Optoelectronic component having a UV-protecting substrate and method for producing the same

Patent metadata

Field	Value
Publication number	US-9478761-B2
Application number	US-201314396780-A
Country	US
Kind code	B2
Filing date	Apr 11, 2013
Priority date	Apr 26, 2012
Publication date	Oct 25, 2016
Grant date	Oct 25, 2016

Abstract

An optoelectronic component may include a carrier, a protective layer on or above the carrier, a first electrode on or above the protective layer, an organic functional layer structure on or above the first electrode, and a second electrode on or above the organic functional layer structure. The protective layer has a lower transmission than the carrier for electromagnetic radiation having a wavelength of less than approximately 400 nm at least in one wavelength range. The protective layer includes a glass.

First claim

The invention claimed is:

1. An optoelectronic component, comprising:
a carrier;
a protective layer on or above the carrier;
a first electrode on or above the protective layer;
an organic functional layer structure on or above the first electrode; and
a second electrode on or above the organic functional layer structure;
wherein the protective layer comprises a matrix and UV-absorbing particles, wherein the matrix comprises a glass and wherein the UV-absorbing particles are formed as scattering centers and are applied on or above the carrier, and the UV-absorbing particles being embedded in the matrix such that the protective layer has a lower transmission than the carrier for electromagnetic radiation within at least one of a plurality of respective wavelength ranges having an upper range bound value that is less than approximately 400 nm; and

wherein the protective layer has a thickness in a range of 1 μm to 100 μm.

2. The optoelectronic component as claimed in claim 1 , wherein the carrier is embodied in a planar fashion.

3. The optoelectronic component as claimed in claim 1 , wherein the carrier comprises a soft glass or is formed therefrom.

4. The optoelectronic component as claimed in claim 3 , wherein the soft glass is a soda-lime silicate glass.

5. The optoelectronic component as claimed in claim 1 , wherein the matrix of the protective layer has a refractive index of greater than approximately 1.7.

6. The optoelectronic component as claimed in claim 5 , wherein the matrix of the protective layer is embodied in an amorphous fashion.

7. The optoelectronic component as claimed in claim 1 , wherein the matrix of the protective layer is embodied in an amorphous fashion.

8. The optoelectronic component as claimed in claim 1 , wherein the matrix of the protective layer comprises or is formed from a substance or substance mixture from the group of glass systems: PbO-containing systems: PbO—B 2 O 3 , PbO—SiO 2 , PbO—B 2 O 3 —SiO 2 , PbO—B 2 O 3 —ZnO 2 , PbO—B 2 O 3 —Al 2 O 3 ; Bi 2 O 3 -containing systems: Bi 2 O 3 —B 2 O 3 , Bi 2 O 3 —B 2 O 3 —SiO 2 , Bi 2 O 3 —B 2 O 3 —ZnO, Bi 2 O 3 —B 2 O 3 —ZnO—SiO 2 .

9. The optoelectronic component as claimed in claim 8 , wherein the substance or the substance mixture of the matrix further comprises or is formed from a substance from the group of substances: Ce, Fe, Sn, Ti, Pr, Eu and/or V compounds.

10. The optoelectronic component as claimed in claim 1 , wherein one type of the UV-absorbing particles comprises or is formed from a substance or substance mixture or a stoichiometric compound from the group of substances: TiO 2 , CeO 2 , Bi 2 O 3 , ZnO, SnO 2 , phosphors: Ce 3+ doped garnets such as YAG:Ce and LuAG, Eu 3+ doped nitrides, sulfides, SIONS, sialon, orthosilicates, chlorosilicates, chlorophosphates, BAM (barium magnesium aluminate:Eu) and/or SCAP, halophosphate, glass particles, metallic nanoparticles.

11. The optoelectronic component as claimed in claim 1 , wherein the optoelectronic component is embodied as an organic light emitting diode or as an organic solar cell.

12. A method for producing an optoelectronic component, the method comprising:
forming a protective layer on or above a carrier;
forming a first electrode on or above the protective layer;
forming an organic functional layer structure on or above the first electrode; and
forming a second electrode on or above the organic functional layer structure;
wherein the protective layer is designed having a matrix and UV-absorbing particles, the matrix comprising a glass and the UV-absorbing particles are formed as scattering centers and are applied on or above the carrier and being embedded in the matrix in such a way that the protective layer has a lower transmission of electromagnetic radiation than the carrier for electromagnetic radiation within at least one of a plurality of respective wavelength ranges having an upper range bound value that is less than approximately 400 nm; and

wherein the protective layer is formed having a thickness in a range of 1 μm to 100 μm.

13. The method as claimed in claim 12 ,
wherein forming the protective layer comprises applying a glass solder powder to or above the carrier, wherein the glass solder powder is liquefied in order to form the protective layer.

14. The method as claimed in claim 13 ,
wherein the UV-absorbing particles are added to the glass solder powder before the glass solder powder is applied to the carrier.

15. The method as claimed in claim 14 ,
the glass solder powder are applied on or above the ply of UV-absorbing scattering centers, and the glass is liquefied in such a way that one part of the liquefied glass flows between the scattering centers toward the surface of the carrier in such a way that another part of the liquefied glass remains above the scattering centers.

16. The method as claimed in claim 13 , the glass solder powder are applied on or above the ply of UV-absorbing scattering centers, and the glass is liquefied in such a way that one part of the liquefied glass flows between the scattering centers toward the surface of the carrier in such a way that another part of the liquefied glass remains above the scattering centers.

Assignees

• Osram Oled Gmbh

Inventors

• Setz Daniel Steffen
• Eberhardt Angela
• Deisenhofer Manfred
• Wille Christina

Classifications

• H10K50/854

  comprising scattering means · CPC title

• H10K30/88

  Passivation; Containers; Encapsulations · CPC title

• C03C8/14 Primary

  Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions · CPC title

• Y02E10/549

  Organic PV cells · CPC title

• H01L51/5253

  Electricity · mapped topic