Semiconductor device and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9478604-B2
Application number	US-201514682181-A
Country	US
Kind code	B2
Filing date	Apr 9, 2015
Priority date	Mar 28, 2002
Publication date	Oct 25, 2016
Grant date	Oct 25, 2016

Abstract

A semiconductor device provided with a silicon carbide semiconductor substrate, and an ohmic metal layer joined to one surface of the silicon carbide semiconductor substrate in an ohmic contact and composed of a metal material whose silicide formation free energy and carbide formation free energy respectively take negative values. The ohmic metal layer is composed of, for example, a metal material such as molybdenum, titanium, chromium, manganese, zirconium, tantalum, or tungsten.

First claim

What is claim is:

1. A Schottky barrier diode, comprising:
a silicon carbide semiconductor substrate having a silicon surface and a carbon surface;
an ohmic metal layer joined to the carbon surface of the silicon carbide semiconductor substrate in an ohmic contact;
a Schottky metal layer joined to the silicon surface of the silicon carbide semiconductor substrate in a Schottky contact and composed of the same material as that composing the ohmic metal layer; and
a multi-layer metal structure including the Schottky metal layer and another metal layer formed on a surface of the Schottky metal layer, the another metal layer being composed of a metal material different from that of the Schottky metal layer,
wherein the Schottky metal layer is composed of molybdenum, and the another metal layer is composed of any one of aluminum, an aluminum-silicon alloy, and an aluminum-silicon-copper alloy.

2. The Schottky barrier diode according to claim 1 , wherein the ohmic metal layer is composed of molybdenum or an alloy of molybdenum and at least one metal material selected from the group consisting of titanium, chromium, manganese, zirconium, tantalum, and tungsten.

3. The Schottky barrier diode according to claim 1 , comprising a multi-layer metal structure including the ohmic metal layer and another metal layer formed on a surface of the ohmic metal layer, the another metal layer being composed of a metal material different from that of the ohmic metal layer.

4. The Schottky barrier diode according to claim 3 , wherein the ohmic metal layer is composed of molybdenum, and the another metal layer is composed of any one of gold, silver, and a gold-silver alloy.

5. The Schottky barrier diode according to claim 1 , further comprising a titanium metal layer disposed between the ohmic metal layer and the silicon carbide semiconductor substrate.

6. The Schottky barrier diode according to claim 1 , wherein a carrier concentration of a semiconductor layer on a side of the carbon surface of the silicon carbide semiconductor substrate is within a range of 10 17 to 10 21 /cm 3 .

7. The Schottky barrier diode according to claim 1 , wherein a carrier concentration of a first semiconductor layer on a side of the carbon surface of the silicon carbide semiconductor substrate is higher than a carrier concentration of a second semiconductor layer on a side of the silicon surface of the silicon carbide semiconductor substrate.

8. The Schottky barrier diode according to claim 1 , wherein a carrier concentration of a first semiconductor layer on a side of the carbon surface of the silicon carbide semiconductor substrate is within a range of 10 17 to 10 21 /cm 3 , and
a carrier concentration of a second semiconductor layer on a side of the silicon surface of the silicon carbide semiconductor substrate is within a range of 10 14 to 10 16 /cm 3 .

9. The Schottky barrier diode according to claim 1 , further comprising a titanium metal layer disposed between the Schottky metal layer and the silicon carbide semiconductor substrate.

10. The Schottky barrier diode according to claim 1 , further comprising an edge termination formed in the silicon carbide semiconductor substrate so as to be exposed on the silicon surface of the silicon carbide semiconductor substrate, wherein the Schottky metal layer has a peripheral portion disposed on the edge termination.

11. The Schottky barrier diode according to claim 10 , wherein the edge termination contains boron.

12. The Schottky barrier diode according to claim 1 , comprising
a first multi-layer metal structure including the ohmic metal layer and another metal layer formed on a surface of the ohmic metal layer, the another metal layer being composed of a metal material different from that of the ohmic metal layer,
a second multi-layer metal structure including the Schottky metal layer and further another metal layer formed on a surface of the Schottky metal layer, the further another metal layer being composed of a metal material different from that of the Schottky metal layer, and
an edge termination formed in the silicon carbide semiconductor substrate so as to be exposed on the silicon surface of the silicon carbide semiconductor substrate, wherein the Schottky metal layer has a peripheral portion disposed on the edge termination.

Assignees

• Rohm Co Ltd

Inventors

• Okamura Yuji
• Matsushita Masashi

Classifications

• H10W72/5524

  comprising aluminium [Al] · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/923

  Bond pads having multiple stacked layers · CPC title

• H10W72/59

  Bond pads specially adapted therefor · CPC title