Polyamide resin, epoxy resin compositions, and cured articles thereof

Patent metadata

Field	Value
Publication number	US-9480154-B2
Application number	US-98859306-A
Country	US
Kind code	B2
Filing date	Jul 19, 2006
Priority date	Jul 21, 2005
Publication date	Oct 25, 2016
Grant date	Oct 25, 2016

Abstract

Provided herein are a phenolic hydroxyl group-containing aromatic polyamide resin and a resin composition containing the resin, such as an epoxy resin composition containing an epoxy resin. The phenolic hydroxyl group-containing aromatic polyamide resin has a structure represented by the following formula (1):

wherein m and n are average values satisfying the following formula: 0.005≦n/(m+n)<0.05, m+n is a positive value of 2 to 200, Ar 1 is a bivalent aromatic group, Ar 2 is a phenolic hydroxyl group-containing bivalent aromatic group, and Ar 3 is a bivalent aromatic group. Such a phenolic hydroxyl group-containing aromatic polyamide resin has a low ionic impurity content and improved adhesive properties as well as excellent properties inherent in conventional phenolic hydroxyl group-containing aromatic polyamide resins, such as the ability to allow a cured epoxy resin composition to have excellent flexibility, electrical properties, flame retardancy, and the like.

First claim

The invention claimed is:

1. A polyamide resin obtained by polycondensing hydroxyisophthalic acid, isophthalic acid and either 3,4-diaminodiphenylether or 4,4-diaminodiphenylether in the presence of a phosphite ester, a pyridine derivative and an inorganic salt, the polyamide resin having a structure represented by the following formula (5):

wherein m and n are average values satisfying the following formula: 0.01≦n/(m+n)≦0.03, m+n is a positive value of 30 to 200, x represents the average number of substituents and is a positive value of 1 to 4, and Ar 3 is a bivalent aromatic group of the following formula that is a residue of 3,4-diaminodiphenylether or 4,4-diaminodiphenylether:

the polyamide resin having an equivalent weight of active hydrogen capable of reacting with an epoxy group of 2,000 to 10,000 g/eq, and both ends of said polyamide resin are amino groups.

2. The polyamide resin according to claim 1 , which has an intrinsic viscosity as measured at a concentration of 0.5 gi/dl in N,N-dimethylacetamide solution at 30° C. of 0.3 to 4.0 dl/g.

3. A film obtained by forming an epoxy resin composition comprising the following components: (1) the polyamide resin according to claim 1 ; and (2) only an epoxy resin or both an organic solvent and an epoxy resin, into a sheet shape.

4. A cured product of the film according to claim 3 .

5. An adhesive sheet for flexible printed wiring boards, comprising: a layer composed of an epoxy resin composition comprising the following components: (1) the polyamide resin according to claim 1 ; and (2) only an epoxy resin or both an organic solvent and an epoxy resin, a layer composed of a film obtained by forming said epoxy resin composition into a sheet shape, or a layer composed of a cured product thereof.

6. A reinforcing plate for flexible printed wiring boards, comprising: a layer composed of an epoxy resin composition comprising the following components: (1) the polyamide resin according to claim 1 ; and (2) only an epoxy resin or both an organic solvent and an epoxy resin, a layer composed of a film obtained by forming said epoxy resin composition into a sheet shape, or a layer composed of a cured product thereof.

7. A coverlay for flexible printed wiring boards, comprising: a layer composed of an epoxy resin composition comprising the following components: (1) the polyamide resin according to claim 1 ; and (2) only an epoxy resin or both an organic solvent and an epoxy resin, a layer composed of a film obtained by forming said epoxy resin composition into a sheet shape, or a layer composed of a cured product thereof.

8. A single- or double-sided metal-clad resin laminate characterized in that a metal foil or a polyimide-clad metal foil is bonded to one side or both sides of a layer composed of an epoxy resin composition comprising the following components: (1) the polyamide resin according to claim 1 ; and (2) only an epoxy resin or both an organic solvent and an epoxy resin, or of a layer composed of a film obtained by forming said epoxy resin composition into a sheet shape, or of a layer composed of a cured product thereof so that one surface of the metal foil or the polyimide film surface of the polyimide-clad metal foil is brought into contact with the surface(s) of the layer.

9. A flexible printed wiring board, comprising a layer composed of an epoxy resin composition comprising the following components: (1) the polyamide resin according to claim 1 ; and (2) only an epoxy resin or both an organic solvent and an epoxy resin, a layer composed of a film obtained by forming said epoxy resin composition into a sheet shape, or a layer composed of a cured product thereof.

Assignees

• Ishikawa Kazunori
• Uchida Makoto
• Akatsuka Yasumasa
• Nippon Kayaku Kk

Inventors

• Ishikawa Kazunori
• Uchida Makoto
• Akatsuka Yasumasa

Classifications

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title

• C08G69/265

  from at least two different diamines or at least two different dicarboxylic acids · CPC title

• C08G59/54

  Amino amides> · CPC title

• B32B27/08

  of synthetic resin · CPC title

• Y10T428/31515

  As intermediate layer · CPC title