Solid PCD cutter

US9482056B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9482056-B2
Application numberUS-201213719326-A
CountryUS
Kind codeB2
Filing dateDec 19, 2012
Priority dateDec 30, 2011
Publication dateNov 1, 2016
Grant dateNov 1, 2016

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A cutting element may be formed by placing a plurality of diamond particles adjacent to a substrate in a reaction cell and subjecting the plurality of diamond particles to high pressure high temperature conditions to form a polycrystalline diamond body. The polycrystalline diamond body may have a cutting face area to thickness ratio ranging from 60:16 to 500:5 and at least one dimension greater than 8 mm.

First claim

Opening claim text (preview).

What is claimed is: 1. A cutting element comprising a polycrystalline diamond body, wherein the polycrystalline diamond body comprises: a cutting face; a thickness of the polycrystalline body extending from the cutting face; and a cutting face area to thickness ratio ranging from 60:16 to 500:5; wherein the thickness of the polycrystalline body is greater than or equal to 8 mm and less than or equal to 16 mm. 2. The cutting element of claim 1 , wherein the cutting face has a diameter greater than or equal to 8 mm. 3. The cutting element of claim 1 , further comprising a substrate. 4. The cutting element of claim 3 , wherein the substrate comprises a first region adjacent to the diamond body and at least one additional region adjacent to the first region opposite from the diamond body, wherein the first region comprises hard particles having a smaller median grain size than hard particles of the at least one additional region. 5. The cutting element of claim 3 , wherein the substrate comprises a first region adjacent to the diamond body and a second region, wherein the first region comprises carbide particles ranging in size from about 2 microns to 3 microns, and wherein the second region ranges in size from about 4 microns to about 6 microns. 6. The cutting element of claim 1 , wherein the diamond body comprises thermally stable polycrystalline diamond. 7. The cutting element of claim 1 , wherein at least one acid infusion pathway is formed in the diamond body. 8. The cutting element of claim 1 , wherein the polycrystalline diamond body comprises boron additive. 9. The cutting element of claim 1 , wherein the polycrystalline diamond body has a bulk thermal conductivity of greater than 200 W/mK. 10. The cutting element of claim 1 , wherein the polycrystalline diamond body comprises a plurality of bonded together diamond grains and a carbonate solvent catalyst. 11. The cutting element of claim 1 , wherein the polycrystalline diamond body comprises a diamond gradient. 12. A drill bit, comprising: a bit body having a rotational axis extending there through; at least one cutter pocket formed in the drill bit; and at least one cutting element positioned in the at least one cutter pocket, wherein the at least one cutting element comprises a polycrystalline diamond body, and wherein the polycrystalline diamond body comprises: a cutting face; a thickness of the polycrystalline diamond body extending from the cutting face to a distance within the cutter pocket; and a cutting face area to thickness ratio ranging from 60:16 to 500:5; wherein the thickness of the polycrystalline diamond body is greater than or equal to 8 mm and less than or equal to 16 mm; and wherein the at least one cutting element is positioned in the at least one cutter pocket such that the cutting face faces in the direction of rotation of the drill bit. 13. The drill bit of claim 12 , wherein the at least one cutting element is fixed within the at least one cutter pocket. 14. The cutting element of claim 12 , wherein the at least one cutting element is rotatably mounted to the at least one cutter pocket. 15. A drill bit, comprising: a bit body having a rotational axis extending there through; at least one cutter pocket formed in the drill bit; and at least one cutting element positioned in the at least one cutter pocket, wherein the at least one cutting element comprises a polycrystalline diamond body having a thickness greater than or equal to 8 mm and less than or equal to 16 mm and has a bulk thermal conductivity of greater than 100 W/mK; wherein the at least one cutting element is positioned in the at least one cutter pocket such that the cutting face faces in the direction of rotation of the drill bit. 16. The drill bit of claim 15 , wherein the polycrystalline diamond body has a bulk thermal conductivity of greater than 200 W/mK. 17. The drill bit of claim 15 , wherein the at least one cutting element is fixed within the at least one cutter pocket. 18. The drill bit of claim 15 , wherein the at least one cutting element is rotatably mounted to the at least one cutter pocket.

Assignees

Inventors

Classifications

  • E21B10/46Primary

    characterised by wear resisting parts, e.g. diamond inserts · CPC title

  • Alloys containing diamond {or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes} · CPC title

  • based on carbon, e.g. graphite · CPC title

  • Cutting tools, earth boring or grinding tool other than table ware · CPC title

  • characterised by the composition · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9482056B2 cover?
A cutting element may be formed by placing a plurality of diamond particles adjacent to a substrate in a reaction cell and subjecting the plurality of diamond particles to high pressure high temperature conditions to form a polycrystalline diamond body. The polycrystalline diamond body may have a cutting face area to thickness ratio ranging from 60:16 to 500:5 and at least one dimension greater…
Who is the assignee on this patent?
Smith International
What technology area does this patent fall under?
Primary CPC classification E21B10/46. Mapped technology areas include Fixed Constructions.
When was this patent published?
Publication date Tue Nov 01 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).