Label removal solution for low temperature and low alkaline conditions

Patent metadata

Field	Value
Publication number	US-9487735-B2
Application number	US-201414459732-A
Country	US
Kind code	B2
Filing date	Aug 14, 2014
Priority date	May 14, 2012
Publication date	Nov 8, 2016
Grant date	Nov 8, 2016

Abstract

According to the invention, the compositions and methods provide for the complete removal of synthetic glues or adhesives from a plurality of surfaces through the use of amide solvents in combination with surfactants, chelants, acidulants and/or additional bottle wash additives. Beneficially, the compositions and methods are suitable for use at lower temperatures, including below 35° C., and lower pH conditions, including from 5 to 10, from 6 to 9, and from 6 to 8, in comparison to conventional caustic-based adhesive removal compositions.

First claim

What is claimed is:

1. A composition for removing adhesive material from a surface comprising:
from about 0.1-10 wt-% of an aqueous or non-aqueous amide solvent;
from about 1-5 wt-% of an additional aqueous or non-aqueous organic solvent;
water; and
less than about 25 wt-% sodium hydroxide;
wherein the composition effectively removes an adhesive material from a surface at a composition pH between about 5 to 10 within a period of time less than about 10 minutes at temperatures less than about 50° C., and
the additional aqueous or non-aqueous organic solvent is one or more solvents selected from the group consisting of C18-monoamine, ethoxylated alkylamine, alkoxylated ethylenediamine, imidazole, and ethoxylated alkyl cocoamine.

2. The composition of claim 1 wherein the amide solvent is a saturated amide having at least 8 carbon atoms or combinations thereof.

3. The composition of claim 2 wherein the amide solvent is a saturated amide having a R n E(O)xNR′ 2 functional group, wherein R and/or R′ is H or an organic group, n is at least 1, E is C, S, or P, and x is at least 1.

4. The composition of claim 1 wherein the composition is substantially-free of sodium hydroxide or other caustic containing components and has a pH between about 6 and 8, and wherein the composition provides a total solvent concentration between about 1 wt-% and 5 wt-%.

5. The composition of claim 1 wherein the composition further comprises a chelant, a surfactant, an acidulant and/or at least one bottle washing additive selected from the group consisting of a defoaming agent, wetting agent, rinse aid, catalyst, corrosion inhibitor, and combinations thereof.

6. The composition of claim 1 comprising from about 0.1 wt-% to about 10 wt-% organic solvent and amide solvent.

7. The composition of claim 1 wherein the composition further comprises a substrate layer of one or more layers of adhesive, laminate and/or other synthetic or natural adhesive residue.

8. The composition of claim 7 wherein one of more of said layers is a polyacrylic acid, aminocarboxylate and/or casein adhesive.

Assignees

• Ecolab Usa Inc

Inventors

• Hunt Jr Clinton
• Smith Kim R
• Krack Ralf

Classifications

• C11D3/32

  Amides; Substituted amides · CPC title

• C11D1/521 Primary

  Carboxylic amides (R1-CO-NR2R3), where R1, R2 and R3 are alkyl or alkenyl groups · CPC title

• C11D3/43 Primary

  Solvents · CPC title

• C11D3/044

  Hydroxides or bases · CPC title

• C11D11/0035

  Chemistry & Metallurgy · mapped topic