Laser device with non-absorbing mirror, and method
US-11824322-B2 · Nov 21, 2023 · US
US9478944B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9478944-B2 |
| Application number | US-201414460090-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 14, 2014 |
| Priority date | Sep 4, 2007 |
| Publication date | Oct 25, 2016 |
| Grant date | Oct 25, 2016 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A semiconductor laser element includes: a window region including a disordered portion formed by diffusion of a group-III vacancy, the diffusion promoted by providing on the window region a promoting film that absorbs a predetermined atom; a non-window region including an active layer of a quantum well structure; and a difference equal to or larger than 50 meV between an energy band gap in the window region and an energy band gap in the non-window region.
Opening claim text (preview).
What is claimed is: 1. A semiconductor laser element, comprising: an active layer; a window region including a disordered portion formed by diffusion of a group-III vacancy, the window region including an impurity free disordered portion of the active layer; a non-window region including a portion of the active layer having a quantum well structure; a layer near the active layer, the layer being doped with a p-impurity an impurity that preferentially substitutes a group-V site; a layer including zinc and being formed above the layer near the active layer, and a contact layer made of only GaAs and dopants and formed above the active layer to inject a carrier into the active layer, wherein the GaAs contact layer includes the layer including zinc, and the GaAs contact layer includes a first GaAs contact layer doped with the p-impurity that preferentially substitutes the group-V site and a second GaAs contact layer which is the layer including zinc and being formed above the first GaAs contact layer. 2. The semiconductor laser element according to claim 1 , wherein the layer including zinc is formed in the non-window region. 3. The semiconductor laser element according to claim 1 , further comprising a current non-injecting layer that is provided between the first GaAs contact layer and the second GaAs contact layer, constricts a current injected from outside, and supplies the current to the active layer. 4. The semiconductor laser element according to claim 1 , wherein the impurity that preferentially substitutes the group-V site is carbon. 5. The semiconductor laser element according to claim 1 , wherein the active layer does not include zinc in the non-window region. 6. The semiconductor laser element according to claim 1 , wherein a difference between an energy band gap in the window region and an energy band gap in the non-window region is equal to or larger than 50 meV. 7. The semiconductor laser element according to claim 1 , wherein the impurity that preferentially substitutes the group-V site has a diffusion coefficient equal to or smaller than 3×10 −14 cm 2 /s at a thermal treatment temperature at which the disordered portion is formed. 8. The semiconductor laser element according to claim 1 , further comprising a guide layer being formed above the active layer, the guide layer is doped with the impurity that preferentially substitutes the group-V site at least at a side of the active layer. 9. The semiconductor laser element according to claim 8 , wherein a doping concentration of the impurity that preferentially substitutes the group-V site in the guide layer is 0.1 to 1.0×10 17 cm 3 . 10. The semiconductor laser element according to claim 1 , wherein a thickness between the layer including zinc of the GaAs contact layer and the active layer is equal to or greater than 1400 nanometers. 11. The semiconductor laser element according to claim 10 , further comprising a cladding layer being dope with the p-impurity that preferentially substitutes the group-V site and being disposed between the layer including zinc of the GaAs contact layer and the active layer, wherein a thickness of the cladding layer is equal to or greater than 1 μm.
IV compounds · CPC title
p-doping · CPC title
with window regions made by diffusion or disordening of the active layer · CPC title
with window regions comprising current blocking layers · CPC title
with window regions comprising semiconductor material with a wider bandgap than the active layer · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.