Pulsed remote plasma method and system

US9484191B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9484191-B2
Application numberUS-201313791339-A
CountryUS
Kind codeB2
Filing dateMar 8, 2013
Priority dateMar 8, 2013
Publication dateNov 1, 2016
Grant dateNov 1, 2016

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

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A system and method for providing pulsed excited species from a remote plasma unit to a reaction chamber are disclosed. The system includes a pressure control device to control a pressure at the remote plasma unit as reactive species from the remote plasma unit are pulsed to the reaction chamber.

First claim

Opening claim text (preview).

What is claimed is: 1. A remote plasma system comprising: a reactor comprising a reaction chamber; a remote plasma unit fluidly coupled to the reaction chamber and to a vacuum source; a pressure control device in fluid communication with and interposed between the remote plasma unit and the vacuum source, wherein the pressure control device controls an operating pressure of the remote plasma unit located upstream of the pressure control device; a control valve between the remote plasma unit and the reaction chamber to pulse species from the remote plasma unit to the reaction chamber; and a controller coupled to the pressure control device and to the control valve, the controller configured to simultaneously control the pressure control device and the control valve, so that the remote plasma unit operates under steady-state conditions as the species are pulsed to the reaction chamber. 2. The remote plasma system of claim 1 , further comprising at least one flow control unit coupled to the remote plasma unit. 3. The remote plasma system of claim 1 , wherein the reactor is selected from the group consisting of a plasma-enhance chemical vapor deposition reactor, a plasma-enhanced atomic layer deposition reactor, a plasma-enhanced etch reactor, a plasma-enhanced clean reactor, and a plasma-enhanced treatment reactor. 4. The remote plasma system of claim 1 , wherein the pressure control device is a closed-loop pressure control device. 5. The remote plasma system of claim 1 , wherein the control valve is a fast-response pneumatic valve. 6. The remote plasma system of claim 1 , further comprising an integrated inlet manifold block to allow mixing of the species with another gas prior to the species and gas entering a gas distribution system. 7. A remote plasma-enhanced atomic layer deposition system comprising: an atomic layer deposition reactor comprising a reaction chamber; a remote plasma unit in fluid communication with the reaction chamber and a vacuum source; a first reactant source in fluid communication with the remote plasma unit; a pressure control device in fluid communication with and interposed between the remote plasma unit and the vacuum source, wherein the pressure control device controls an operating pressure of the remote plasma unit located upstream of the pressure control device; a control valve between the remote plasma unit and the reaction chamber; and a controller coupled to the pressure control device and to the control valve, the controller configured to simultaneously control the pressure control device and the control valve, so that the remote plasma unit operates under steady-state conditions as species from the remote plasma unit are pulsed to the reaction chamber. 8. The remote plasma-enhanced atomic layer deposition system of claim 7 , wherein the pressure control device is a closed-loop pressure control device. 9. The remote plasma-enhanced atomic layer deposition system of claim 7 , further comprising an integrated manifold block to allow mixing of species generated by the remote plasma unit and another gas prior to entering a gas distribution system. 10. The remote plasma-enhanced atomic layer deposition system of claim 9 , wherein the gas distribution system comprises a showerhead. 11. The remote plasma-enhanced atomic layer deposition system of claim 9 , further comprising one or more flow controllers coupled to the integrated manifold block. 12. The remote plasma-enhanced atomic layer deposition system of claim 9 , further comprising one or more flow controllers fluidly coupled to the remote plasma unit.

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What does patent US9484191B2 cover?
A system and method for providing pulsed excited species from a remote plasma unit to a reaction chamber are disclosed. The system includes a pressure control device to control a pressure at the remote plasma unit as reactive species from the remote plasma unit are pulsed to the reaction chamber.
Who is the assignee on this patent?
Asm Ip Holding Bv
What technology area does this patent fall under?
Primary CPC classification H01J37/32449. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 01 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).