Multilayer electronic component
US-2024242884-A1 · Jul 18, 2024 · US
Multilayer ceramic electronic component, manufacturing method thereof and board having the same mounted thereon
US9490070B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9490070-B2 |
| Application number | US-201414258876-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 22, 2014 |
| Priority date | Feb 6, 2014 |
| Publication date | Nov 8, 2016 |
| Grant date | Nov 8, 2016 |
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Abstract
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A multilayer ceramic electronic component may include: a ceramic body in which dielectric layers containing plate-shaped dielectric grains are stacked; and internal electrodes disposed on the dielectric layers within the ceramic body. The dielectric layer may contain dielectric grains, plate-shaped surfaces of which have an angle of 20° or less with regard to a boundary surface between the dielectric layer and the internal electrode.
First claim
Opening claim text (preview).
What is claimed is: 1. A multilayer ceramic electronic component, comprising: a ceramic body in which dielectric layers containing plate-shaped dielectric grains are stacked; and internal electrodes disposed on the dielectric layers within the ceramic body, wherein the dielectric layer contains dielectric grains, plate-shaped surfaces of which have an angle of 20° or less with regard to a boundary surface between the dielectric layer and the internal electrode. 2. The multilayer ceramic electronic component of claim 1 , wherein when a diameter of the plate-shaped surface of the dielectric grain is a and a thickness of the dielectric grain is c, a/c≧1.5 is satisfied. 3. The multilayer ceramic electronic component of claim 1 , wherein when an area of the plate-shaped surface of the dielectric grain is s and a thickness of the dielectric grain is c, s/c≧2.25 is satisfied. 4. The multilayer ceramic electronic component of claim 1 , wherein the dielectric layer comprises a dielectric base material and bismuth. 5. The multilayer ceramic electronic component of claim 1 , wherein the dielectric layer comprises a dielectric base material, and the dielectric base material comprises a barium titanate-based dielectric material. 6. The multilayer ceramic electronic component of claim 1 , wherein the dielectric layer comprises a dielectric base material and bismuth, and the bismuth is contained in an amount of 0.2 to 1.6 moles based on 100 moles of the dielectric base material. 7. The multilayer ceramic electronic component of claim 1 , wherein the dielectric layer comprises a dielectric base material and bismuth, and the bismuth is contained as bismuthoxide (Bi 2 O 3 ) in an amount of 0.1 to 0.8 mole based on 100 moles of the dielectric base material. 8. The multilayer ceramic electronic component of claim 1 , wherein the dielectric grains, plate-shaped surfaces of which have an angle of 20° or less with regard to the boundary surface between the dielectric layer and the internal electrode, make up 60% or more of the dielectric grains contained in the dielectric layer.
Assignees
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Classifications
based on alkaline earth titanates · CPC title
Fried electrodes · CPC title
- H01G4/1209Primary
characterised by the ceramic dielectric material (H01G4/1272, H01G4/1281 take precedence) · CPC title
Stacked capacitors (H01G4/33 takes precedence) · CPC title
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- What does patent US9490070B2 cover?
- A multilayer ceramic electronic component may include: a ceramic body in which dielectric layers containing plate-shaped dielectric grains are stacked; and internal electrodes disposed on the dielectric layers within the ceramic body. The dielectric layer may contain dielectric grains, plate-shaped surfaces of which have an angle of 20° or less with regard to a boundary surface between the diel…
- Who is the assignee on this patent?
- Samsung Electro Mech
- What technology area does this patent fall under?
- Primary CPC classification H01G4/1209. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 08 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).