Pattern-forming method

US9487868B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9487868-B2
Application numberUS-201514591323-A
CountryUS
Kind codeB2
Filing dateJan 7, 2015
Priority dateJan 7, 2014
Publication dateNov 8, 2016
Grant dateNov 8, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A pattern-forming method includes providing a metal-containing film directly or indirectly on a substrate. A directed self-assembling film is provided directly or indirectly on the metal-containing film such that a plurality of phases of the directed self-assembling film is formed. At least a part of the plurality of phases of the directed self-assembling film is removed such that a pattern of the directed self-assembling film is formed. The metal-containing film and the substrate are sequentially etched using the pattern of the directed self-assembling film as a mask.

First claim

Opening claim text (preview).

The invention claimed is: 1. A pattern-forming method comprising: applying a composition directly or indirectly on a substrate to provide a metal-containing film directly or indirectly on the substrate; providing a directed self-assembling film directly or indirectly on the metal-containing film such that a plurality of phases of the directed self-assembling film is formed; removing at least a part of the plurality of phases of the directed self-assembling film such that a pattern of the directed self-assembling film is formed; sequentially etching the metal-containing film and the substrate using the pattern of the directed self-assembling film as a mask to obtain a patterned substrate; and totally removing the directed self-assembling film and the metal-containing film from the substrate after the patterned substrate is obtained, wherein the composition comprises: a hydrolyzable compound which is a metal compound comprising a hydrolyzable group, a hydrolysis product of a metal compound comprising a hydrolyzable group, a hydrolytic condensation product of a metal compound comprising a hydrolyzable group, or a combination thereof; and an organic solvent. 2. The pattern-forming method according to claim 1 , wherein a metal element of the metal compound is a group 3 element, a group 4 element, a group 5 element, a group 6 element, a group 12 element, a group 13 element, or a combination thereof. 3. The pattern-forming method according to claim 2 , wherein the metal element of the metal compound is titanium, zirconium or a combination thereof. 4. The pattern-forming method according to claim 1 , wherein the directed self-assembling film is provided using a composition for forming a directed self-assembling film which comprises: a block copolymer, a mixture of two or more types of polymers that are not compatible with each other, or a combination thereof; and an organic solvent. 5. The pattern-forming method according to claim 1 , further comprising: providing an organic underlayer film on the substrate before providing the metal-containing film, wherein the organic underlayer film is etched when the metal-containing film and the substrate is sequentially etched. 6. The pattern-forming method according to claim 1 , wherein the composition further comprises water. 7. The pattern-forming method according to claim 1 , wherein the composition further comprises a crosslinking accelerator. 8. The pattern-forming method according to claim 1 , wherein the hydrolyzable compound is a metal alkoxide, a metal carboxylate, or a metal complex. 9. The pattern-forming method according to claim 6 , wherein a content of the water is 0.1 parts by mass to 10 parts by mass with respect to 100 parts by mass of the composition. 10. The pattern-forming method according to claim 6 , wherein a content of the water is 1 part by mass to 8 parts by mass with respect to 100 parts by mass of the composition. 11. The pattern-forming method according to claim 7 , wherein the crosslinking accelerator is an onium salt compound, an N-sulfonyloxyimide compound or both thereof. 12. The pattern-forming method according to claim 7 , wherein the crosslinking accelerator is an onium salt compound. 13. The pattern-forming method according to claim 7 , wherein a content of the crosslinking accelerator is no less than 0.1 parts by mass and no greater than 5 parts by mass with respect to 100 parts by mass of the hydrolyzable compound.

Assignees

Inventors

Classifications

  • characterised by their composition, e.g. multilayer masks or materials · CPC title

  • Coating compositions based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers · CPC title

  • using a catalyst of the anionic type · CPC title

  • Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

  • Gaseous compositions · CPC title

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What does patent US9487868B2 cover?
A pattern-forming method includes providing a metal-containing film directly or indirectly on a substrate. A directed self-assembling film is provided directly or indirectly on the metal-containing film such that a plurality of phases of the directed self-assembling film is formed. At least a part of the plurality of phases of the directed self-assembling film is removed such that a pattern of …
Who is the assignee on this patent?
Jsr Corp
What technology area does this patent fall under?
Primary CPC classification C23F1/02. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Nov 08 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).