Tungsten sintered compact sputtering target and method for producing same
US-2015357170-A1 · Dec 10, 2015 · US
US9478961B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9478961-B2 |
| Application number | US-201314371577-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 28, 2013 |
| Priority date | May 29, 2012 |
| Publication date | Oct 25, 2016 |
| Grant date | Oct 25, 2016 |
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The present invention related to an iron bus bar coated with copper and a method of manufacturing the same. The present invention provides an iron bus bar including an iron core and a copper layer applied on the iron core, and a method of manufacturing the same. According to the present invention, an iron bus bar having high strength and durability as well as excellent electrical conductivity can be manufactured at low cost.
Opening claim text (preview).
The invention claimed is: 1. An iron bus bar, comprising: an iron core comprised of an iron-containing material; a copper layer formed on the surface of the iron core to a thickness of 10 to 30 μm; a corrosion-resistant layer formed on the surface of the copper layer to a thickness of 1 μm or less; and a buffer layer formed between the iron core and the copper layer, the buffer layer comprising: a first buffer layer formed on the iron core to have a thickness of 1 μm or less from the surface of the iron core and including iron in an amount of 92.4 to 100 wt % at an interface thereof making contact with the iron core; and a second buffer layer formed between the first buffer layer and the copper layer to have a thickness of 1 μm or less and including copper in an amount of 95.9 to 100 wt % at an interface thereof making contact with the copper layer; wherein the corrosion-resistant layer includes Cu and at least one selected from the group consisting of Sn, Cr, Zr and Ag; the content of Cu in the corrosion-resistant layer reduced as the distance from the surface of the corrosion-resistant layer decreases; and the buffer layer is configured such that the first buffer layer and the second buffer layer are alternately and repeatedly formed two or more times. 2. The iron bus bar of claim 1 , wherein the iron-containing material is any one selected from the group consisting of pure iron, carbon steel, stainless steel, a Fe—Al alloy and a Fe—Cu alloy. 3. The iron bus bar of claim 1 , wherein the corrosion-resistant layer includes 0 to 15.9 wt % of any one selected from the group consisting of Sn, Cr, Zr and Ag and 84.2 to 100 wt % of Cu at an interface thereof making contact with the copper layer. 4. The iron bus bar of claim 1 , further comprising an uppermost layer having a thickness of 1 μm or less and including at least one of Ag and Ti, which is formed on the surface of the corrosion-resistant layer.
mainly consisting of metals or alloys · CPC title
Graded interfaces · CPC title
by cathodic sputtering · CPC title
Sputtering · CPC title
using more than one target (C23C14/56 takes precedence) · CPC title
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