Curable resin composition, cured product thereof, laminate, and method for producing laminate

US9487682B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9487682-B2
Application numberUS-201214009417-A
CountryUS
Kind codeB2
Filing dateApr 5, 2012
Priority dateApr 5, 2011
Publication dateNov 8, 2016
Grant dateNov 8, 2016

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

This curable resin composition comprises (A) a polymerizable (meth)acrylic-based monomer, (B) a thiourea compound component, and (C) a peroxide component having a structure of formula (1), and may have (D) a (meth) acrylic-based polymer component as an optional component. (In formula (1), R is a C1-15 hydrocarbon group.) In the curable resin composition, preferably, the content of the (A) component is 5-100 mass % and the content of the (D) component is 0-95 mass % relative to the total mass of the (A) component and the (D) component.

First claim

Opening claim text (preview).

The invention claimed is: 1. A curable resin composition comprising: (A) a polymerizable (meth)acrylic-based monomer component; (B) a thiourea compound component; and (C) a peroxide component having a structure of the following formula (1), wherein the composition may contain (D) a (meth)acrylic-based polymer component as an optional component, wherein R in the formula (1) is a hydrocarbon group with a carbon number of 1 to 15. 2. The curable resin composition according to claim 1 , wherein a content of the (A) component is 5 to 100 mass %, and a content of the (D) component is 0 to 95 mass %, relative to the total mass of the (A) component and the (D) component. 3. The curable resin composition according to claim 1 , wherein a content of the (A) component is 80 to 100 mass %, and a content of the (D) component is 0 to 20 mass %, relative to the total mass of the (A) component and the (D) component. 4. The curable resin composition according to claim 1 , wherein a content of the (A) component is 80 to 98 mass %, and a content of the (D) component is 2 to 20 mass %, relative to the total mass of the (A) component and the (D) component. 5. The curable resin composition according to claim 1 , wherein the (B) component is at least one compound selected from the group consisting of thiourea, ethylene thiourea, N,N′-dimethyl thiourea, N,N′-diethyl thiourea, N,N′-dipropyl thiourea, N,N′-di-n-butyl thiourea, N,N′-dilauryl thiourea, N,N′-diphenyl thiourea, trimethyl thiourea, 1-acetyl-2-thiourea and 1-benzoyl-2-thiourea; and wherein the (C) component is at least one compound selected from the group consisting of t-hexylperoxy isopropyl monocarbonate, t-butylperoxy isopropyl monocarbonate, t-butylperoxy 2-ethylhexyl monocarbonate, t-butylperoxy allyl monocarbonate and 1,6-bis(t-butylperoxy carbonyloxy)hexane. 6. The curable resin composition according to claim 1 , comprising: 0.05 to 5 parts by mass of the (C) component; and 0.1 to 10 parts by mass of the (D) components, relative to a total of 100 parts by mass of the (A) component and the (D) component. 7. The curable resin composition according to claim 6 , wherein the (B) component is at least one compound selected from the group consisting of thiourea, ethylene thiourea, N,N′-dimethyl thiourea, N,N′-diethyl thiourea, N,N′-dipropyl thiourea, N,N′-di-n-butyl thiourea, N,N′-dilauryl thiourea, N,N′-diphenyl thiourea, trimethyl thiourea, 1-acetyl-2-thiourea and 1-benzoyl-2-thiourea; and wherein the (C) component is at least one compound selected from the group consisting of t-hexylperoxy isopropyl monocarbonate, t-butylperoxy isopropyl monocarbonate, t-butylperoxy 2-ethylhexyl monocarbonate, t-butylperoxy allyl monocarbonate and 1,6-bis(t-butylperoxy carbonyloxy)hexane. 8. A cured product obtained by curing the curable resin composition according to claim 1 . 9. A cured product obtained by curing the curable resin composition according to claim 5 . 10. A cured product obtained by curing the curable resin composition according to claim 6 . 11. A cured product obtained by curing the curable resin composition according to claim 7 . 12. A laminate comprising a layer consisting of the cured product according to claim 8 between two substrates. 13. A laminate comprising a layer consisting of the cured product according to claim 9 between two substrates. 14. A laminate comprising a layer consisting of the cured product according to claim 10 between two substrates. 15. A laminate comprising a layer consisting of the cured product according to claim 11 between two substrates. 16. A method for producing the laminate according to claim 12 , comprising: pouring the curable resin composition according to claim 1 between two opposing substrates; and curing the curable resin composition. 17. A method for producing the laminate according to claim 13 , comprising: pouring the curable resin composition according to claim 5 between two opposing substrates; and curing the curable resin composition. 18. A method for producing the laminate according to claim 14 , comprising: pouring the curable resin composition according to claim 6 between two opposing substrates; and curing the composition. 19. A method for producing the laminate according to claim 15 , comprising: pouring the curable resin composition according to claim 7 between two opposing substrates; and curing the curable resin composition.

Assignees

Inventors

Classifications

  • Methyl esters {, e.g. methyl (meth)acrylate} · CPC title

  • with acrylic or methacrylic acids · CPC title

  • C09J135/02Primary

    Homopolymers or copolymers of esters (C09J135/06, C09J135/08 take precedence) · CPC title

  • applied in spaced arrangements, e.g. in stripes · CPC title

  • Polymerisation of acrylate or methacrylate esters on to polymers thereof · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9487682B2 cover?
This curable resin composition comprises (A) a polymerizable (meth)acrylic-based monomer, (B) a thiourea compound component, and (C) a peroxide component having a structure of formula (1), and may have (D) a (meth) acrylic-based polymer component as an optional component. (In formula (1), R is a C1-15 hydrocarbon group.) In the curable resin composition, preferably, the content of the (A) compo…
Who is the assignee on this patent?
Matsumura Kazunari, Mitsubishi Rayon Co
What technology area does this patent fall under?
Primary CPC classification C09J135/02. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Nov 08 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).