IR sensor package including a cover member and a sensor chip recessed into the package body

Patent metadata

Field	Value
Publication number	US-9478682-B2
Application number	US-201113806111-A
Country	US
Kind code	B2
Filing date	Jun 23, 2011
Priority date	Jun 24, 2010
Publication date	Oct 25, 2016
Grant date	Oct 25, 2016

Abstract

The infrared sensor includes: an infrared sensor chip in which a plurality of pixel portions each including a temperature-sensitive portion formed of a thermopile is disposed in an array on one surface side of a semiconductor substrate; and an IC chip that processes an output signal of the infrared sensor chip. A package includes a package main body on which the infrared sensor chip and the IC chip are mounted to be arranged side-by-side, and a package cover that has a lens transmitting infrared rays and is hermetically bonded to the package main body. The package is provided therein with a cover member that includes a window hole through which infrared rays pass into the infrared sensor chip and equalizes amounts of temperature change of hot junctions and cold junctions among the pixel portions, the temperature change resulting from heating of the IC chip.

First claim

The invention claimed is:

1. An infrared sensor comprising:
an infrared sensor chip in which a plurality of pixel portions is disposed in an array on one surface side of a semiconductor substrate, each of said pixel portions including a temperature-sensitive portion formed of a thermopile;
an IC chip configured to process an output signal of said infrared sensor chip; and
a package in which said infrared sensor chip and said IC chip are accommodated,
wherein said package includes: a package main body having a first region and a second region on which said infrared sensor chip and said IC chip are mounted, respectively, to be arranged side-by-side; and a package cover which is hermetically bonded to said package main body so as to surround said infrared sensor chip and said IC chip together with said package main body, said package cover having a function of transmitting infrared rays to be detected by said infrared sensor chip,
said package is provided therein with a cover member which includes a hole through which infrared rays pass into said infrared sensor chip, said cover member equalizing, among the pixel portions, the amounts of temperature change of hot junctions and cold junctions caused by heating of said IC chip,
said cover member is formed such that both said IC chip and said infrared sensor chip are included within a region of a circumferential line of said cover member in a thickness direction of the IC chip, and
the second region is recessed into the package main body relative to the first region.

2. The infrared sensor according to claim 1 , wherein said cover member is configured such that said hole has a rectangular shape, and an inner circumferential line of said hole closer to said IC chip is located closer to said IC chip than an outer circumferential line of said infrared sensor chip closer to said IC chip in a plan view.

3. The infrared sensor according to claim 1 , wherein said IC chip is a heat-emitting element.

4. The infrared sensor according to claim 1 , wherein said cover member is formed of a conductive material.

5. The infrared sensor according to claim 4 , wherein said cover member is bonded to said package main body by a conductive material.

6. The infrared sensor according to claim 1 , wherein said cover member includes a front plate portion which is located on a front side of said infrared sensor chip and in which said hole is formed, and a side plate portion which is extended toward a rear side from said front plate portion and is bonded to said package main body.

7. The infrared sensor according to claim 6 , wherein said cover member is disposed in proximity to both said infrared sensor chip and said IC chip.

8. The infrared sensor according to claim 6 , wherein the front plate portion is formed in such a size that at least said infrared sensor chip is included in a projection region of an outer circumferential line of said front plate portion.

9. An infrared sensor comprising:
an infrared sensor chip in which a plurality of pixel portions is disposed in an array on one surface side of a semiconductor substrate, each of said pixel portions including a temperature-sensitive portion formed of a thermopile; and
a package in which said infrared sensor chip is accommodated,
wherein said package includes a package cover which is bonded to said package,
said package is provided therein with a heat-emitting element and a cover member,
said cover member includes a hole through which infrared rays pass into said infrared sensor chip,
said cover member is formed such that both said heat-emitting element and said infrared sensor chip are included in a region of a circumferential line of said cover member in a thickness direction of the heat-emitting element,
said package having a first region and a second region on which said infrared sensor chip and said heat-emitting element are mounted, respectively, and
the second region is recessed into the package relative to the first region.

10. The infrared sensor according to claim 9 , wherein the heat-emitting element is an IC chip configured to process an output signal of said infrared sensor chip.

11. The infrared sensor according to claim 9 , wherein said cover member has a function of equalizing, among the pixel portions, the amounts of temperature change of hot junctions and cold junctions caused by heating of said heat-emitting element.

12. The infrared sensor according to claim 9 , wherein said package includes a package main body on which said infrared sensor chip and said heat-emitting element are mounted to be arranged side-by-side.

13. The infrared sensor according to claim 9 , wherein said package cover is hermetically bonded to said package so as to surround said infrared sensor chip and said heat-emitting element together with said package.

14. The infrared sensor according to claim 9 , wherein said package cover has a function of transmitting infrared rays to be detected by said infrared sensor chip.

15. The infrared sensor according to claim 9 , wherein said cover member is configured such that said hole has a rectangular shape, and an inner circumferential line of said hole closer to said heat-emitting element is located closer to said heat-emitting element than an outer circumferential line of said infrared sensor chip closer to said heat-emitting element in a plan view.

16. The infrared sensor according to claim 9 , wherein said cover member is formed of a conductive material.

17. The infrared sensor according to claim 16 , wherein said cover member is bonded to said package by the conductive material.

18. The infrared sensor according to claim 9 , wherein said cover member includes a front plate portion which is located on a front side of said infrared sensor chip and in which said hole is formed, and a side plate portion which is extended toward a rear side from said front plate portion and is bonded to said package.

19. The infrared sensor according to claim 18 , wherein said cover member is disposed in proximity to both said infrared sensor chip and said heat-emitting element.

20. The infrared sensor according to claim 18 , wherein the front plate portion is formed in such a size that at least said infrared sensor chip is included in a projection region of an outer circumferential line of said front plate portion.

Assignees

• Kirihara Masao
• Yamanaka Hiroshi
• Sanagawa Yoshiharu
• Aketa Takanori
• Nakamura Yushi
• Ueda Mitsuhiko
• Panasonic Ip Man Co Ltd

Inventors

• Kirihara Masao
• Yamanaka Hiroshi
• Sanagawa Yoshiharu
• Aketa Takanori
• Nakamura Yushi
• Ueda Mitsuhiko

Classifications

• H10W40/00

  Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title

• G01J5/0801

  Means for wavelength selection or discrimination · CPC title

• H10F77/60 Primary

  Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations · CPC title

• H01L31/024 Primary

  Electricity · mapped topic

• H01L2924/00

  Electricity · mapped topic