Conditioning of grooving in polishing pads

Patent metadata

Field	Value
Publication number	US-9486893-B2
Application number	US-201414285545-A
Country	US
Kind code	B2
Filing date	May 22, 2014
Priority date	May 22, 2014
Publication date	Nov 8, 2016
Grant date	Nov 8, 2016

Abstract

Among other things, a method comprises polishing a surface of a substrate by applying a pressure between the surface of a substrate and a surface of a polishing pad. The surface of the polishing pad defines one or more grooves separated by one or more partition regions. The one or more grooves have an initial depth before the polishing starts and extend from an initial outer surface of the one or more partition regions to an initial bottom of the one or more grooves. The method also comprises removing material below an initial bottom of the one or more grooves such that a distance between an outer surface of the one or more partition regions and a bottom of the one or more grooves remain substantially the same as the initial depth.

First claim

What is claimed is:

1. A method comprising:
polishing a surface of a substrate by pressing the surface of the substrate against a polishing surface of a polishing layer of a polishing pad, wherein the polishing pad defines one or more grooves separated by one or more partition regions with an outer surface of the one or more partition regions of the polishing layer providing the polishing surface and with the polishing layer providing the bottom of the one or more grooves, and wherein the one or more grooves have an initial depth before the polishing starts and extend from an initial outer surface of the one or more partition regions to an initial bottom of the one or more grooves;
abrading the polishing surface, wherein the abrading removes material from the one or more partitions regions and reduces a thickness of the polishing pad; and
removing material of the polishing layer below the initial bottom of the one or more grooves such that a distance between the outer surface of the one or more partition regions and a bottom of the one or more grooves remain substantially the same as the initial depth as the thickness of the polishing pad is reduced.

2. The method of claim 1 , wherein removing the material below the initial bottom of the one or more grooves comprises applying a laser beam to the one or more grooves.

3. The method of claim 1 , wherein removing the material below the initial bottom of the one or more grooves comprises applying a high pressure water stream to the one or more grooves.

4. The method of claim 3 , wherein applying the high pressure water stream comprises sweeping the high pressure water stream across a radius of the polishing pad.

5. The method of claim 1 , wherein removing the material below the initial bottom of the one or more grooves comprises applying a bit or blade to the one or more grooves.

6. The method of claim 5 , wherein applying the bit or blade comprises sweeping the bit or blade across a radius of the polishing pad.

7. The method of claim 1 , comprising forming the one or more grooves having the initial depth in the surface of the polishing pad, wherein the one or more groves are formed by a different process than a process by which the material below the initial bottom is removed.

8. The method of claim 1 , comprising forming the one or more grooves having the initial depth in the surface of the polishing pad, wherein the one or more groves are formed by a same process as a process by which the material below the initial bottom is removed.

9. The method of claim 1 , wherein removing material below the initial bottom of the one or more grooves comprises removing the material during the polishing of the substrate.

10. The method of claim 9 , wherein removing material below the initial bottom of the one or more grooves comprises continuously removing the material during the polishing of the substrate.

11. The method of claim 1 , wherein removing material below the initial bottom of the one or more grooves comprises removing the material after completing polishing the substrate and before starting polishing another substrate.

12. The method of claim 1 , comprising sensing a depth of the one or more grooves to determine whether or not to remove material below the initial bottom of the one or more grooves.

13. A polishing system comprising:
a platen to support a polishing pad;
a polishing head to hold a substrate and position the substrate in contact with a polishing surface of a polishing layer of the polishing pad while the polishing pad is supported on the platen;
a pad conditioning system configured to abrade the polishing surface of the polishing layer while the polishing pad is supported on the platen, wherein abrasion from the pad conditioning system reduces a thickness of the polishing pad;
a groove conditioning system configured to remove material of the polishing layer from an area that is controllably positionable on the polishing pad while the polishing pad is supported on the platen; and
a controller configured to control the groove conditioning system such that a distance between the polishing surface of the polishing pad and a bottom of one or more grooves remains substantially the same as an initial depth of the one or more grooves as the thickness of the polishing pad is reduced, the controller configured to control the position of the area of the polishing layer from which material is removed to be within the one or more grooves in the polishing pad such that material of the polishing layer is removed from below an initial bottom of the one or more grooves.

14. The system of claim 13 , wherein the groove conditioning system comprises a laser source for projecting a laser beam that removes the material below the initial bottom by ablation.

15. The system of claim 14 , wherein the groove conditioning system comprises a galvanometer configured to direct the projected laser beam from the source to the one or more grooves.

16. The system of claim 15 , wherein the galvanometer is configured to move so that the laser beam scans all of the one or more grooves.

17. The system of claim 13 , wherein the groove conditioning system comprises a high pressure water jet.

18. The system of claim 13 , wherein the groove conditioning system comprises a bit or blade configured to directly contact the material.

19. The system of claim 13 , wherein the groove conditioning system comprises a sweeping mechanism configured to sweep a conditioning head of the groove conditioning system radially across the polishing pad.

20. The system of claim 13 , comprising a sensor for determining a depth of the one or more grooves.

Assignees

• Applied Materials Inc

Inventors

• Chen Hung
• Bajaj Rajeev
• Brown Brian J
• Lum Robert T
• Redeker Fred C

Classifications

• B26F3/004

  by means of a fluid jet (methods for use of abrasive blasting for cutting B24C1/045; guns for abrasive fluid jets B24C5/02; perforating by non-mechanical means, e.g. by fluid jet B26F1/26) · CPC title

• B26D3/06

  Grooving involving removal of material from the surface of the work · CPC title

• B24B37/26

  characterised by the shape of the lapping pad surface, e.g. grooved · CPC title

• B24B53/017 Primary

  Devices or means for dressing, cleaning or otherwise conditioning lapping tools · CPC title

• B23K26/36

  Removing material (B23K26/55, B23K26/57 take precedence) · CPC title