Methylene beta-ketoester monomers, methods for making methylene beta-ketoester monomers, polymerizable compositions and products formed therefrom
US-9527795-B2 · Dec 27, 2016 · US
US9487682B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9487682-B2 |
| Application number | US-201214009417-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 5, 2012 |
| Priority date | Apr 5, 2011 |
| Publication date | Nov 8, 2016 |
| Grant date | Nov 8, 2016 |
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This curable resin composition comprises (A) a polymerizable (meth)acrylic-based monomer, (B) a thiourea compound component, and (C) a peroxide component having a structure of formula (1), and may have (D) a (meth) acrylic-based polymer component as an optional component. (In formula (1), R is a C1-15 hydrocarbon group.) In the curable resin composition, preferably, the content of the (A) component is 5-100 mass % and the content of the (D) component is 0-95 mass % relative to the total mass of the (A) component and the (D) component.
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The invention claimed is: 1. A curable resin composition comprising: (A) a polymerizable (meth)acrylic-based monomer component; (B) a thiourea compound component; and (C) a peroxide component having a structure of the following formula (1), wherein the composition may contain (D) a (meth)acrylic-based polymer component as an optional component, wherein R in the formula (1) is a hydrocarbon group with a carbon number of 1 to 15. 2. The curable resin composition according to claim 1 , wherein a content of the (A) component is 5 to 100 mass %, and a content of the (D) component is 0 to 95 mass %, relative to the total mass of the (A) component and the (D) component. 3. The curable resin composition according to claim 1 , wherein a content of the (A) component is 80 to 100 mass %, and a content of the (D) component is 0 to 20 mass %, relative to the total mass of the (A) component and the (D) component. 4. The curable resin composition according to claim 1 , wherein a content of the (A) component is 80 to 98 mass %, and a content of the (D) component is 2 to 20 mass %, relative to the total mass of the (A) component and the (D) component. 5. The curable resin composition according to claim 1 , wherein the (B) component is at least one compound selected from the group consisting of thiourea, ethylene thiourea, N,N′-dimethyl thiourea, N,N′-diethyl thiourea, N,N′-dipropyl thiourea, N,N′-di-n-butyl thiourea, N,N′-dilauryl thiourea, N,N′-diphenyl thiourea, trimethyl thiourea, 1-acetyl-2-thiourea and 1-benzoyl-2-thiourea; and wherein the (C) component is at least one compound selected from the group consisting of t-hexylperoxy isopropyl monocarbonate, t-butylperoxy isopropyl monocarbonate, t-butylperoxy 2-ethylhexyl monocarbonate, t-butylperoxy allyl monocarbonate and 1,6-bis(t-butylperoxy carbonyloxy)hexane. 6. The curable resin composition according to claim 1 , comprising: 0.05 to 5 parts by mass of the (C) component; and 0.1 to 10 parts by mass of the (D) components, relative to a total of 100 parts by mass of the (A) component and the (D) component. 7. The curable resin composition according to claim 6 , wherein the (B) component is at least one compound selected from the group consisting of thiourea, ethylene thiourea, N,N′-dimethyl thiourea, N,N′-diethyl thiourea, N,N′-dipropyl thiourea, N,N′-di-n-butyl thiourea, N,N′-dilauryl thiourea, N,N′-diphenyl thiourea, trimethyl thiourea, 1-acetyl-2-thiourea and 1-benzoyl-2-thiourea; and wherein the (C) component is at least one compound selected from the group consisting of t-hexylperoxy isopropyl monocarbonate, t-butylperoxy isopropyl monocarbonate, t-butylperoxy 2-ethylhexyl monocarbonate, t-butylperoxy allyl monocarbonate and 1,6-bis(t-butylperoxy carbonyloxy)hexane. 8. A cured product obtained by curing the curable resin composition according to claim 1 . 9. A cured product obtained by curing the curable resin composition according to claim 5 . 10. A cured product obtained by curing the curable resin composition according to claim 6 . 11. A cured product obtained by curing the curable resin composition according to claim 7 . 12. A laminate comprising a layer consisting of the cured product according to claim 8 between two substrates. 13. A laminate comprising a layer consisting of the cured product according to claim 9 between two substrates. 14. A laminate comprising a layer consisting of the cured product according to claim 10 between two substrates. 15. A laminate comprising a layer consisting of the cured product according to claim 11 between two substrates. 16. A method for producing the laminate according to claim 12 , comprising: pouring the curable resin composition according to claim 1 between two opposing substrates; and curing the curable resin composition. 17. A method for producing the laminate according to claim 13 , comprising: pouring the curable resin composition according to claim 5 between two opposing substrates; and curing the curable resin composition. 18. A method for producing the laminate according to claim 14 , comprising: pouring the curable resin composition according to claim 6 between two opposing substrates; and curing the composition. 19. A method for producing the laminate according to claim 15 , comprising: pouring the curable resin composition according to claim 7 between two opposing substrates; and curing the curable resin composition.
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