Microphone manufacturing method, microphone, and control method

Patent metadata

Field	Value
Publication number	US-9485571-B2
Application number	US-201514798716-A
Country	US
Kind code	B2
Filing date	Jul 14, 2015
Priority date	Nov 28, 2014
Publication date	Nov 1, 2016
Grant date	Nov 1, 2016

Abstract

A method of manufacturing a microphone, a microphone, and a method of controlling the microphone are provided. The method includes forming a sound sensing module on a mainboard having a first sound aperture, to be connected with the first sound aperature and forming a cover having a second sound aperature that corresponds to the first sound aperature, mounted on the mainboard, and housing the sound sensing module. A first and second sound delay filters are formed in a space defined by the cover, to be connected with the second sound hole and thermal actuators are disposed at both sides of the first sound delay filter and move the first sound delay filter based on whether power is supplied. A semiconductor chip is electrically connected with the sound sensing module in the space and selectively operates the thermal actuators in response to signals from the sound sensing module.

First claim

What is claimed is:

1. A microphone comprising:
a sound sensing module mounted on a side of a mainboard having a first sound aperture and connected to the first sound aperture;
a cover that has a second sound aperture that corresponds to the first sound aperture, mounted on the mainboard, and has a space receiving the sound sensing module;
a first sound delay filter disposed in the space;
a second sound delay filter bonded to the top of the first sound delay filter by metal pads and is connected to the second sound aperture in the cover;
a plurality of thermal actuators disposed at both sides of the first sound delay filter and move the first sound delay filter; and
a semiconductor chip electrically configured to the sound sensing module in the space and selectively operates the thermal actuators in response to signals from the sound sensing module.

2. The microphone of claim 1 , wherein the first sound delay filter includes:
a first substrate having a groove; and
a driving membrane disposed on the first substrate, has a plurality of coupling apertures and a plurality of penetration apertures, and has a center section divided to have the first penetration apertures formed by a coupling material deposited in the coupling apertures.

3. The microphone of claim 1 , wherein the second sound delay filter includes:
a second substrate having a plurality of third penetration apertures;
an oxide film and a bonding layer disposed on the second substrate and having a plurality of second penetration apertures; and
metal pads disposed on the bonding layer.

4. The microphone of claim 2 , wherein the first to third penetration apertures are connected to each other and form a plurality of sound delay apertures of as many as the number of penetration apertures.

5. The microphone of claim 3 , wherein the first to third penetration apertures are connected to each other and form a plurality of sound delay apertures of as many as the number of penetration apertures.

6. The microphone of claim 3 , wherein the second sound delay filter is turned over and then bonded to the first sound delay filter by the metal pads on the top of the second sound delay filter.

7. The microphone of claim 1 , wherein the thermal actuators include a first thermal actuator and a second thermal actuator, disposed at both sides of the first sound delay filter, and move the center section using an extending force generated when a current is supplied.

Assignees

• Hyundai Motor Co Ltd

Inventors

• Yoo Ilseon

Classifications

• H04R3/00 Primary

  Circuits for transducers (arrangements for producing a reverberation or echo sound G10K15/08; amplifiers H03F) · CPC title

• H04R31/00 Primary

  Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor {(manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182)} · CPC title

• H04R1/20

  Arrangements for obtaining desired frequency or directional characteristics (for stereophonic purpose H04R5/00) · CPC title

• H04R2201/003

  Mems transducers or their use · CPC title

• H04R31/003

  for diaphragms or their outer suspension · CPC title