Electronic control apparatus

Patent metadata

Field	Value
Publication number	US-9480189-B2
Application number	US-201314424099-A
Country	US
Kind code	B2
Filing date	Sep 12, 2013
Priority date	Sep 21, 2012
Publication date	Oct 25, 2016
Grant date	Oct 25, 2016

Abstract

A heat-generating component ( 3 ) is mounted on a surface ( 4 b ), on a case ( 12 ) side, of a circuit board ( 4 ). A recessed portion ( 5 ) is formed in a position facing the heat-generating component ( 3 ), on an inner wall surface ( 12 e ) side of a bottom wall ( 12 a ) of the case ( 12 ). Between an inner wall surface ( 5 a ) of this recessed portion ( 5 ) and the heat-generating component ( 3 ), a predetermined-sized component clearance (Ca) is provided, and a heat radiation member ( 6 ) is interposed in a position of the component clearance (Ca). A peripheral clearance (Cb) is provided between the surface ( 4 b ), on the case ( 12 ) side, of the circuit board ( 4 ) and the inner wall surface ( 12 e ) of the bottom wall ( 12 a ) of the case ( 12 ) on a peripheral edge side of the recessed portion ( 5 ).

First claim

The invention claimed is:

1. An electronic control apparatus accommodating, in a space inside an enclosure formed by connecting a plurality of enclosure members together, a circuit board on which a plurality of heat-generating electronic components that generate heat are mounted, comprising:
a recessed portion formed in a position facing each heat-generating electronic component in the enclosure member that faces each heat-generating electronic component, and
a component clearance being formed between an inner wall surface of the recessed portion and each heat-generating electronic component,
a peripheral clearance, which is set with a distance from an opening edge of the recessed portion to the circuit board being a reference, being formed between the circuit board and the enclosure member on at least one peripheral edge side of each heat-generating electronic component, and
hollows disposed between the plurality of heat-generating electronic components communicating with each other through the peripheral clearance.

2. The electronic control apparatus as claimed in claim 1 , wherein:
a heat radiation member is interposed between the recessed portion and each heat-generating electronic component.

3. The electronic control apparatus as claimed in claim 1 , wherein:
at least a part of each heat-generating electronic component is encircled by the inner wall surface of the recessed portion.

4. The electronic control apparatus as claimed in claim 1 , wherein the recessed portion projects below all other portions of the enclosure member.

Assignees

• Hitachi Automotive Systems Ltd

Inventors

• Kawai Yoshio
• Ohhashi Hironori
• Yanagisawa Yuuichi
• Yoshinaga Kumiko
• Ichikawa Eiji

Classifications

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H05K7/20854 Primary

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20863 takes precedence) · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K7/20409

  Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title

• H01L23/3675

  Electricity · mapped topic