder layer and directly adjoining the metallic layer or the uppermost of the metallic layers, respectively, on the surface of the carrier, wherein the protection layer is an Ag layer.

2. The electronic device according to claim 1 , wherein the electrical contact layer has a thickness in a range from 100 nm to 1 μm.

3. The electronic device according to claim 1 , wherein the functional layer has a thickness in a range from 50 nm to 200 nm.

4. The electronic device according to claim 1 , wherein the solder layer has a thickness in a range from 1 μm to 5 μm.

5. The electronic device according to claim 1 , wherein the protection layer has a thickness in a range from 50 nm to 200 nm.

6. An electronic device comprising:
a carrier having one or more metallic layers disposed on its surface, wherein the metallic layer or an uppermost of the metallic layers, respectively, comprises one or more of Cu, Pt, or Ag;
a semiconductor substrate attached to the carrier; and
a layer system disposed between the semiconductor substrate and the carrier, the layer system comprising:
an electrical contact layer disposed directly on the semiconductor substrate, wherein the electrical contact layer is a single Ti layer;
a functional layer disposed directly on the electrical contact layer, wherein the functional layer is a Ti layer or a W layer;
an adhesion layer disposed directly on the functional layer, wherein the adhesion layer is a single element layer of Cu, Au, Ag, or Ni;
a solder layer disposed directly on the adhesion layer, wherein the solder layer is a single element layer of Zn, In, Ga, Bi, or Cd, or an alloy containing one or more of Zn, In, Ga, Bi, or Cd; and
a protection layer disposed directly on the solder layer and directly adjoining the metallic layer or the uppermost of the metallic layers, respectively, on the surface of the carrier, wherein the protection layer is an Ag layer.

Assignees

• Heinrich Alexander
• Juerss Michael
• Roesl Konrad
• Eichinger Oliver
• Goh Kok Chai
• Schmidt Tobias
• Infineon Technologies Ag

Inventors

• Heinrich Alexander
• Juerss Michael
• Roesl Konrad
• Eichinger Oliver
• Goh Kok Chai
• Schmidt Tobias

Classifications

• H10W72/923

  Bond pads having multiple stacked layers · CPC title

• H10W72/59

  Bond pads specially adapted therefor · CPC title

• H10W72/01938

  in gaseous form, e.g. by CVD or PVD · CPC title

• H10W72/01936

  in solid form, e.g. by using a powder or by laminating a foil · CPC title

• H10W72/07336

  Soldering or alloying · CPC title