Semiconductor device comprising oxide semiconductor film

Patent metadata

Field	Value
Publication number	US-9478535-B2
Application number	US-201314011899-A
Country	US
Kind code	B2
Filing date	Aug 28, 2013
Priority date	Aug 31, 2012
Publication date	Oct 25, 2016
Grant date	Oct 25, 2016

Abstract

A semiconductor device including a capacitor having an increased charge capacity without decreasing an aperture ratio is provided. The semiconductor device includes a transistor including a light-transmitting semiconductor film, a capacitor in which a dielectric film is provided between a pair of electrodes, and a pixel electrode electrically connected to the transistor. In the capacitor, a conductive film formed on the same surface as the light-transmitting semiconductor film in the transistor serves as one electrode, the pixel electrode serves as the other electrode, and a nitride insulating film and a second oxide insulating film which are provided between the light-transmitting semiconductor film and the pixel electrode serve as the a dielectric film.

First claim

What is claimed is:

1. A semiconductor device comprising:
a substrate;
a first insulating film over the substrate;
a second insulating film over the first insulating film;
a third insulating film over the second insulating film;
a fourth insulating film over the third insulating film, the fourth insulating film comprising carbon;
a light-transmitting conductive film over the fourth insulating film;
a transistor comprising:
a gate electrode;
the first insulating film over the gate electrode; and
a semiconductor film over the first insulating film and overlapping the gate electrode, the semiconductor film being electrically connected to the light-transmitting conductive film; and

a capacitor comprising:
a light-transmitting film as a first capacitor electrode over the first insulating film;
the third insulating film and the fourth insulating film as at least part of a capacitor dielectric film over the light-transmitting film and
the light-transmitting conductive film as a second capacitor electrode over the fourth insulating film,

wherein the second insulating film and the third insulating film cover the semiconductor film,
wherein the second insulating film is in direct contact with a first portion of the light-transmitting film, and
wherein the third insulating film is in direct contact with a second portion of the light-transmitting film.

2. The semiconductor device according to claim 1 ,
wherein the first insulating film comprises a first oxide insulating film that is formed by a chemical vapor deposition method using a deposition gas containing silicon and an oxidizing gas, and
wherein the fourth insulating film is a second oxide insulating film that is formed by a chemical vapor deposition method using an organosilane gas.

3. The semiconductor device according to claim 1 , wherein the first insulating film is partly etched in a region under the light-transmitting film.

4. The semiconductor device according to claim 1 , wherein the first capacitor electrode and the semiconductor film are formed from a same film.

5. The semiconductor device according to claim 1 , wherein the first capacitor electrode and the semiconductor film are formed from an oxide semiconductor film.

6. The semiconductor device according to claim 1 ,
wherein the first capacitor electrode and the semiconductor film are formed from an oxide semiconductor film, and
wherein the first capacitor electrode has a higher conductivity than the semiconductor film.

7. The semiconductor device according to claim 1 , further comprising a capacitor line,
wherein the light-transmitting film contains a semiconductor material, and
wherein the semiconductor device is configured so that a potential applied to the capacitor line is constantly lower than a potential to be supplied to the light-transmitting conductive film by a threshold voltage of the capacitor or more when the semiconductor device is used.

8. A display device comprising the semiconductor device according to claim 1 .

9. An electronic device comprising the semiconductor device according to claim 1 .

10. The semiconductor device according to claim 1 ,
wherein the first portion does not overlaps with the second portion.

11. A semiconductor device comprising:
a substrate;
a first insulating film over the substrate, the first insulating film being a first oxide insulating film;
a second insulating film over the first insulating film, the second insulating film being a second oxide insulating film;
a third insulating film over the second insulating film, the third insulating film being a nitride insulating film;
a fourth insulating film over the third insulating film, the fourth insulating film being a third oxide insulating film, and the fourth insulating film comprising carbon;
a light-transmitting conductive film over the fourth insulating film;
a transistor comprising:
a gate electrode;
the first insulating film over the gate electrode; and
a metal oxide semiconductor film over the first insulating film and overlapping the gate electrode, the metal oxide semiconductor film being electrically connected to the light-transmitting conductive film; and

a capacitor comprising:
a light-transmitting film as a first capacitor electrode over the first insulating film;
the third insulating film and the fourth insulating film as at least part of a capacitor dielectric film over the light-transmitting film; and
the light-transmitting conductive film as a second capacitor electrode over the fourth insulating film,

wherein the first insulating film and the second insulating film are each in direct contact with the metal oxide semiconductor film,
wherein the second insulating film and the third insulating film cover the metal oxide semiconductor film,
wherein the second insulating film is in direct contact with a first portion of the light-transmitting film, and
wherein the third insulating film is in direct contact with a second portion of the light-transmitting film.

12. The semiconductor device according to claim 11 ,
wherein the first insulating film is formed by a chemical vapor deposition method using a deposition gas containing silicon and an oxidizing gas, and
wherein the fourth insulating film is formed by a chemical vapor deposition method using an organosilane gas.

13. The semiconductor device according to claim 11 ,
wherein the first insulating film comprises a nitride insulating film under the first oxide insulating film, and
wherein the light-transmitting film is in contact with the nitride insulating film.

14. The semiconductor device according to claim 11 ,
wherein the light-transmitting film and the metal oxide semiconductor film are formed from an oxide semiconductor film, and
wherein the light-transmitting film further contains a dopant at a concentration greater than 1×10 19 atoms/cm 3 and less than or equal to 1×10 22 atoms/cm 3 .

15. The semiconductor device according to claim 11 ,
wherein the light-transmitting film and the metal oxide semiconductor film are formed from an oxide semiconductor film, and
wherein the light-transmitting film contains a higher concentration of nitrogen than the metal oxide semiconductor film.

16. The semiconductor device according to claim 11 ,
wherein the light-transmitting film and the metal oxide semiconductor film are formed from an oxide semiconductor film, and
wherein the light-transmitting film contains a higher concentration of hydrogen than the metal oxide semiconductor film.

17. The semiconductor device according to claim 11 , further comprising a capacitor line,
wherein the light-transmitting film contains a semiconductor material, and
wherein the semiconductor device is configured so that a potential applied to the capacitor line is constantly lower than a potential to be supplied to the light-transmitting conductive film by a threshold voltage of the capacitor or more when the semiconductor device is used.

18. A display device comprising the semiconductor device according to claim 11 .

19. An electronic device comprising the semiconductor device according to claim 11 .

20. The semiconductor device according to claim 11 ,
wherein the first portion does not overlaps with the second portion.

21. The semiconductor device according to claim 11 ,
wherein the metal oxide semiconductor film and the light-transmitting film are formed from a same film.

22. A semiconductor device comprising:
a substrate;
a first ins

Assignees

• Semiconductor Energy Lab

Inventors

• Yamazaki Shunpei
• Katayama Masahiro
• Sato Ami
• Shima Yukinori

Classifications

• G02F1/1368

  in which the switching element is a three-electrode device {(G02F1/136277 takes precedence)} · CPC title

• G06F3/0412

  Digitisers structurally integrated in a display · CPC title

• G02F1/133345

  Insulating layers (G02F1/1335, G02F1/1337, G02F1/135, G02F1/136 take precedence) · CPC title

• G02F1/13338

  Input devices, e.g. touch panels · CPC title

• G02F2201/121

  common or background · CPC title